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Texas Instruments 74AVC20T245DGGRG4

Part No.:
74AVC20T245DGGRG4
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
Aetrix74AVC20T245DGGRG4.pdf
Description:
IC TRANSLATOR BIDIR 56TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,603

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Product details

Overview

74AVC20T245DGGRG4 from Texas Instruments is a 20-bit dual-supply noninverting bus transceiver enabling bidirectional voltage-level translation between 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V buses. It features independent VCCA and VCCB rails (1.2–3.6 V), Ioff partial-power-down support, VCC isolation, and 4.6-V tolerant I/Os. Used in FPGA-to-ASIC interconnect, memory subsystem bridging, and mixed-voltage SoC interfaces.

For engineers reviewing the 74AVC20T245DGGRG4 datasheet, 74AVC20T245DGGRG4 pinout, 74AVC20T245DGGRG4 application, or 74AVC20T245DGGRG4 equivalent, this page delivers verified electrical specs, directional control behavior, thermal performance (θJA = 64°C/W), ESD ratings (8 kV HBM), and real-world translation timing across 1.2–3.3 V combinations.

Technical Context

This device implements two independent 10-bit transceiver sections (1A↔1B and 2A↔2B), each with dedicated DIR and OE controls referenced to VCCA. Directional data flow is determined by logic level on DIR inputs, while OE enables/disables outputs into high-impedance state - critical for bus arbitration and hot-swap isolation.

VCC isolation ensures both ports enter high-Z when either VCCA or VCCB is at GND, preventing backdrive during power sequencing. Ioff protection limits current flow when either supply is powered down, meeting JESD78 Class II latch-up immunity (>100 mA) and supporting robust system-level power management.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Range VCCA and VCCB independently configurable from 1.2 V to 3.6 V - enables universal low-voltage translation across five logic families.
Max Data Rate 380 Mbps (1.8 V ↔ 3.3 V) - supports high-speed DDR memory interface bridging and FPGA I/O expansion.
I/O Voltage Tolerance 4.6 V - allows safe interfacing with legacy 3.3-V or 5-V systems without external level-shifting components.
Propagation Delay 2.9–6.5 ns (A↔B, VCCA = 3.3 V, VCCB = 3.3 V) - ensures sub-ns timing margin for 333 MHz bus operation.
ESD Protection 8 kV HBM, 200 V MM, 1 kV CDM - meets industrial-grade reliability requirements for board-level handling and field deployment.
Thermal Resistance θJA = 64°C/W (DGG package) - defines maximum power dissipation (≤156 mW at ΔT = 10°C) for stable operation in compact PCB layouts.
Power-Down Current Ioff ≤ ±1 µA (VI/VO = 0–3.6 V) - eliminates leakage-induced current paths during standby, critical for battery-powered subsystems.

Pinout & Package

TSSOP-56 (DGG) package, 12.0 mm × 6.2 mm × 1.2 mm, lead pitch 0.5 mm, RoHS-compliant NiPdAu finish, MSL Level-1.

Pin/Terminal Circuit Role Design Meaning
1DIR, 2DIR Direction control input Referenced to VCCA; determines A→B (DIR = H) or B→A (DIR = L) data flow per 10-bit section.
1OE, 2OE Output enable input Active-low; disables both A and B ports of respective section into high-impedance state for bus isolation.
1A1–1A10, 2A1–2A10 A-side data I/O Track VCCA supply; tolerate up to 4.6 V regardless of VCCA level - enables overvoltage-safe receive from higher-voltage domains.
1B1–1B10, 2B1–2B10 B-side data I/O Track VCCB supply; identical overvoltage tolerance - permits asymmetric translation (e.g., 1.2 V A → 3.3 V B).
VCCA, VCCB Independent power supplies Decoupled rails allow simultaneous operation at different voltages; no internal regulation - requires external bypassing per rail.
GND Ground reference Eight dedicated ground pins distributed across package to minimize ground bounce and ensure signal integrity at >300 Mbps.

Key Features

Feature Design Value
Dual-rail translation Full 1.2–3.6 V range per rail enables direct interface between LPDDR4 (1.1 V), ARM cores (1.2 V), and PCIe PHYs (3.3 V) without discrete translators.
VCC isolation Automatic high-Z on both ports if either VCCA or VCCB = GND - eliminates need for external power-good sequencing logic in multi-rail systems.
Ioff protection Prevents damaging current backflow when one supply is off - certified for partial-power-down compliance in ACPI S3/S4 states.
Overvoltage-tolerant I/O 4.6-V absolute max rating on all I/Os - supports legacy 3.3-V peripherals connected to 1.2-V processors without clamping diodes or resistors.
Low propagation skew tPLH/tPHL mismatch < 0.3 ns across 10-bit channels - preserves data eye integrity in parallel bus applications like camera sensor interfaces.

Applications

FPGA-to-ASIC Interconnect LPDDR Memory Subsystem Bridging

Use Scenario: Connecting a 1.2-V FPGA I/O bank to a 2.5-V ASIC control interface in a baseband processor module.

IC Role / Device Role / Timing Role: Bidirectional level translator managing command/address/data flow with sub-3-ns propagation delay and matched rise/fall times.

Use Value: Eliminates need for eight discrete single-bit translators; reduces BOM count, layout area, and signal skew across 20-line bus.

Use Scenario: Isolating LPDDR4 memory controller (1.1 V) from 1.8-V voltage-tracking termination network and 3.3-V PMIC telemetry bus.

IC Role / Device Role / Timing Role: Dual-section transceiver providing independent direction control per 10-bit lane group with VCC isolation during memory self-refresh.

Use Value: Enables dynamic power gating of memory subsystem while maintaining PMIC communication path - extends battery life in portable medical devices.

Industrial PLC Backplane Interface Automotive ADAS Sensor Hub

Use Scenario: Interfacing 3.3-V microcontroller UART/SSI peripherals with 1.5-V isolated CAN transceivers and 2.5-V analog front-end ADCs on modular I/O carrier.

IC Role / Device Role / Timing Role: Robust voltage translator with 8-kV HBM ESD rating and −40°C to 85°C operation, supporting hot-plug detection via OE-controlled isolation.

Use Value: Single-component solution replaces three separate level-shifter ICs; simplifies certification for IEC 61000-4-2 and reduces failure modes in harsh EMC environments.

Use Scenario: Aggregating data from multiple 1.8-V image sensors and 1.2-V radar preprocessors into a 3.3-V domain for fusion processing in autonomous driving ECUs.

IC Role / Device Role / Timing Role: High-speed bidirectional bridge with guaranteed 210 Mbps throughput at 1.2 V → 3.3 V translation and Ioff-enabled safe power-down during sleep mode.

Use Value: Maintains sensor data coherency across voltage domains while meeting ASIL-B functional safety requirements for fault-free isolation during reset sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional voltage-level translation applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74AVCH16T245DGGR 16-bit version, same DGG package, identical VCC range and I/O tolerance, but lacks second DIR/OE pair - single 16-bit channel vs. dual 10-bit. Suitable only for unified 16-bit buses; cannot support independent control of two 10-bit segments like 74AVC20T245DGGRG4. Select when bus width is exactly 16 bits and directional control granularity is not required per segment.
TXB0304RUTR 4-bit auto-direction sensing device; no DIR/OE pins; relies on bus activity to detect direction; max 3.6-V I/O tolerance but lower 100 Mbps data rate at 1.2 V. Eliminates control signal routing but introduces direction arbitration latency; unsuitable for synchronous protocols requiring deterministic timing. Select only for simple GPIO or I²C expansion where direction is infrequent and latency is non-critical.

Compared with SN74AVCH16T245DGGR and TXB0304RUTR, the 74AVC20T245DGGRG4 provides precise per-10-bit directional control, highest data rate (380 Mbps), and guaranteed deterministic timing - making it optimal for high-performance parallel bus translation where channel independence and speed are mandatory.

Availability

74AVC20T245DGGRG4 is available at Aetrix Electronics and suitable for FPGA interconnect, memory subsystem bridging, and industrial PLC backplane designs requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 74AVC20T245DGGRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with over 50 years of innovation in high-reliability interface ICs.

The AVC family targets low-voltage, high-speed digital interface applications, designed specifically to solve mixed-voltage interoperability challenges in portable, industrial, and automotive electronics with minimal power and board space overhead.

FAQ

What is the maximum supported data rate for 74AVC20T245DGGRG4 when translating between 1.8 V and 3.3 V?

The 74AVC20T245DGGRG4 supports up to 380 Mbps in 1.8-V to 3.3-V translation mode, as specified in the SCES566F datasheet under "Max Data Rates." This performance is achieved with matched load capacitance (≤15 pF) and proper VCCA/VCCB decoupling, making it suitable for high-speed parallel interfaces such as memory address/data buses and FPGA I/O expansion.

Does 74AVC20T245DGGRG4 require external pull-up or pull-down resistors on DIR and OE pins?

No external resistors are required on DIR or OE pins of the 74AVC20T245DGGRG4 when driven actively by CMOS logic referenced to VCCA. However, TI recommends tying OE to VCCA through a pull-up resistor during power-up/down to guarantee high-impedance state - minimum value depends on driver sink capability, typically 10 kΩ for standard CMOS drivers.

Can 74AVC20T245DGGRG4 operate with VCCA = 1.2 V and VCCB = 3.3 V simultaneously?

Yes, the 74AVC20T245DGGRG4 is fully specified for simultaneous operation with VCCA = 1.2 V and VCCB = 3.3 V. Its overvoltage-tolerant I/Os (rated to 4.6 V) and independent rail design ensure reliable translation in this configuration, delivering 100 Mbps throughput per the datasheet's "Max Data Rates" table.

What is the thermal resistance θJA of the 74AVC20T245DGGRG4 in its TSSOP-56 package?

The 74AVC20T245DGGRG4 in the DGG (TSSOP-56) package has a junction-to-ambient thermal resistance (θJA) of 64°C/W, as documented in the SCES566F absolute maximum ratings table. This value assumes standard JEDEC 2-layer board conditions and guides thermal design for continuous operation up to 85°C ambient.

How does the VCC isolation feature function in 74AVC20T245DGGRG4 during power sequencing?

The VCC isolation feature in the 74AVC20T245DGGRG4 forces both A and B ports into high-impedance state whenever either VCCA or VCCB is at GND - even if the other rail is powered. This prevents back-driving, latch-up, or uncontrolled current flow during asymmetric power-up/down sequences common in multi-rail systems like SoC + PMIC architectures.

74AVC20T245DGGRG4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74AVC
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Logic Type:
Translation Transceiver
Number of Elements:
2
Number of Bits per Element:
10
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
12mA, 12mA
Voltage - Supply:
1.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

74AVC20T245DGGRG4 FAQ

1.How can I place an order for 74AVC20T245DGGRG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74AVC20T245DGGRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 74AVC20T245DGGRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AVC20T245DGGRG4 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74AVC20T245DGGRG4?

For technical support, including 74AVC20T245DGGRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AVC20T245DGGRG4 requirements.

6.How does Aetrix verify that 74AVC20T245DGGRG4 is sourced from the original manufacturer or authorized distributors?

All 74AVC20T245DGGRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AVC20T245DGGRG4 meets industry standards.

7.What is the process for return or replacement of 74AVC20T245DGGRG4?

All 74AVC20T245DGGRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74AVC20T245DGGRG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74AVC20T245DGGRG4 part is unused and in its original packaging.

Return procedure for 74AVC20T245DGGRG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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