Nexperia USA Inc. 74AVC2T245GUX

Overview

74AVC2T245GUX from Nexperia is a 2-bit dual-supply translating transceiver enabling bidirectional level translation between independent voltage domains (0.8 V to 3.6 V). It supports two 1-bit or one 2-bit configuration, features separate DIRn and OE controls per channel, and delivers up to 380 Mbit/s data rate for ≥1.8 V ↔ 3.3 V translation. Used in mixed-voltage SoC interconnects, FPGA I/O bridging, and DDR memory subsystems.

For engineers reviewing the 74AVC2T245GUX datasheet, 74AVC2T245GUX pinout, 74AVC2T245GUX application, or 74AVC2T245GUX equivalent, key selection criteria include dual-rail IOFF-enabled partial power-down, suspend-mode isolation when either VCC is grounded, JEDEC-compliant voltage translation across six standard logic families, and XQFN10 package thermal performance at +125 °C ambient.

Technical Context

This transceiver implements independent A- and B-side I/O buffers referenced to VCC(A) and VCC(B), respectively, with direction control (DIR1/DIR2) and output enable (OE) inputs tied to VCC(A). Its IOFF circuitry actively disables outputs during power-down, blocking backflow current when either supply drops to GND - critical for hot-swap and low-power suspend states.

Propagation delay is asymmetric: An→Bn paths are optimized for lower latency (e.g., 6.6 ns typical at 2.5 V/2.5 V), while Bn→An paths exhibit higher delay (14.0 ns typical), reflecting internal buffer staging. Dynamic power dissipation capacitance ranges from 0.2 pF (idle) to 14 pF (active Bn→An), directly impacting high-speed switching losses.

Key Specifications

Pinout & Package

XQFN10 (SOT1160-1) package: 1.40 × 1.80 × 0.50 mm body, no leads, exposed thermal pad, 10 terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVC2T245RSWR and 74LVC2T45GT,115, the 74AVC2T245GUX provides superior thermal rating (+125 °C), guaranteed IOFF behavior, and faster An→Bn propagation - making it optimal for thermally constrained, hot-swap-capable embedded systems requiring robust domain isolation.

Availability

74AVC2T245GUX is available at Aetrix Electronics and suitable for PCIe add-in card design, FPGA I/O bridging, DDR3 subsystem isolation, and automotive ADAS sensor hub interfaces requiring stable component supply across extended temperature and mixed-voltage environments.

Supply support for 74AVC2T245GUX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions - serving automotive, industrial, and consumer markets with scalable manufacturing and rigorous quality systems.

The 74AVC logic family targets ultra-low-voltage, high-speed digital interfacing in space-constrained applications - designed specifically for seamless voltage translation between next-generation SoCs, FPGAs, and memory subsystems operating below 3.3 V.

FAQ

What is the maximum allowable voltage difference between VCC(A) and VCC(B)?

The device permits any combination within its 0.8 V–3.6 V range per rail, including ΔVCC = 2.8 V (e.g., VCC(A) = 0.8 V, VCC(B) = 3.6 V). Absolute maximum ratings allow −0.5 V to +4.6 V per supply, but functional operation requires both supplies to be within 0.8 V–3.6 V and referenced to the same GND.

Can DIR1 and DIR2 be tied together, and what is the impact on timing?

Yes, DIR1 and DIR2 may be connected to a single control line. This synchronizes direction for both bits but does not alter propagation delay - each channel retains its independent timing characteristics (e.g., An→Bn remains 6.6 ns, Bn→An remains 14.0 ns), preserving timing predictability in parallel bus applications.

How does the IOFF feature behave when only VCC(A) is powered?

When VCC(A) = 0 V and VCC(B) = 3.3 V, IOFF forces A1/A2 into high-impedance and limits leakage to ±1 μA. B1/B2 remain functional if OE is active, but A-side inputs are disabled - enabling safe "A-side off, B-side on" operation without bus contention or backfeed.

Is the XQFN10 package compatible with standard reflow profiles for lead-free assembly?

Yes, the SOT1160-1 (XQFN10) package is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 1 and supports peak reflow temperatures up to 260 °C. Its 0.50 mm profile and exposed thermal pad require controlled solder paste volume (0.12 mm stencil) to ensure void-free thermal interface and coplanarity.