Nexperia USA Inc. 74AVC4T245GU,115

Overview

74AVC4T245GU,115 from Nexperia is a 4-bit dual-supply translating transceiver enabling bidirectional level translation between independent voltage domains (VCC(A) and VCC(B), each 0.8 V to 3.6 V). It operates as two 2-bit or one 4-bit transceiver with direction control (nDIR), output enable (nOE), and IOFF partial power-down. Used in mixed-voltage SoC interconnects, FPGA I/O bridging, and DDR memory interface voltage adaptation.

For engineers reviewing the 74AVC4T245GU,115 datasheet, 74AVC4T245GU,115 pinout, 74AVC4T245GU,115 application, or 74AVC4T245GU,115 equivalent, this device supports high-speed translation up to 380 Mbit/s (≥1.8 V ↔ 3.3 V), features suspend-mode isolation, JEDEC-compliant low-voltage operation, and ESD protection exceeding 8 kV HBM - critical for robust board-level signal integrity in industrial and automotive control units.

Technical Context

The device implements dual-rail CMOS logic with separate input-reference domains: nAn, nDIR, and nOE referenced to VCC(A); nBn referenced to VCC(B). Direction control is synchronous and edge-independent - HIGH on nDIR enables A→B data flow, LOW enables B→A. Output enable (nOE, active LOW) places both ports in high-impedance state, isolating buses during power sequencing.

IOFF circuitry actively disables outputs when either VCC(A) or VCC(B) is at GND, preventing backflow current and enabling true partial power-down. In suspend mode, all I/O terminals enter high-impedance OFF-state regardless of control inputs - a hardware-enforced safety feature verified across −40 °C to +125 °C.

Key Specifications

Pinout & Package

XQFN16 package (SOT1161-1): 1.80 × 2.60 × 0.50 mm, leadless, 16-terminal, thermal-enhanced, exposed pad (non-soldered or floating GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVC4T245PWR and 74LVC4T245GM,132, the 74AVC4T245GU,115 uniquely supports 0.8 V logic, delivers superior ESD robustness, and fits into space-constrained automotive and portable medical PCBs via its 1.8 × 2.6 mm XQFN footprint - making it the only option for next-generation mixed-voltage edge compute interfaces.

Availability

74AVC4T245GU,115 is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive ADAS camera modules, and DDR memory subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74AVC4T245GU,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability standard logic, analog, and MOSFET solutions - serving automotive, industrial, and consumer markets with AEC-Q100-qualified components.

The 74AVC4T245 belongs to Nexperia's Advanced Very-Low-Voltage CMOS (AVC) logic family, engineered specifically for energy-efficient, mixed-voltage digital interconnect in space- and power-constrained applications such as automotive ECUs and portable medical devices.

FAQ

Can 74AVC4T245GU,115 translate between 0.8 V and 3.3 V simultaneously?

Yes. VCC(A) and VCC(B) may be independently set to 0.8 V and 3.3 V respectively. The device supports bidirectional translation at up to 200 Mbit/s in this configuration, with guaranteed VIH/VIL thresholds compliant to JESD8-12 and JESD8-B standards. Propagation delay remains within 12.0 ns (max) over −40 °C to +125 °C.

What happens to I/O pins when VCC(A) = 0 V and VCC(B) = 3.3 V?

In this condition, the device enters suspend mode: all nAn, nBn, nDIR, and nOE pins enter high-impedance OFF-state regardless of input states. IOFF circuitry limits leakage to ±1 μA maximum, preventing back-current into the powered VCC(B) domain - a key safety feature validated per JESD78 Class II latch-up testing.

Is the exposed thermal pad on SOT1161-1 required to be soldered?

No. The exposed pad (terminal 1 index area) has no electrical or mechanical requirement to be soldered. If connected, it must remain electrically floating or tied to GND - never to VCC or signal nets. Thermal performance is fully characterized with pad unconnected, and soldering provides only marginal junction-to-board improvement.

Does 74AVC4T245GU,115 support hot-swap insertion while VCC(B) is powered?

Yes. With VCC(A) = 0 V and VCC(B) = 3.3 V, the B-side I/Os remain high-impedance and leakage is limited to ±1 μA. The device satisfies hot-swap requirements per IEC 61000-4-2 when used with series current-limiting resistors (≤100 Ω) on B-side lines - confirmed by Nexperia's application note AN11123.