Nexperia USA Inc. 74AVC4T245GUZ

Overview

74AVC4T245GUZ from Nexperia is a 4-bit dual-supply translating transceiver enabling bidirectional level translation between independent voltage domains (VCC(A) and VCC(B), each 0.8 V–3.6 V). It supports two 2-bit or one 4-bit configuration, features direction control (nDIR), output enable (nOE), IOFF partial power-down, and operates from –40 °C to +125 °C. Used in mixed-voltage SoC interconnects, FPGA I/O bridging, and memory subsystem voltage translation.

For engineers reviewing the 74AVC4T245GUZ datasheet, 74AVC4T245GUZ pinout, 74AVC4T245GUZ application, or 74AVC4T245GUZ equivalent, key selection criteria include configurable bidirectional translation, 380 Mbit/s max data rate (≥1.8 V ↔ 3.3 V), IOFF-enabled suspend mode, JEDEC-compliant low-voltage operation, and XQFN16 package thermal performance.

Technical Context

The device implements two independent 2-bit transceiver channels, each with separate A-side (nAn, nDIR, nOE referenced to VCC(A)) and B-side (nBn referenced to VCC(B)) I/O banks. Direction control is synchronous and edge-agnostic: HIGH on nDIR enables A→B flow; LOW enables B→A flow.

IOFF circuitry actively disables outputs and blocks backflow current when either VCC(A) or VCC(B) is at GND, enforcing high-impedance isolation in suspend mode. Input tolerance up to 3.6 V on all pins allows safe interfacing with higher-voltage logic even when powered down.

Key Specifications

Pinout & Package

XQFN16 package (SOT1161-1) with 16 terminals, 0.4 mm pitch, body size 1.80 × 2.60 × 0.50 mm, and thermal pad (non-soldered or floating/grounded per design).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVC4T245PWR and 74LVC4T245GM,115, the 74AVC4T245GUZ delivers superior thermal performance in ultra-compact layouts, full bidirectional configurability, and guaranteed operation across the widest voltage combination range - making it the preferred choice for next-generation embedded interconnects.

Availability

74AVC4T245GUZ is available at Aetrix Electronics and suitable for automotive ADAS sensor hubs, industrial PLC I/O modules, and portable DDR memory subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74AVC4T245GUZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable components for automotive, industrial, and consumer electronics, with leadership in logic, power, and analog devices.

The 74AVC4T245 belongs to Nexperia's advanced voltage-translating logic family, engineered specifically for robust, low-power bidirectional interfacing between heterogeneous voltage domains in space- and power-constrained embedded systems.

FAQ

What is the minimum recommended load capacitance for achieving 380 Mbit/s operation?

The 380 Mbit/s maximum data rate is specified under test conditions with CL = 15 pF, RL = 2 kΩ, and Δt/Δv ≤ 1 ns/V. For reliable operation at this rate, keep total capacitive loading-including PCB trace, connector, and receiver input-below 15 pF. Exceeding this increases propagation delay and jitter, potentially violating setup/hold windows in high-speed interfaces like SPI or parallel memory buses.

Can VCC(A) and VCC(B) be powered from different regulators with independent sequencing?

Yes - the device supports independent power sequencing. When VCC(A) ramps before VCC(B), the A-side inputs (nA1–nA4, nDIR, nOE) remain functional while B-side outputs stay high-impedance until VCC(B) stabilizes. IOFF ensures no back-current flows if VCC(B) remains unpowered, satisfying IEC 61000-4-2 and automotive power-sequence robustness requirements.

Is the thermal pad on the XQFN16 package electrically connected internally?

No - the exposed thermal pad (terminal 1 index area) has no internal electrical connection. Per Nexperia SOT1161-1 specification, it may be left floating or connected to GND based on thermal and EMI requirements. If soldered, avoid connecting it to any voltage rail other than GND to prevent unintended coupling or latch-up risk.

How does suspend mode behave when only VCC(A) is at GND and VCC(B) is active?

In this condition, all A-side pins (nA1–nA4, nDIR, nOE) enter high-impedance OFF-state, while B-side pins (nB1–nB4) also go high-Z regardless of VCC(B) voltage. The IOFF circuit actively blocks current flow into A-side inputs, limiting leakage to ±1 μA. This behavior isolates the A-side bus completely, preventing corruption of the powered B-side domain.