Nexperia USA Inc. 74AVC4T774BQX

Overview

74AVC4T774BQ from Nexperia is a 4-bit dual-supply bidirectional level-translating transceiver with independent 0.8 V to 3.6 V supplies on A and B sides, eight I/O ports (A1–A4, B1–B4), four direction controls (DIR1–DIR4), and active-low output enable (OE). It enables voltage translation between mismatched logic domains such as 1.2 V MCU I/O and 3.3 V peripheral buses in portable SSD controllers and multi-rail FPGA interfaces.

For engineers reviewing the 74AVC4T774BQ datasheet, 74AVC4T774BQ pinout, 74AVC4T774BQ application, or 74AVC4T774BQ equivalent, key selection criteria include per-channel direction control granularity, IOFF-enabled partial power-down isolation, suspend-mode high-impedance behavior when either supply drops to GND, and JEDEC-compliant operation across six low-voltage standards (JESD8-12 through JESD8-B).

Technical Context

The device implements four independent 1-bit bidirectional channels, each with dedicated DIRn input controlling signal flow direction (An ↔ Bn) and OE enabling/disabling all outputs simultaneously. Each port's input threshold scales with its local supply (VIH = 0.65×VCC, VIL = 0.35×VCC for 1.1–1.95 V operation), ensuring robust noise margins across mixed-voltage systems.

IOFF circuitry actively disables outputs and blocks backflow current during power-down of either VCC(A) or VCC(B), while suspend mode forces all An and Bn pins into high-impedance states when either supply reaches GND-critical for hot-swap and battery-backed subsystems requiring rail independence.

Key Specifications

Pinout & Package

DHVQFN16 package (SOT763-1), 2.5 × 3.5 × 0.85 mm body, thermal-enhanced no-lead quad flat design with exposed die pad (non-soldered or floating/grounded per layout).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with SN74AVC4T245RTER and TXB0104PWR, the 74AVC4T774BQ provides granular per-channel direction control and lower propagation delay variability-critical for time-critical mixed-voltage parallel interfaces where direction must be asserted before data launch.

Availability

74AVC4T774BQ is available at Aetrix Electronics and suitable for PCIe SSD controller interfaces, FPGA I/O bridging, automotive ADAS camera links, and multi-rail IoT sensor hubs requiring stable component supply across extended temperature and mixed-voltage conditions.

Supply support for 74AVC4T774BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a leading semiconductor manufacturer specializing in high-performance logic, analog, and discrete components, with core expertise in advanced logic families optimized for low-power, high-speed, and automotive-grade reliability.

The 74AVC series targets ultra-low-voltage, high-speed interface translation in space-constrained and thermally demanding applications-designed specifically for seamless interoperability between next-generation sub-1.5 V logic and legacy 3.3 V infrastructure.

FAQ

Can 74AVC4T774BQ translate between 0.8 V and 3.6 V simultaneously?

Yes. VCC(A) and VCC(B) operate independently within 0.8 V to 3.6 V, enabling direct translation between those rails-for example, 0.8 V microcontroller I/O to 3.6 V display interface. Input tolerance up to 3.6 V on both sides ensures safe operation even when one supply is at minimum.

What happens to I/O pins when VCC(A) = 0 V and VCC(B) = 3.3 V?

In this suspend condition, all A1–A4 and B1–B4 pins enter high-impedance OFF-state per JEDEC JESD78 Class II latch-up immunity. The IOFF circuit blocks back-current, limiting leakage to ±1 μA-preventing corruption of the powered 3.3 V domain.

Is the thermal pad on SOT763-1 required to be soldered?

No. Per datasheet note, the exposed pad has no electrical or mechanical requirement to be soldered. If connected, it must remain floating or tied to GND-never to VCC or signal nets-to avoid parasitic coupling and thermal stress.

How does DIRn control differ from OE functionality?

DIRn sets signal direction per channel (An→Bn or Bn→An), while OE globally disables all outputs to high-Z. DIRn can be changed dynamically during operation; OE overrides direction state-when HIGH, all I/O go high-Z regardless of DIRn or data values.