Nexperia USA Inc. 74AVC4T774GUZ

Overview

74AVC4T774GUZ from Nexperia is a 4-bit dual-supply translating transceiver enabling bidirectional level translation between independent voltage domains (VCC(A) and VCC(B), each 0.8 V to 3.6 V). It features eight I/O ports (A1–A4, B1–B4), four direction controls (DIR1–DIR4), active-low output enable (OE), and IOFF partial power-down protection. Used in mixed-voltage SoC interconnects, such as FPGA-to-ASIC data buses operating at 1.2 V/1.8 V or 1.8 V/3.3 V.

For engineers reviewing the 74AVC4T774GUZ datasheet, 74AVC4T774GUZ pinout, 74AVC4T774GUZ application, or 74AVC4T774GUZ equivalent, this page delivers verified electrical parameters, thermal-enhanced XQFN16 package details, suspend-mode behavior, JEDEC-compliant voltage translation ranges, and real-world timing performance across -40 °C to +125 °C.

Technical Context

The device implements four independent 1-bit bidirectional channels, each with separate DIRn control and shared OE. Direction logic is asynchronous: DIRn = HIGH enables An→Bn flow; DIRn = LOW enables Bn→An flow. Both A-side and B-side I/Os are referenced to their respective supplies-no internal level-shifting circuitry beyond passive CMOS topology.

IOFF circuitry actively disables outputs during partial power-down (e.g., VCC(A) = 0 V, VCC(B) = 3.3 V), limiting backflow current to ±1 μA. Suspend mode activates when either supply drops to GND, forcing all An and Bn pins into high-impedance OFF-state regardless of DIRn or OE state.

Key Specifications

Pinout & Package

XQFN16 package (SOT1161-1): plastic, extremely thin quad flat, no leads, 16 terminals, body size 1.80 × 2.60 × 0.50 mm. Exposed thermal pad (pin 8) must remain floating or connected to GND per datasheet guidance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVC4T245RTER and TXS0104EJR, the 74AVC4T774GUZ uniquely supports per-lane direction control and achieves the lowest propagation delay (down to 0.2 ns) in high-VCC configurations-making it optimal for mixed-protocol, timing-sensitive interconnects where channel independence and speed are mandatory.

Availability

74AVC4T774GUZ is available at Aetrix Electronics and suitable for PCIe add-in card design, FPGA-memory subsystem integration, automotive ADAS sensor aggregation, and industrial PLC fieldbus interfacing requiring stable component supply across extended temperature and mixed-voltage environments.

Supply support for 74AVC4T774GUZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a leading semiconductor manufacturer specializing in high-performance, reliable standard logic, analog, and MOSFET solutions for automotive, industrial, and consumer markets.

The 74AVC4T774GUZ belongs to Nexperia's AVC advanced very low voltage logic family, engineered specifically for ultra-low-voltage bidirectional translation in space-constrained, thermally demanding applications such as portable electronics and automotive ECUs.

FAQ

What is the minimum recommended load capacitance for achieving 380 Mbit/s data rate?

The 380 Mbit/s maximum data rate is specified under test conditions with CL = 15 pF, RL = 2 kΩ, and Δt/ΔV ≤ 1.0 ns/V. For PCB layouts targeting this speed, keep trace capacitance below 5 pF per line and use controlled-impedance routing (50 Ω) to avoid signal integrity degradation. Higher loads reduce effective bandwidth due to increased tpd and jitter.

Can VCC(A) and VCC(B) be powered from the same supply rail?

Yes-VCC(A) and VCC(B) may be tied together to a common voltage (e.g., 1.8 V) without functional impact. The device remains fully operational as a standard 4-bit transceiver with 3-state outputs. However, doing so forfeits the core benefit of independent domain translation and increases total supply current versus using separate optimized rails.

How does suspend mode behave when only VCC(A) is at GND and VCC(B) is active?

When VCC(A) = 0 V and VCC(B) = 1.8 V–3.3 V, the device enters suspend mode: all A1–A4 and B1–B4 pins go high-impedance regardless of DIRn or OE states. Input leakage on B-side remains ≤±5 μA, and no current flows from Bn into An. This behavior is guaranteed across -40 °C to +125 °C per Table 4 and Section 7.

Is the exposed thermal pad (pin 8) required to be soldered and grounded?

No-the thermal pad (pin 8) has no electrical function and requires no solder connection. If soldered, it must remain electrically floating or be connected to GND; connecting it to any other net violates the absolute maximum ratings and risks latch-up. Thermal performance is adequate without soldering, as confirmed in the SOT1161-1 package thermal characterization.