Nexperia USA Inc. 74AVC4TD245GU,115

Overview

74AVC4TD245GU,115 from Nexperia is a 4-bit dual-supply translating transceiver enabling bidirectional level translation between independent voltage domains (VCC(A) and VCC(B), each 0.8 V–3.6 V). It features eight I/O ports (A1–A4, B1–B4), four independent direction controls (DIR1–DIR4), active-low output enable (OE), and IOFF partial power-down protection. Used in mixed-voltage SoC interconnects, FPGA-to-ASIC bridges, and DDR memory interface voltage adaptation.

For engineers reviewing the 74AVC4TD245GU,115 datasheet, 74AVC4TD245GU,115 pinout, 74AVC4TD245GU,115 application, or 74AVC4TD245GU,115 equivalent, key selection criteria include per-bit directional control granularity, suspend-mode isolation at 0 V supply, JEDEC-compliant low-voltage operation down to 0.8 V, and guaranteed 380 Mbit/s data rate for ≥1.8 V ↔ 3.3 V translation.

Technical Context

This device implements four independent 1-bit bidirectional transceivers, each with dedicated DIRn input controlling signal flow direction (An↔Bn). The A-side pins (An, DIRn, OE) are referenced to VCC(A); B-side pins (Bn) to VCC(B), enabling true asymmetric voltage translation without external biasing.

IOFF circuitry actively disables outputs and blocks backflow current when either VCC(A) or VCC(B) is at GND, enforcing high-impedance OFF-state in suspend mode. Propagation delays are asymmetric: An→Bn is faster than Bn→An under identical supply conditions, with typical tpd as low as 0.2 ns (VCC(A)=VCC(B)=3.3 V, CL=0 pF).

Key Specifications

Pinout & Package

XQFN16 package (SOT1161-1): 1.80 × 2.60 × 0.50 mm body, no leads, 16-terminal thermal-enhanced quad flat layout with exposed thermal pad (non-soldered or floating).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVC4T245PWR and 74LVC4T245GW,125, the 74AVC4TD245GU,115 uniquely delivers per-bit direction control in a 1.8 × 2.6 mm XQFN package with 0.8 V compatibility - essential for heterogeneous voltage domain partitioning in modern embedded systems.

Availability

74AVC4TD245GU,115 is available at Aetrix Electronics and suitable for PCIe retimer interfaces, FPGA-to-microcontroller bridges, DDR3 memory subsystems, and automotive ADAS sensor hubs requiring stable component supply across extended temperature ranges.

Supply support for 74AVC4TD245GU,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable components including logic, discretes, MOSFETs, and ESD protection devices, serving automotive, industrial, and consumer markets.

The 74AVC logic family targets ultra-low-voltage, high-speed digital interfacing in space-constrained and power-sensitive applications - designed specifically for mixed-rail SoC and FPGA interconnects.

FAQ

Can 74AVC4TD245GU,115 translate between 0.8 V and 3.3 V simultaneously?

Yes. VCC(A) can be set to 0.8 V (for A-port logic) and VCC(B) to 3.3 V (for B-port logic), enabling direct bidirectional translation. Input thresholds scale with respective supplies, and outputs drive to full rail - confirmed by JEDEC JESD8-12 and JESD8-B compliance.

What happens to the I/O ports when VCC(A) = 0 V and VCC(B) = 3.3 V?

In this suspend condition, both A and B ports enter high-impedance OFF-state per the IOFF circuitry. No backflow current occurs, and the B-side bus remains isolated - verified by static characteristics tables showing IOZ ≤ ±5 μA at −40 °C to +125 °C.

Is the thermal pad on the XQFN16 package required to be soldered?

No. Per datasheet note (SOT1161-1), the exposed thermal pad has no electrical or mechanical requirement to be soldered. If connected, it must remain electrically floating or tied to GND - no thermal performance dependency on soldering is specified.

How does per-bit DIR control improve system design versus single-DIR transceivers?

It enables concurrent bidirectional data flow on the same bus (e.g., A1→B1 for command while B2→A2 for status), eliminating protocol overhead from direction toggling. This reduces latency in handshaking protocols and avoids bus turnaround dead time - directly supported by the four independent DIR1–DIR4 inputs.