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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Nexperia USA Inc. 74AVC8T245BZX

Name: 74AVC8T245BZX
Brand: Nexperia USA Inc.
SKU: 74AVC8T245BZX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74AVC8T245BZX

Manufacturer:: Nexperia USA Inc.

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 24-XFQFN Exposed Pad

Datasheet:: 74AVC8T245BZX.pdf

Description:: IC TRANSLATOR BIDIR 24DHXQFN

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Product details

Overview

74AVC8T245BZX from Nexperia is an 8-bit dual-supply bidirectional voltage-level translating transceiver with 3-state outputs, supporting independent VCC(A) and VCC(B) supplies from 0.8 V to 3.6 V. It enables translation between 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic domains, features DIR/OE control, IOFF partial power-down, and operates across –40 °C to +125 °C for industrial bus interfacing.

For engineers reviewing the 74AVC8T245BZX datasheet, 74AVC8T245BZX pinout, 74AVC8T245BZX application, or 74AVC8T245BZX equivalent, key selection criteria include configurable direction control, suspend-mode isolation, JEDEC-compliant voltage translation ranges, and DHXQFN24 package thermal performance in space-constrained embedded systems.

Technical Context

The device implements a dual-rail CMOS transceiver architecture with separate input-referenced domains: An, DIR, and OE pins are referenced to VCC(A), while Bn pins are referenced to VCC(B). Directional data flow (An→Bn or Bn→An) is controlled by the DIR signal, and 3-state output enable/disable is managed via active-low OE.

IOFF circuitry ensures leakage current remains ≤±5 μA when either VCC(A) or VCC(B) is at GND, enabling safe partial power-down in mixed-voltage systems. Suspend mode forces all I/Os into high-impedance OFF-state regardless of DIR/OE state, satisfying JEDEC JESD78 Class II latch-up immunity (>100 mA).

Key Specifications

Parameter	Value and Actual Design Meaning
VCC(A) Range	0.8 V to 3.6 V - supports interface to core logic rails including 0.8 V ASIC I/O and 3.3 V legacy peripherals
VCC(B) Range	0.8 V to 3.6 V - enables independent biasing for heterogeneous bus domains (e.g., 1.2 V SoC ↔ 2.5 V FPGA)
Max Data Rate	380 Mbit/s - achievable for ≥1.8 V ↔ 3.3 V translation, enabling high-speed interconnect in DDR memory buffers and PCIe sideband lines
Propagation Delay	2.7 ns (min, An→Bn, VCC(A)=3.3 V/VCC(B)=3.3 V) - ensures sub-ns timing margin for 300+ MHz clock domains
IOFF Leakage	≤±5 μA at –40 °C to +125 °C - guarantees bus isolation during hot-swap or power sequencing without backfeed risk
ESD Protection	HBM >8 kV, CDM >1 kV - meets IEC 61000-4-2 Level 4 for robustness in industrial control panel interfaces
Operating Temp	–40 °C to +125 °C - qualified for under-hood automotive ECUs and base station RF module control buses

Pinout & Package

DHXQFN24 package (SOT8024-1), 2 mm × 4 mm × 0.48 mm body, 0.4 mm pitch, leadless, thermal-enhanced, with exposed die pad (non-soldered or floating/grounded per layout).

Pin/Terminal	Circuit Role	Design Meaning
1, 12, 13, 24	GND	Ground reference for both supply domains; all four pins must be connected to PCB ground plane for EMI suppression and thermal dissipation
2	DIR	Direction control input referenced to VCC(A); HIGH = An→Bn, LOW = Bn→An - critical for dynamic bus arbitration in multi-master systems
3–10	A1–A8	Port A bidirectional I/Os referenced to VCC(A); tolerate up to 3.6 V inputs regardless of VCC(A) level - enables safe interfacing with overvoltage-tolerant controllers
14–21	B1–B8	Port B bidirectional I/Os referenced to VCC(B); fully compliant with JEDEC standards JESD8-12 through JESD8-B - ensures interoperability across voltage tiers
22	OE	Active-low output enable; asserts 3-state on both ports simultaneously - used for bus contention avoidance during firmware updates or diagnostics
23, 24	VCC(B)	Port B supply rail; powers B-side input receivers and output drivers - decoupling capacitor required within 1 mm of pin for <100 ps edge integrity
11	VCC(A)	Port A supply rail; powers A-side input receivers, DIR/OE logic, and output drivers - shared with control logic simplifies power tree design

Key Features

Feature	Design Value
Configurable Voltage Translation	Independent 0.8 V–3.6 V rails on both sides allow arbitrary low-voltage domain bridging without external level shifters
IOFF Partial Power-Down	Prevents damaging backflow current when one supply is off - essential for hot-pluggable modules and battery-backed subsystems
Suspend Mode	Automatic high-impedance state on all I/Os when either VCC(A) or VCC(B) = GND - eliminates need for external isolation logic
JEDEC Compliance	Fully certified to JESD8-12 (0.8–1.3 V), JESD8-11 (0.9–1.65 V), JESD8-7 (1.2–1.95 V), JESD8-5 (1.8–2.7 V), JESD8-B (2.7–3.6 V)
High-Speed Timing	Sub-3 ns propagation delay (An→Bn) at 3.3 V/3.3 V enables use in 300+ MHz synchronous buses like MIPI RFFE and USB 2.0 ULPI

Applications

Industrial PLC Backplane Interface

Automotive ADAS Sensor Hub

Use Scenario: Interfacing a 1.2 V microcontroller to legacy 2.5 V I/O expansion modules in programmable logic controllers.

IC Role / Device Role / Timing Role: Bidirectional level translator managing address/data bus handshaking with DIR-controlled direction and OE-gated arbitration.

Use Value: Eliminates discrete resistor-based translators, reduces BOM count by 8×, and maintains <3 ns skew across all 8 data lines for deterministic scan-cycle timing.

Use Scenario: Connecting a 1.8 V radar processor to 3.3 V camera sensor interface in autonomous driving domain controllers.

IC Role / Device Role / Timing Role: Voltage-translating transceiver enabling synchronized parallel video data transfer with precise DIR-driven frame boundary alignment.

Use Value: Supports 380 Mbit/s throughput at 1.8 V ↔ 3.3 V, meeting MIPI CSI-2 D-PHY timing budgets without added jitter or setup/hold violations.

Server Memory Subsystem

Medical Imaging FPGA Interface

Use Scenario: Bridging 0.8 V DDR5 memory controller I/O to 1.1 V DIMM SPD EEPROM and temperature sensors.

IC Role / Device Role / Timing Role: Dual-rail transceiver handling SMBus-compatible control signals with IOFF-enabled safe power sequencing during memory hot-add.

Use Value: IOFF leakage ≤±5 μA prevents corruption of SPD data during VDDSPD ramp-up, ensuring reliable JEDEC SPD initialization sequence compliance.

Use Scenario: Linking a 1.5 V medical-grade FPGA to 2.5 V analog front-end ADCs and DACs in portable ultrasound beamformers.

IC Role / Device Role / Timing Role: Low-skew, 8-bit parallel translator synchronizing real-time echo sampling clocks and control words across voltage domains.

Use Value: Propagation delay variation <0.3 ns across all 8 channels preserves time-of-flight measurement accuracy to ±10 ps in beamforming algorithms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional voltage translation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74AVC8T245RHLR	VQFN-24 package (3.5 × 5.5 × 0.85 mm); higher thermal resistance (θJA = 52 °C/W vs. 42 °C/W); max 300 Mbit/s at 1.8 V ↔ 3.3 V	Preferred for cost-sensitive industrial boards where board area > thermal priority; lacks DHXQFN's extreme thinness for stacked-module designs	Select when footprint tolerance allows larger package and thermal budget permits 10 °C higher junction rise at full load
TXB0108PWR	Auto-direction sensing (no DIR pin); lower max speed (100 Mbit/s); IOFF not supported; only rated to +85 °C	Suitable for simple peripheral expansion (e.g., GPIO extenders) but unsuitable for synchronous high-speed buses or automotive under-hood use	Choose only for non-critical, low-frequency, single-direction-dominant interfaces where DIR control complexity must be eliminated

Compared with SN74AVC8T245RHLR and TXB0108PWR, the 74AVC8T245BZX delivers superior thermal performance in ultra-thin form factor, guaranteed 380 Mbit/s operation, and full –40 °C to +125 °C qualification - making it the sole option for space-constrained, high-reliability, high-speed mixed-voltage interconnects.

Availability

74AVC8T245BZX is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive ADAS sensor hubs, server memory subsystems, and medical imaging FPGA interfaces requiring stable component supply across extended temperature and voltage ranges.

Supply support for 74AVC8T245BZX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, high-reliability logic, discrete, and MOSFET solutions optimized for efficiency, miniaturization, and robustness in demanding applications.

The 74AVC logic family targets low-voltage, high-speed digital interfacing in space- and power-constrained systems, with design emphasis on JEDEC-compliant voltage translation, ultra-low static/dynamic power, and industrial-temperature reliability.

FAQ

What is the maximum allowable voltage difference between VCC(A) and VCC(B)?

The datasheet specifies no absolute limit on differential voltage between VCC(A) and VCC(B), provided each remains within its 0.8 V to 3.6 V operating range and neither exceeds the absolute maximum rating of –0.5 V to +4.6 V. Real-world validation confirms stable operation at ΔVCC = 2.5 V (e.g., VCC(A) = 0.8 V, VCC(B) = 3.3 V), with full timing compliance and IOFF functionality intact.

Can OE and DIR be tied together for unidirectional operation?

No - OE and DIR serve independent functions: DIR controls data direction (An↔Bn), while OE enables/disables outputs. Tying them violates recommended operating conditions and risks undefined states during transitions. For unidirectional use, fix DIR to HIGH or LOW and control bus access solely via OE, preserving timing predictability and avoiding shoot-through risk.

Does the DHXQFN24 package require soldering of the exposed thermal pad?

No - the exposed pad (pin 1 index area) has no electrical or mechanical requirement to be soldered. If connected, it must remain electrically floating or tied to GND; intentional soldering improves thermal resistance by ~15 °C/W but is optional. Layout guidelines recommend 4×4 array of thermal vias to internal ground planes if used.

How does suspend mode behave when only VCC(A) is powered?

When VCC(A) = 3.6 V and VCC(B) = GND, the device enters suspend mode: all An and Bn pins enter high-impedance OFF-state regardless of DIR/OE logic levels. IOZ leakage is limited to ±5 μA (max) per port, and no current flows between domains - verified per Table 7 and Section 6 function table under "GND [1] X X Z Z" condition.

74AVC8T245BZX Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: 74AVC

Package/Case:: 24-XFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Logic Type:: Translation Transceiver

Number of Elements:: 1

Number of Bits per Element:: 8

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 12mA, 12mA

Voltage - Supply:: 0.8V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 24-DHXQFN (2x4)

74AVC8T245BZX FAQ

1.How can I place an order for 74AVC8T245BZX through Aetrix?

Please submit a Request for Quotation (RFQ) for 74AVC8T245BZX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74AVC8T245BZX reliable?

The price and inventory of 74AVC8T245BZX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AVC8T245BZX is usually 5 days.

3.What payment methods are accepted for 74AVC8T245BZX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AVC8T245BZX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74AVC8T245BZX?

74AVC8T245BZX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74AVC8T245BZX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74AVC8T245BZX?

For technical support, including 74AVC8T245BZX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AVC8T245BZX requirements.

6.How does Aetrix verify that 74AVC8T245BZX is sourced from the original manufacturer or authorized distributors?

All 74AVC8T245BZX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AVC8T245BZX meets industry standards.

7.What is the process for return or replacement of 74AVC8T245BZX?

All 74AVC8T245BZX units undergo pre-shipment inspection (PSI). If there is an issue with 74AVC8T245BZX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74AVC8T245BZX part is unused and in its original packaging.

Return procedure for 74AVC8T245BZX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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