NXP Semiconductors 74AVCH4T245GU/S500115

Overview

The 74AVCH4T245GU/S500115 from NXP Semiconductors is a 4-bit dual-supply translating transceiver enabling bidirectional level translation between 0.8 V and 3.6 V domains. It supports two independent 2-bit channels or unified 4-bit operation, features IOFF partial power-down protection, active bus hold on all I/Os, and operates across −40 °C to +125 °C. It is used in mixed-voltage SoC interconnects, FPGA I/O bridging, and low-power sensor hub interfaces.

For engineers reviewing the 74AVCH4T245GU/S500115 datasheet, 74AVCH4T245GU/S500115 pinout, 74AVCH4T245GU/S500115 application, or 74AVCH4T245GU/S500115 equivalent, key selection considerations include voltage translation range (0.8 V–3.6 V per rail), suspend-mode behavior during partial power-down, bus hold current specifications, propagation delay asymmetry (nAn→nBn vs. nBn→nAn), and XQFN16 package thermal and routing constraints.

Technical Context

This device implements dual-rail CMOS logic with separate VCC(A) and VCC(B) supplies, where A-side pins (nAn, nDIR, nOE) are referenced to VCC(A) and B-side pins (nBn) to VCC(B). Direction control is synchronous and edge-independent: nDIR HIGH enables A→B data flow; LOW enables B→A flow. Output enable (nOE, active LOW) places both ports in high-impedance state.

IOFF circuitry actively disables outputs when either supply drops to GND, preventing backflow current and enabling true partial power-down. Bus hold circuitry maintains valid logic levels on floating inputs without external resistors-sinking ≥15 µA at VIL and sourcing ≥−15 µA at VIH across 1.4 V–3.0 V supply ranges.

Key Specifications

Pinout & Package

XQFN16 package: 1.80 mm × 2.60 mm × 0.50 mm body, 16-terminal no-lead construction with exposed thermal pad (GND-connected per design recommendation).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVCH4T245PW and NTB0102BFT2G, the 74AVCH4T245GU/S500115 uniquely combines XQFN16 miniaturization, full 4-bit bidirectionality with independent channel controls, and guaranteed −40 °C to +125 °C operation - making it optimal for space-constrained automotive and industrial modules requiring robust mixed-voltage interoperability.

Availability

The 74AVCH4T245GU/S500115 is available at Aetrix Electronics and suitable for industrial sensor hubs, automotive ADAS subsystems, and low-power wearable electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74AVCH4T245GU/S500115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The 74AVCH4T245GU/S500115 belongs to NXP's advanced voltage translation portfolio, designed specifically for mixed-signal systems requiring robust, low-power, and thermally efficient interoperability between heterogeneous voltage domains in harsh environments.

FAQ

What is the maximum allowable voltage difference between VCC(A) and VCC(B) for reliable operation of the 74AVCH4T245GU/S500115?

The 74AVCH4T245GU/S500115 supports any combination of VCC(A) and VCC(B) within 0.8 V to 3.6 V independently - including cases where one rail is 0.8 V and the other is 3.6 V. Absolute maximum ratings allow up to 4.6 V on either supply, but functional operation is guaranteed only within the recommended 0.8 V–3.6 V range per rail. No derating is required for differential supply operation.

Does the 74AVCH4T245GU/S500115 require external pull-up or pull-down resistors on its I/O pins?

No. The 74AVCH4T245GU/S500115 integrates active bus hold circuitry on all A- and B-side I/Os, which sources or sinks sufficient current (≥15 µA at 1.4 V) to maintain valid logic levels on floating inputs. This eliminates the need for external resistors, reducing BOM count and PCB footprint - confirmed in Section 2 and Table 8 of the official NXP datasheet Rev. 4.

How does the 74AVCH4T245GU/S500115 behave when only VCC(A) is powered and VCC(B) is at GND?

When VCC(B) = GND and VCC(A) is active, the 74AVCH4T245GU/S500115 enters suspend mode: all B-side outputs (1B1, 1B2, 2B1, 2B2) go high-impedance, and A-side outputs remain in their last state until nOE is asserted. IOFF circuitry limits leakage to ≤±5 µA, preventing backflow into the unpowered B-domain - a key feature verified in Tables 7 and 8 of the NXP datasheet.

What is the propagation delay asymmetry of the 74AVCH4T245GU/S500115, and why does it matter?

The 74AVCH4T245GU/S500115 exhibits intentional asymmetry: nAn→nBn delay is 5.9 ns (2.5 V/25 °C), while nBn→nAn is 12.1 ns. This reflects optimized internal driver strength for A→B (typically host→peripheral) versus B→A (peripheral→host) paths. Designers must allocate separate timing budgets for each direction - critical for synchronous protocols like SPI or custom command-response interfaces.

Is the 74AVCH4T245GU/S500115 pin-compatible with other packages in the same family, such as SO16 or TSSOP16?

No. The 74AVCH4T245GU/S500115 uses the XQFN16 (SOT1161-1) package with a unique 16-pin top-side terminal layout (e.g., Pin 1 = 1OE, Pin 2 = VCC(B)), differing from SO16 (SOT109-1) and TSSOP16 (SOT403-1) pinouts. While functionally identical, PCB layout and rework procedures are not interchangeable - verified in Figures 3–6 and Table 3 of the NXP datasheet.