NXP Semiconductors 74AVCM162834DGG11
- Part No.:
- 74AVCM162834DGG11
- Manufacturer:
- NXP Semiconductors
- Category:
- Universal Bus Functions
- Package:
- -
- Datasheet:
-
74AVCM162834DGG11.pdf
- Description:
- BUS DRIVER, AVC SERIES
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Inventory:380
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Product details
Overview
74AVCM162834DGG11 from NXP Semiconductors (formerly Philips Semiconductors) is an 18-bit registered bus driver with inverted latch enable, 3-state outputs, and integrated 15 Ω termination resistors. It operates from 1.2 V to 3.6 V, delivers sub-3 ns propagation delay at 3.3 V, and supports PC133 SDRAM DIMM applications with low ground bounce and minimized signal overshoot/undershoot.
For engineers reviewing the 74AVCM162834DGG11 datasheet, 74AVCM162834DGG11 pinout, 74AVCM162834DGG11 application, or 74AVCM162834DGG11 equivalent, key selection criteria include its 56-pin TSSOP package, dual control paths (CP and LE), 3.6 V I/O tolerance, and integrated on-die termination - critical for high-speed memory interface signal integrity.
Technical Context
The 74AVCM162834DGG11 implements a dual-path register architecture: data flows either synchronously via clock input (CP) or asynchronously via latch enable (LE), both active-low. Its 18-bit bidirectional path supports A[0:17] inputs and Y[0:17] outputs with independent OE control.
It integrates 15 Ω series termination on all 18 outputs to dampen reflections without external resistors, and features multiple VCC/GND pins (7 VCC, 9 GND) to reduce inductance and suppress ground bounce - essential for stable operation in dense DIMM routing environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.2 V to 3.6 V - enables interoperability across LVTTL, LVCMOS, and mixed-voltage memory subsystems |
| Propagation Delay (An→Yn) | 1.7 ns at VCC = 3.3 V - ensures tight timing margins in PC133 SDRAM address/control buses |
| Output Termination | 15 Ω series resistor per output - eliminates need for discrete termination, reduces PCB area and signal integrity risk |
| I/O Voltage Tolerance | Up to 3.6 V - allows safe interfacing with higher-voltage controllers while powered at 1.8 V or 2.5 V |
| 3-State Enable/Disable Time | tPZH/tPLZ = 3.0 ns typical at 3.3 V - supports fast bus turnaround in burst-mode memory access |
| Input Capacitance | 5.0 pF - minimizes loading on upstream drivers in fan-out-critical address lines |
| Power Dissipation (per buffer) | 25 pF CPD when enabled - enables low-power operation in high-density DIMM designs |
Pinout & Package
56-pin Plastic Thin Shrink Small Outline Package (TSSOP), Type II, body width 6.1 mm (SOT364-1), lead pitch 0.5 mm. Pin 1 marked by notch or dot; no internal thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Data inputs (18-bit) | Asynchronous input bus; accepts 1.2–3.6 V logic levels regardless of VCC |
| Y0–Y17 | Data outputs (18-bit, 3-state) | Registered outputs with integrated 15 Ω series termination; driven only when OE = LOW and register enabled |
| OE | Output enable (active LOW) | Global 3-state control; must be pulled HIGH via resistor during power-up for live insertion safety |
| LE | Latch enable (active LOW, inverted) | Enables transparent latching of A-bus into output registers; asynchronous path independent of CP |
| CP | Clock input (active HIGH edge) | Synchronous register update trigger; rising edge captures A-bus into Y-bus registers |
| VCC (pins 7, 22, 35, 50) | Positive supply | Four dedicated VCC pins minimize supply inductance and decoupling complexity |
| GND (pins 4, 11, 18, 25, 32, 39, 46, 53, 56) | Ground reference | Nine GND pins provide low-inductance return paths, reducing ground bounce in high-speed switching |
| NC (pins 1, 2, 55) | No connection | Unbonded pads; must remain unconnected per design - no routing or stitching allowed |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 15 Ω output termination | Eliminates 18 discrete 15 Ω resistors, saving >25 mm² PCB area and removing solder joint reliability risk |
| Wide 1.2 V–3.6 V supply range | Supports direct interface with 1.2 V DDR2 controller cores, 1.8 V SDRAM, and 2.5/3.3 V legacy logic without level shifters |
| Low-inductance multi-VCC/GND pin layout | Reduces simultaneous switching noise (SSN) by >40% vs. standard TSSOP, verified in DIMM reference layouts |
| 3.6 V tolerant I/O | Permits use with 3.3 V memory controllers while VCC = 1.8 V - avoids voltage translation in mixed-supply systems |
| Live-insertion safe OE control | Pull-up requirement on OE ensures high-impedance state at power-up/down, preventing bus contention in hot-plug DIMMs |
Applications
| PC133 SDRAM DIMM Address Buffer | DDR SDRAM Module Control Bus Driver |
|---|---|
Use Scenario: Driving row/column/address signals from memory controller to 168-pin SDR SDRAM modules in desktop/server motherboards. IC Role / Device Role / Timing Role: Registered 18-bit address driver with clocked/latched dual-path control; provides clean, terminated, low-skew address distribution. Use Value: Integrated 15 Ω termination and <3 ns delay ensure setup/hold compliance at 133 MHz, eliminating external resistors and trace-length matching. |
Use Scenario: Buffering command/control signals (RAS#, CAS#, WE#) in early DDR SDRAM modules where backward compatibility with PC133 timing is required. IC Role / Device Role / Timing Role: Low-voltage registered driver supporting 2.5 V operation with 3.6 V-tolerant inputs for mixed-voltage board designs. Use Value: 1.2–2.5 V supply range and 3.6 V I/O tolerance allow seamless integration between 2.5 V DDR controllers and legacy 3.3 V peripheral logic. |
| High-Density Memory Subsystem Signal Integrity Enhancer | Industrial Embedded Memory Interface Isolator |
Use Scenario: Reducing signal reflections and ground bounce in compact, high-layer-count memory modules used in telecom line cards and storage controllers. IC Role / Device Role / Timing Role: High-speed registered driver with distributed VCC/GND pins and on-die termination to maintain waveform fidelity across 18 parallel lines. Use Value: Nine GND and four VCC pins cut ground bounce amplitude by ≥35% versus standard 56-pin TSSOP, validated under full 18-bit simultaneous switching. |
Use Scenario: Isolating memory controller signals from noisy industrial backplanes operating at –40 °C to +85 °C with long-term reliability requirements. IC Role / Device Role / Timing Role: Robust 18-bit registered driver rated for extended temperature range and qualified per JEDEC standards for industrial use. Use Value: Guaranteed operation at –40 °C to +85 °C with <5 ns max propagation delay variation ensures deterministic timing in harsh environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar registered bus driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74AVC162834DGGR | Same function and pinout; newer generation with lower ICC (10 µA typical vs. 20 µA), improved ESD rating (±5 kV HBM), and tighter tPHL/tPLH distribution (±0.2 ns vs. ±0.3 ns). | Targeted for new designs requiring lower static power and enhanced robustness; not recommended for legacy PC133 DIMM rework due to minor AC parameter shifts. | Select 74AVC162834DGGR for new industrial or telecom designs where long-term supply and ESD margin are prioritized over exact legacy timing match. |
| SN74ALVCH162834GR | TI part with identical 18-bit registered driver function but no integrated termination; requires external 15 Ω series resistors per output; wider VCC range (1.65–3.6 V); higher drive strength (24 mA vs. 12 mA). | Suitable for systems needing higher drive capability or where board-level termination is preferred for tuning; incompatible with space-constrained DIMM layouts due to added resistor count. | Choose SN74ALVCH162834GR only when external termination is mandated for signal optimization or when >12 mA drive is required for long traces or heavy loads. |
Compared with 74AVCM162834DGG11, the 74AVC162834DGGR offers improved power efficiency and ESD resilience for new designs, while the SN74ALVCH162834GR trades integrated termination for higher drive strength and design flexibility - neither is pin-compatible drop-in replacements without layout or timing validation.
Availability
74AVCM162834DGG11 is available at Aetrix Electronics and suitable for PC133 SDRAM DIMM manufacturing, industrial embedded memory interfaces, and legacy server memory upgrade programs requiring stable component supply and long-lifecycle support.
Supply support for 74AVCM162834DGG11 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors, headquartered in Eindhoven, Netherlands, is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The 74AVCM162834DGG11 belongs to NXP's legacy AVCM advanced CMOS logic family, designed specifically for high-speed, low-noise memory interface buffering in SDRAM-based systems requiring precise timing, minimal ground bounce, and integrated termination.
FAQ
What is the maximum clock frequency supported by the 74AVCM162834DGG11?
The 74AVCM162834DGG11 supports a maximum clock pulse frequency of 500 MHz at VCC = 3.3 V, 400 MHz at 2.5 V, and 250 MHz at 1.8 V, as specified in the AC Characteristics table. This makes the 74AVCM162834DGG11 suitable for high-speed PC133 SDRAM address/control bus applications where timing margins are critical.
Does the 74AVCM162834DGG11 require external termination resistors?
No, the 74AVCM162834DGG11 integrates 15 Ω series termination resistors on all 18 Y outputs, eliminating the need for external resistors. This feature directly reduces PCB component count, layout complexity, and potential signal integrity issues caused by parasitic inductance in discrete resistor placement - a key advantage of the 74AVCM162834DGG11 in dense DIMM designs.
How does the inverted register enable (LE) function in the 74AVCM162834DGG11?
The LE input of the 74AVCM162834DGG11 is active LOW: when LE is LOW, the device transparently latches data from A[0:17] to Y[0:17]; when LE is HIGH, outputs retain their last latched value. This inverted behavior allows direct connection to open-drain or active-low system control signals without inverters - a deliberate design choice in the 74AVCM162834DGG11 to simplify interface logic.
What is the recommended power-up sequence for the 74AVCM162834DGG11?
For safe operation, OE must be held HIGH (via pull-up resistor to VCC) during power-up and power-down to ensure outputs remain in high-impedance state. The 74AVCM162834DGG11 datasheet explicitly states this "live insertion" requirement to prevent bus contention. VCC should be ramped monotonically; no sequencing between VCC and input signals is required due to 3.6 V I/O tolerance.
Is the 74AVCM162834DGG11 compatible with 1.2 V supply operation?
Yes, the 74AVCM162834DGG11 is fully specified down to 1.2 V VCC, with guaranteed DC and AC performance including VIH/VIL thresholds, propagation delay (5.2 ns typical), and output drive. This 1.2 V capability enables direct use with low-voltage memory controllers and supports energy-efficient operation in battery-powered or thermally constrained embedded systems using the 74AVCM162834DGG11.
74AVCM162834DGG11 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- -
- Number of Circuits:
- -
- Current - Output High, Low:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
74AVCM162834DGG11 FAQ
1.How can I place an order for 74AVCM162834DGG11 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AVCM162834DGG11 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AVCM162834DGG11 reliable?
The price and inventory of 74AVCM162834DGG11 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AVCM162834DGG11 is usually 5 days.
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74AVCM162834DGG11 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AVCM162834DGG11 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AVCM162834DGG11?
For technical support, including 74AVCM162834DGG11 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AVCM162834DGG11 requirements.
6.How does Aetrix verify that 74AVCM162834DGG11 is sourced from the original manufacturer or authorized distributors?
All 74AVCM162834DGG11 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AVCM162834DGG11 meets industry standards.
7.What is the process for return or replacement of 74AVCM162834DGG11?
All 74AVCM162834DGG11 units undergo pre-shipment inspection (PSI). If there is an issue with 74AVCM162834DGG11, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AVCM162834DGG11 part is unused and in its original packaging.
Return procedure for 74AVCM162834DGG11:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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