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Home > Products > Integrated Circuits (ICs) > Logic > Universal Bus Functions

NXP Semiconductors 74AVCM162835DGG,11

Name: 74AVCM162835DGG,11
Brand: NXP Semiconductors
SKU: 74AVCM162835DGG,11
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74AVCM162835DGG,11

Manufacturer:: NXP Semiconductors

Category:: Universal Bus Functions

Package:: 56-TFSOP (0.240", 6.10mm Width)

Datasheet:: 74AVCM162835DGG,11.pdf

Description:: IC RGSTRD DVR 3-ST 18BIT 56TSSOP

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Product details

Overview

74AVCM162835DGG,11 from NXP Semiconductors (formerly Philips) is an 18-bit registered bus driver with integrated 15 Ω output termination resistors and 3-state outputs. It features dual control paths via clock (CP) and latch enable (LE), operates from 1.2 V to 3.6 V, and delivers sub-3 ns propagation delay at 3.3 V. It is used in high-speed SDRAM DIMM address/data buffering where signal integrity and timing margin are critical.

For engineers reviewing the 74AVCM162835DGG,11 datasheet, 74AVCM162835DGG,11 pinout, 74AVCM162835DGG,11 application, or 74AVCM162835DGG,11 equivalent, this page provides verified functional identity, validated pin mapping, confirmed termination architecture, JEDEC-compliant voltage operation, and real-world SDRAM interface use context - all derived from the official Philips product specification.

Technical Context

The 74AVCM162835DGG,11 implements a dual-path registered driver architecture: data flows either synchronously through CP (clocked register) or transparently latched via LE (level-sensitive latch). Its 18-bit A0–A17 inputs drive corresponding Y0–Y17 outputs with independent 3-state control via active-low OE.

It integrates on-die 15 Ω series termination resistors per output to suppress overshoot/undershoot without external components. Designed for PC133 SDRAM systems, it interfaces directly with memory controllers and DIMMs while meeting JEDEC Std 8-1A/5/7 for low-voltage CMOS operation.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage Range	1.2 V to 3.6 V - supports mixed-voltage system interfacing and backward compatibility with 1.8 V, 2.5 V, and 3.3 V logic domains
Propagation Delay (An→Yn)	1.7 ns typical at VCC = 3.3 V - enables tight timing budgets in 133 MHz SDRAM address/data paths
Output Termination	Integrated 15 Ω series resistors - eliminates need for external termination, reduces PCB area and signal reflections
Input/Output Tolerance	Up to 3.6 V - allows safe interfacing with higher-voltage peripherals without level shifters
3-State Enable/Disable Time	tPZH/tPLZ = 3.0 ns typical at 3.3 V - ensures fast bus turnaround for multiplexed address/data sharing
Power Dissipation Capacitance	25 pF per buffer (enabled), 6 pF (disabled) - quantifies dynamic power contribution for accurate system-level PD estimation
Operating Temperature	–40 °C to +85 °C - qualified for industrial-grade embedded memory subsystems

Pinout & Package

56-pin Plastic Thin Shrink Small Outline Package (TSSOP), Type II, body width 6.1 mm (SOT364-1).

Pin/Terminal	Circuit Role	Design Meaning
A0–A17	Data inputs (18-bit)	Unidirectional parallel input bus; accepts address or data signals for registration/latching
Y0–Y17	Data outputs (18-bit)	Registered/latched outputs with integrated 15 Ω series termination and 3-state control
OE	Active-low output enable	Drives all Y outputs into high-impedance state; requires pull-up for live insertion safety
LE	Active-high latch enable	Enables transparent latching mode; holds output stable when LE is HIGH
CP	Clock input	Edge-triggered register clock; controls synchronous data transfer from A to Y on rising edge
VCC (pins 7,22,35,50)	Positive supply	Multiple distributed VCC pins minimize supply inductance and reduce ground bounce noise
GND (pins 4,11,18,25,32,39,46,53,56)	Ground reference	9 dedicated GND pins ensure low-impedance return paths and improve signal integrity

Key Features

Feature	Design Value
Wide voltage operation (1.2–3.6 V)	Enables single-part support across DDR, SDR, and legacy memory interfaces without redesign
Integrated 15 Ω output termination	Reduces board-level component count by eliminating 18 discrete series resistors and associated layout complexity
Low-inductance multi-VCC/GND pinning	Suppresses simultaneous switching noise (SSN) in high-density DIMM applications with >100 MHz toggle rates
JEDEC Std 8-1A/5/7 compliance	Guarantees interoperability with industry-standard low-voltage memory controller I/O specifications
Live-insertion safe OE control	Pull-up requirement on OE prevents undefined output states during hot-plug DIMM insertion or removal

Applications

PC133 SDRAM DIMM Address Buffering	SDRAM Controller Signal Fanout
Use Scenario: Driving 18-bit address bus from memory controller to multiple SDRAM chips on a 168-pin DIMM module. IC Role / Device Role / Timing Role: Registered address driver providing setup/hold margin extension and waveform clean-up before SDRAM address inputs. Use Value: Integrated 15 Ω termination and sub-3 ns delay preserve signal integrity at 133 MHz, enabling reliable t_AS/t_AH compliance without external tuning.	Use Scenario: Distributing clock-synchronized address or command signals from a single controller to multiple SDRAM ranks. IC Role / Device Role / Timing Role: Low-skew fanout buffer with latch/register flexibility to align timing across parallel memory channels. Use Value: Dual CP/LE control allows either synchronous (CP-driven) or asynchronous (LE-driven) distribution, simplifying timing closure in multi-rank layouts.
High-Speed Memory Interposer	Legacy-to-Modern Memory Interface Bridge
Use Scenario: Inserted between CPU memory controller and SDRAM modules to compensate for trace-length mismatch and signal degradation. IC Role / Device Role / Timing Role: Signal conditioner with built-in termination and register stage to restore timing margins and reduce jitter accumulation. Use Value: 1.2 V–3.6 V operation allows interposition between disparate voltage domains (e.g., 1.8 V controller → 3.3 V SDRAM), maintaining DC compatibility.	Use Scenario: Adapting older 3.3 V memory controller designs to newer low-voltage SDRAM modules requiring 2.5 V or 1.8 V signaling. IC Role / Device Role / Timing Role: Level-translating registered driver that maintains timing alignment while shifting logic thresholds. Use Value: Input/output tolerance up to 3.6 V permits direct connection to 3.3 V controllers, while output swing adapts to lower VCC levels for downstream SDRAMs.

PC133 SDRAM DIMM Address Buffering

SDRAM Controller Signal Fanout

Use Scenario: Driving 18-bit address bus from memory controller to multiple SDRAM chips on a 168-pin DIMM module.

IC Role / Device Role / Timing Role: Registered address driver providing setup/hold margin extension and waveform clean-up before SDRAM address inputs.

Use Value: Integrated 15 Ω termination and sub-3 ns delay preserve signal integrity at 133 MHz, enabling reliable t_AS/t_AH compliance without external tuning.

Use Scenario: Distributing clock-synchronized address or command signals from a single controller to multiple SDRAM ranks.

IC Role / Device Role / Timing Role: Low-skew fanout buffer with latch/register flexibility to align timing across parallel memory channels.

Use Value: Dual CP/LE control allows either synchronous (CP-driven) or asynchronous (LE-driven) distribution, simplifying timing closure in multi-rank layouts.

High-Speed Memory Interposer

Legacy-to-Modern Memory Interface Bridge

Use Scenario: Inserted between CPU memory controller and SDRAM modules to compensate for trace-length mismatch and signal degradation.

IC Role / Device Role / Timing Role: Signal conditioner with built-in termination and register stage to restore timing margins and reduce jitter accumulation.

Use Value: 1.2 V–3.6 V operation allows interposition between disparate voltage domains (e.g., 1.8 V controller → 3.3 V SDRAM), maintaining DC compatibility.

Use Scenario: Adapting older 3.3 V memory controller designs to newer low-voltage SDRAM modules requiring 2.5 V or 1.8 V signaling.

IC Role / Device Role / Timing Role: Level-translating registered driver that maintains timing alignment while shifting logic thresholds.

Use Value: Input/output tolerance up to 3.6 V permits direct connection to 3.3 V controllers, while output swing adapts to lower VCC levels for downstream SDRAMs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar registered bus driver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
74AVC162835DG,11	No integrated 15 Ω termination resistors; otherwise identical pinout, timing, and voltage range	Requires external series termination for signal integrity - increases BOM count and layout sensitivity	Select when external termination is preferred for tuning flexibility or cost optimization in non-PC133 designs
SN74AVC16835DGGR	16-bit version (vs. 18-bit); same architecture, termination, and voltage specs; different pin count (48-pin TSSOP)	Not pin-compatible; insufficient width for full 18-bit SDRAM address bus - requires two devices or redesign	Choose only if system uses ≤16-bit addressing or space-constrained layouts where 48-pin footprint is mandatory

Compared with 74AVCM162835DGG,11, the 74AVC162835DG,11 trades integrated termination for design flexibility, while the SN74AVC16835DGGR sacrifices bit width for smaller package size - neither offers drop-in replacement capability due to missing termination or reduced channel count.

Availability

74AVCM162835DGG,11 is available at Aetrix Electronics and suitable for PC133 SDRAM DIMM manufacturing, industrial memory subsystem upgrades, and embedded controller memory interface expansion requiring stable component supply and long-term lifecycle assurance.

Supply support for 74AVCM162835DGG,11 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' pioneering logic and memory interface portfolio.

The 74AVCM162835DGG,11 belongs to NXP's advanced voltage CMOS (AVC/AVCM) logic family, engineered specifically for high-speed, low-noise memory interface buffering in SDRAM-based computing and communications platforms.

FAQ

What is the primary function of the 74AVCM162835DGG,11 in memory systems?

The 74AVCM162835DGG,11 serves as an 18-bit registered bus driver with integrated 15 Ω termination, primarily used to buffer and condition address/command signals between memory controllers and SDRAM modules. Its dual-path control (CP and LE) and sub-3 ns propagation delay at 3.3 V make it ideal for PC133-compliant DIMM designs where timing margin and signal integrity are critical. The 74AVCM162835DGG,11 ensures reliable data capture by reducing overshoot/undershoot and minimizing ground bounce through distributed power/ground pins.

Does the 74AVCM162835DGG,11 support live insertion in DIMM modules?

Yes - the 74AVCM162835DGG,11 supports live insertion when OE is tied to VCC via a pull-up resistor, ensuring all outputs remain in high-impedance state during power-up or power-down sequences. This behavior prevents bus contention during hot-plug operations in modular memory systems. The 74AVCM162835DGG,11 datasheet explicitly recommends this configuration to guarantee safe insertion/removal of DIMMs without disrupting system operation.

What is the significance of the integrated 15 Ω termination resistors in the 74AVCM162835DGG,11?

The integrated 15 Ω series termination resistors in the 74AVCM162835DGG,11 suppress output signal overshoot and undershoot without requiring external components, directly improving waveform fidelity on high-speed memory buses. This feature eliminates 18 discrete resistors per device, reducing PCB area, assembly cost, and layout sensitivity. The 74AVCM162835DGG,11 achieves this while maintaining full JEDEC Std 8-1A/5/7 compliance and delivering consistent performance across its 1.2–3.6 V operating range.

Can the 74AVCM162835DGG,11 operate at 1.2 V supply voltage?

Yes - the 74AVCM162835DGG,11 is fully specified down to 1.2 V, with AC characteristics including propagation delay (5.2 ns max at 1.2 V) and DC parameters (VIH/VIL thresholds, VOH/VOL levels) validated across the entire 1.2–3.6 V range. This enables interoperability with ultra-low-power memory controllers and facilitates voltage scaling in battery-powered or thermally constrained embedded systems. The 74AVCM162835DGG,11 maintains functional correctness and timing predictability even at minimum VCC.

How does the 74AVCM162835DGG,11 differ from the 74AVC162835DG,11?

The 74AVCM162835DGG,11 includes integrated 15 Ω output termination resistors, whereas the 74AVC162835DG,11 lacks them - otherwise both share identical pinout, timing, voltage range, and functional behavior. This makes the 74AVCM162835DGG,11 a complete signal-integrity solution for PC133 DIMMs, while the 74AVC162835DG,11 requires external termination. The 74AVCM162835DGG,11 is therefore preferred where board space, BOM simplicity, and guaranteed waveform quality are priorities.

74AVCM162835DGG,11 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: 74AVCM

Package/Case:: 56-TFSOP (0.240", 6.10mm Width)

Packaging:: Tube

Product Status:: Obsolete

Logic Type:: Universal Bus Driver

Number of Circuits:: 18-Bit

Current - Output High, Low:: 12mA, 12mA

Voltage - Supply:: 1.2V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSSOP

74AVCM162835DGG,11 FAQ

1.How can I place an order for 74AVCM162835DGG,11 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74AVCM162835DGG,11 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74AVCM162835DGG,11 reliable?

The price and inventory of 74AVCM162835DGG,11 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AVCM162835DGG,11 is usually 5 days.

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74AVCM162835DGG,11 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74AVCM162835DGG,11 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74AVCM162835DGG,11?

For technical support, including 74AVCM162835DGG,11 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AVCM162835DGG,11 requirements.

6.How does Aetrix verify that 74AVCM162835DGG,11 is sourced from the original manufacturer or authorized distributors?

All 74AVCM162835DGG,11 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AVCM162835DGG,11 meets industry standards.

7.What is the process for return or replacement of 74AVCM162835DGG,11?

All 74AVCM162835DGG,11 units undergo pre-shipment inspection (PSI). If there is an issue with 74AVCM162835DGG,11, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74AVCM162835DGG,11 part is unused and in its original packaging.

Return procedure for 74AVCM162835DGG,11:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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