Nexperia USA Inc. 74AXP1G32GXH

Overview

74AXP1G32GXH from Nexperia is a single 2-input OR gate logic IC with Schmitt-trigger inputs, operating across 0.7 V to 2.75 V supply, delivering 2.0 ns typical propagation delay at 2.5 V, 0.5 pF input capacitance, and IOFF-enabled partial power-down protection. It serves as a level-tolerant signal combiner in ultra-low-power sensor interface and battery-powered microcontroller peripheral circuits.

For engineers reviewing the 74AXP1G32GXH datasheet, 74AXP1G32GXH pinout, 74AXP1G32GXH application, or 74AXP1G32GXH equivalent, key selection criteria include its sub-1.0 V logic compatibility, 0.6 μA max ICC at 85 °C, Schmitt-trigger noise immunity, and X2SON5 (SOT1226-3) 5-terminal thermal-enhanced package.

Technical Context

This device implements a standard positive-logic OR function (Y = A + B) with hysteresis on both inputs, enabling robust operation with slow-rising signals in noisy environments. Its IOFF circuit actively disables outputs during power-down, preventing backflow current when VCC = 0 V while inputs remain biased up to 2.75 V.

Designed for multi-voltage system interfacing, it complies with JEDEC standards JESD8-12A.01 through JESD8-5A.01 and supports dynamic operation down to 0.7 V with guaranteed timing across -40 °C to +85 °C ambient range.

Key Specifications

Pinout & Package

X2SON5 (SOT1226-3) package: plastic thermal-enhanced extremely thin small outline, no leads, 5 terminals, body size 0.8 × 0.8 × 0.32 mm, exposed thermal pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input OR gate applications.

Compared with SN74LVC1G32DBVR and 74LVC1G32GW,125, the 74AXP1G32GXH uniquely supports sub-1 V operation, integrated Schmitt-trigger noise rejection, and IOFF-enabled power sequencing-making it the sole option for battery-critical, multi-rail, and high-noise embedded designs.

Availability

74AXP1G32GXH is available at Aetrix Electronics and suitable for industrial sensor nodes, wearable health monitors, smart home hub interfaces, and asset tracking beacons requiring stable component supply across extended temperature and ultra-low-power constraints.

Supply support for 74AXP1G32GXH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a leading Dutch semiconductor manufacturer specializing in high-performance, energy-efficient logic, analog, and discrete components for automotive, industrial, and consumer markets.

The 74AXP series targets ultra-low-power logic applications demanding wide voltage range, high noise immunity, and robust power sequencing-specifically engineered for battery-operated and energy-constrained edge devices.

FAQ

What is the minimum supply voltage for guaranteed operation?

The 74AXP1G32GXH is fully specified from 0.7 V to 2.75 V. At 0.7 V, propagation delay increases to 124 ns (max) and output drive capability reduces to ±2 mA, but logic functionality and Schmitt-trigger hysteresis remain functional per Table 7 and Table 8 of the datasheet.

Does the X2SON5 package require solder paste stencil adjustments?

Yes. The SOT1226-3 package uses a 0.32 mm height and 0.20 mm lead pitch; recommended stencil aperture is 0.25 mm × 0.25 mm with 50% area reduction for controlled paste volume. Reflow profile must peak at 260 °C for ≤10 seconds to ensure void-free thermal pad wetting.

Can inputs exceed VCC without damage?

Yes. Inputs tolerate voltages up to 2.75 V regardless of VCC level, including when VCC = 0 V. This is enabled by internal clamping diodes and verified under "Input Voltage" limiting values (Table 5), supporting mixed-voltage signal injection during power sequencing.

Is the GND pin electrically connected to the thermal pad?

No. The X2SON5 thermal pad (exposed copper on underside) is not internally connected to any terminal. It may be left floating, grounded via thermal via, or tied to GND externally-no electrical function is assigned, and grounding improves thermal performance by ~15 °C/W.