Nexperia USA Inc. 74AXP2G34GSH

Overview

74AXP2G34GSH from Nexperia is a low-power dual Schmitt-trigger buffer IC designed for signal conditioning and noise-immune level translation in ultra-low-voltage digital systems. It operates across 0.7 V to 2.75 V supply, delivers <2.0 ns typical propagation delay at 2.3–2.7 V, features IOFF partial power-down protection, and supports industrial temperature range (−40 °C to +85 °C). It is used in battery-powered IoT sensor interfaces and voltage-level bridging between mixed-supply logic domains.

For engineers reviewing the 74AXP2G34GSH datasheet, 74AXP2G34GSH pinout, 74AXP2G34GSH application, or 74AXP2G34GSH equivalent, key selection criteria include its sub-1 µA static ICC at 85 °C, 0.5 pF input capacitance, IOFF-enabled bus hold during power sequencing, and compatibility with JEDEC standards JESD8-12A.01 through JESD8-5A.01.

Technical Context

This device integrates two independent non-inverting buffers, each with Schmitt-trigger inputs enabling robust operation with slow-rising or noisy signals. Its IOFF circuit actively disables outputs when VCC = 0 V, blocking backflow current up to ±20 mA per I/O.

It meets JEDEC-compliant voltage thresholds across five VCC bands (0.75–0.85 V, 1.1–1.3 V, 1.4–1.6 V, 1.65–1.95 V, and 2.3–2.7 V), ensuring interoperability with 1.2 V, 1.5 V, 1.8 V, and 2.5 V logic families while maintaining <10 % VCC overshoot/undershoot.

Key Specifications

Pinout & Package

XSON6 (SOT1202) package: 1.0 mm × 1.0 mm × 0.35 mm body, no leads, 6-terminal exposed pad-less construction optimized for space-constrained PCB layouts and automated reflow assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual buffer applications.

Compared with SN74LVC2G34DBVR and 74LVC2G17GW, the 74AXP2G34GSH uniquely combines Schmitt-trigger inputs, IOFF, sub-1 µA ICC, and 0.7–2.75 V operation - making it the only option for energy-harvesting sensors and dynamically scaled SoCs requiring guaranteed power-domain isolation.

Availability

74AXP2G34GSH is available at Aetrix Electronics and suitable for IoT sensor interfaces, multi-rail logic translation, and power-gated subsystem isolation requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 74AXP2G34GSH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, discrete, and MOSFET solutions with focus on efficiency, reliability, and miniaturization for consumer, industrial, and automotive markets.

The 74AXP series targets ultra-low-power digital interfacing in space- and energy-constrained applications, emphasizing sub-1 V operation, IOFF, and JEDEC-compliant multi-voltage interoperability.

FAQ

Does 74AXP2G34GSH support true bidirectional signal translation?

No. It is a dual unidirectional buffer with separate input and output pins (1A→1Y, 2A→2Y). Bidirectional translation requires external control logic or dedicated bus transceivers. Its IOFF feature applies only during power-down, not direction control.

Can 74AXP2G34GSH operate reliably at 0.7 V with full timing specifications?

Yes. Propagation delay is specified from 2 ns (min) to 110 ns (max) at 0.75–0.85 V, and static ICC remains ≤0.6 µA up to 85 °C. All DC and AC parameters in Table 6 and Table 8 are validated across the full 0.7–2.75 V range.

What is the maximum capacitive load this device can drive while maintaining specified tpd?

Test data in Figures 7–11 confirms stable propagation delay up to 50 pF load capacitance across all VCC ranges. At 2.7 V and 25 °C, tpd increases from 2.0 ns (CL = 5 pF) to 4.1 ns (CL = 50 pF), remaining within datasheet limits.

Is the GND pin internally connected to the die substrate or exposed thermal pad?

No thermal pad is present. The XSON6 (SOT1202) package has no exposed pad; GND is electrically connected only to pin 2. Thermal dissipation relies on PCB copper area under the 1.0 × 1.0 mm body, with Ptot rated at 250 mW.