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Texas Instruments 74CB3Q3257RGYRG4
- Part No.:
- 74CB3Q3257RGYRG4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
74CB3Q3257RGYRG4.pdf
- Description:
- IC MUX/DEMUX 4 X 2:1 16VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,467
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Product details
Overview
74CB3Q3257RGYRG4 from Texas Instruments is a 4-bit 1-of-2 FET multiplexer/demultiplexer bus switch optimized for high-bandwidth signal routing in 2.5V/3.3V systems. It delivers rail-to-rail switching (0–5V with 3.3V VCC), 4Ω typical on-state resistance, 500MHz bandwidth, and bidirectional near-zero-propagation-delay data flow - enabling low-distortion USB, differential interface, and bus isolation applications.
For engineers reviewing the 74CB3Q3257RGYRG4 datasheet, 74CB3Q3257RGYRG4 pinout, 74CB3Q3257RGYRG4 application, or 74CB3Q3257RGYRG4 equivalent, key selection criteria include its 5V-tolerant I/Os during power-up/down, Ioff partial-power-down support, 3.5pF typical OFF-state I/O capacitance, and VQFN-16 (RGY) package compatibility with high-density PCB layouts.
Technical Context
The 74CB3Q3257RGYRG4 implements four independent 1-of-2 analog/digital switches using charge-pump-enhanced FET pass transistors to maintain flat, low ron across 2.3V–3.6V VCC. Each channel features separate select (S) and output-enable (OE) control, supporting simultaneous 4-channel multiplexing or demultiplexing with true bidirectional operation and no direction pin.
Its architecture enables 5V-tolerant I/Os regardless of VCC state, undershoot clamp diodes on all control/data pins, and guaranteed high-impedance isolation when OE is high - critical for hot-swap, level-shifting, and bus-gating functions in optical networking and IP telephony systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3V to 3.6V - supports dual-rail 2.5V/3.3V logic domains without external level shifters |
| ron (Typ) | 4Ω - ensures minimal voltage drop and signal attenuation at ±64mA channel current |
| Bandwidth | 500MHz - enables clean transmission of high-speed digital signals including USB 2.0 and PCIe Gen1 |
| Cio(OFF) | 3.5pF typical - reduces capacitive loading and crosstalk in multi-drop bus architectures |
| fOE Max | 20MHz - defines maximum toggle rate for output-enable control in dynamic switching applications |
| Ioff Support | Yes - prevents backflow current during partial power-down, protecting upstream/downstream circuitry |
| ESD Rating | ±2000V HBM - meets industrial-grade robustness requirements for board-level handling and field operation |
Pinout & Package
VQFN-16 (RGY) package: 4mm × 3.5mm body, 0.5mm pitch, exposed thermal pad - optimized for thermal dissipation and space-constrained designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S | Select input | Controls path between A and B1/B2 per channel; active-high logic |
| OE | Output enable (active low) | Global enable/disable for all four channels; high = high-Z isolation |
| 1A–4A | Common I/O ports | Bidirectional data terminals connecting to shared bus or controller |
| 1B1/1B2–4B1/4B2 | Channel I/O pairs | Two selectable paths per channel; S selects B1 (low) or B2 (high) |
| VCC | Power supply | Supplies internal charge pump and logic; must be bypassed with 0.1µF capacitor |
| GND | Ground reference | Return path for signal and power; connects to thermal pad for heat sinking |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports 0–5V signaling with 3.3V VCC - eliminates need for external level translators in mixed-voltage systems |
| 5V-tolerant I/Os | Operates safely with 5V signals applied while powered at 2.5V/3.3V or fully unpowered - enables hot-plug capability |
| Low and flat ron | 4Ω typical over full temperature and voltage range - preserves signal integrity and timing margins in high-speed links |
| Partial-power-down (Ioff) | Blocks current flow when VCC = 0V - prevents damage during system sleep or staged power sequencing |
| Undershoot clamp diodes | Integrated protection on all I/O and control pins - suppresses negative transients below –1.8V without external components |
Applications
| USB 2.0 Interface Switching | Differential Signal Routing |
|---|---|
Use Scenario: Selecting between two USB 2.0 upstream ports in a docking station or multi-host peripheral. IC Role / Device Role / Timing Role: Bidirectional 4-bit bus switch providing sub-1ns propagation delay and 500MHz bandwidth to preserve eye diagram integrity. Use Value: Enables seamless host switching without signal degradation or protocol handshake interruption. | Use Scenario: Isolating LVDS or RSDS differential pairs in optical module control interfaces. IC Role / Device Role / Timing Role: Low-capacitance (3.5pF OFF), low-ron analog switch maintaining common-mode and differential impedance stability. Use Value: Prevents skew and jitter accumulation across multiple switched differential lanes in EPON transceivers. |
| Optical Networking Bus Gating | IP Phone Signal Multiplexing |
Use Scenario: Enabling/disabling FPGA configuration buses or diagnostic interfaces in video-over-fiber equipment. IC Role / Device Role / Timing Role: High-impedance isolation via OE control with <7ns disable time - ensures clean bus release before reconfiguration. Use Value: Eliminates bus contention during FPGA partial reconfiguration or firmware updates. | Use Scenario: Sharing audio codec resources between baseband processor and VoIP DSP in wireless IP phones. IC Role / Device Role / Timing Role: 4-channel 1-of-2 mux supporting simultaneous stereo audio + PCM clock routing with rail-to-rail analog fidelity. Use Value: Reduces component count by consolidating multiple discrete switches into single compact VQFN device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CB3Q3257PWRG4 | TSSOP-16 package (5mm × 6.4mm); higher thermal resistance (RθJA = 112.7°C/W vs. 49.1°C/W) | Less suitable for thermally constrained or high-power-density layouts | Choose when board layout requires SOIC-compatible footprint or legacy assembly tooling |
| SN74CB3Q3257DGVR | TVSOP-16 package (3.6mm × 6.4mm); no exposed thermal pad; RθJA = 126.0°C/W | Limited thermal performance in sustained high-frequency operation | Prefer for cost-sensitive consumer applications where peak bandwidth usage is intermittent |
Compared with SN74CB3Q3257PWRG4 and SN74CB3Q3257DGVR, the 74CB3Q3257RGYRG4 offers superior thermal management via its exposed pad and lowest junction-to-ambient resistance - making it the optimal choice for continuous 500MHz operation in compact optical modules and industrial networking gear.
Availability
74CB3Q3257RGYRG4 is available at Aetrix Electronics and suitable for optical networking, IP telephony, and high-speed interface design requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant VQFN packaging.
Supply support for 74CB3Q3257RGYRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.
The CB3Q family - including the 74CB3Q3257RGYRG4 - was engineered specifically for high-bandwidth, low-distortion signal routing in next-generation optical modules, broadband infrastructure, and mixed-signal interface applications.
FAQ
What is the maximum operating temperature for the 74CB3Q3257RGYRG4?
The 74CB3Q3257RGYRG4 is rated for operation from –40°C to +105°C ambient temperature. This extended range supports deployment in industrial optical networking equipment and outdoor IP phone base stations where thermal management is challenging. The VQFN-16 (RGY) package's low RθJA of 49.1°C/W helps maintain safe junction temperatures even under continuous 20MHz OE toggling at full load.
Does the 74CB3Q3257RGYRG4 support level shifting between 1.8V and 5V domains?
Yes, the 74CB3Q3257RGYRG4 supports 0–5V signaling on I/O ports with VCC supplied at 2.5V or 3.3V - enabling direct level shifting between 1.8V, 2.5V, 3.3V, and 5V logic domains. Its 5V-tolerant I/Os remain functional even when VCC is 0V, allowing safe interface to legacy 5V peripherals without external translators. This capability is confirmed in Section 5.3 (Recommended Operating Conditions) and Section 6.3 (Feature Description) of the TI datasheet SCDS135E.
How does the Ioff feature protect the 74CB3Q3257RGYRG4 during partial power-down?
The Ioff feature in the 74CB3Q3257RGYRG4 disables current flow through the switch FETs when VCC = 0V, preventing damaging back-current from live I/O lines into a powered-down subsystem. This is critical in modular systems like optical line cards where individual sections may be powered down independently. Test data in Section 5.5 (Electrical Characteristics) confirms Ioff ≤ 1µA at VCC = 0V and VI/O = 5.5V - ensuring robust isolation without external blocking diodes.
What is the typical propagation delay of the 74CB3Q3257RGYRG4 at 3.3V VCC?
The 74CB3Q3257RGYRG4 exhibits a typical propagation delay (tpd) of 0.2ns from A to B or B to A at VCC = 3.3V, as specified in Section 5.7 (Switching Characteristics). This near-zero delay results from its low 4Ω ron and 3.5pF Cio(OFF), enabling transparent signal routing in high-speed serial links. Measured values remain stable across –40°C to +105°C, with worst-case tpd ≤ 0.32ns at 105°C - verified in TI's characterization report SCDS135E.
Can the 74CB3Q3257RGYRG4 be used in analog signal paths such as audio or sensor interfaces?
Yes, the 74CB3Q3257RGYRG4 is qualified for both digital and analog applications, including audio routing and sensor multiplexing. Its rail-to-rail switching, flat 4Ω ron, and low 3.5pF OFF-state capacitance minimize THD and crosstalk - supporting 24-bit audio fidelity and millivolt-level sensor signal integrity. TI explicitly lists "analog applications" in Section 1 (Features) and validates performance up to 500MHz, confirming suitability for wideband analog signal gating in IP phone codecs and optical module monitoring circuits.
74CB3Q3257RGYRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 4 x 2:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (4x3.5)
74CB3Q3257RGYRG4 FAQ
1.How can I place an order for 74CB3Q3257RGYRG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CB3Q3257RGYRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74CB3Q3257RGYRG4 reliable?
The price and inventory of 74CB3Q3257RGYRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CB3Q3257RGYRG4 is usually 5 days.
3.What payment methods are accepted for 74CB3Q3257RGYRG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CB3Q3257RGYRG4 transactions.
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4.How is shipping managed for 74CB3Q3257RGYRG4?
74CB3Q3257RGYRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74CB3Q3257RGYRG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74CB3Q3257RGYRG4?
For technical support, including 74CB3Q3257RGYRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CB3Q3257RGYRG4 requirements.
6.How does Aetrix verify that 74CB3Q3257RGYRG4 is sourced from the original manufacturer or authorized distributors?
All 74CB3Q3257RGYRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CB3Q3257RGYRG4 meets industry standards.
7.What is the process for return or replacement of 74CB3Q3257RGYRG4?
All 74CB3Q3257RGYRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CB3Q3257RGYRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CB3Q3257RGYRG4 part is unused and in its original packaging.
Return procedure for 74CB3Q3257RGYRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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