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Texas Instruments 74CB3T1G125DBVRE4

Part No.:
74CB3T1G125DBVRE4
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
SC-74A, SOT-753
Datasheet:
Aetrix74CB3T1G125DBVRE4.pdf
Description:
IC BUS SWITCH 1 X 1:1 SOT23-5
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,033

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Product details

Overview

74CB3T1G125DBVRE4 from Texas Instruments is a single-channel FET bus switch IC designed for bidirectional level translation and bus isolation in mixed-voltage systems. It operates from 2.3 V to 3.6 V, supports 5-V-tolerant I/Os, delivers typ. 5 Ω ON-state resistance, <0.25 ns propagation delay, and enables partial-power-down via Ioff. It is used in USB interface signal routing and low-power portable equipment.

For engineers reviewing the 74CB3T1G125DBVRE4 datasheet, 74CB3T1G125DBVRE4 pinout, 74CB3T1G125DBVRE4 application, or 74CB3T1G125DBVRE4 equivalent, key selection criteria include VCC range (2.3–3.6 V), 5-V-tolerant I/O capability, Ioff support for power sequencing, low capacitance (5 pF OFF-state), and SOT-23 (DBV) 5-pin package compatibility with space-constrained PCB layouts.

Technical Context

The 74CB3T1G125DBVRE4 implements a single NMOS FET-based transmission gate architecture with gate drive referenced to VCC, enabling voltage translation where output tracks VCC. Its control logic uses active-low OE to enable bidirectional conduction between A and B ports.

It features integrated undershoot clamp diodes on all I/Os, supports mixed-mode signaling (0–5 V inputs with 2.5/3.3 V VCC), and guarantees latch-up immunity per JESD 17 (>250 mA). The device maintains high-impedance isolation when OE is high or VCC = 0 V, satisfying Ioff requirements for hot-plug and partial-power-down systems.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 2.3 V to 3.6 V - Enables operation across 2.5-V and 3.3-V system rails without external level shifters.
ron (Typ) 5 Ω - Minimizes voltage drop and signal distortion during high-speed data transfer (e.g., USB 1.1).
tpd (Max) 0.25 ns - Supports >1 GHz signal integrity in short-reach interconnects with negligible timing skew.
Cio(OFF) 5 pF typ - Reduces capacitive loading on upstream drivers and preserves signal edge rates.
Ioff 10 µA max at VCC = 0 V - Prevents backflow current during power sequencing, protecting powered-down subsystems.
VI/O Range 0 V to 5.5 V - Allows direct connection to 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS logic without external clamping.
ESD Rating 2000-V HBM, 1000-V CDM - Meets industrial-grade robustness requirements for board-level handling and field operation.

Pinout & Package

SOT-23 (DBV) 5-pin plastic package, 1.45 mm max height, JEDEC MO-178 compliant, tape-and-reel (3000 pcs/reel), RoHS-compliant NIPDAU finish, MSL Level-1.

Pin/Terminal Circuit Role Design Meaning
1 VCC Positive supply input - Must be stable within 2.3–3.6 V; powers internal gate driver and defines output voltage translation reference.
2 A Data I/O port A - Bidirectional terminal; connects to source-side logic (e.g., microcontroller GPIO).
3 GND Ground reference - Shared return path for VCC and all I/Os; requires low-impedance PCB connection.
4 B Data I/O port B - Bidirectional terminal; connects to sink-side logic (e.g., peripheral bus line).
5 OE Active-low output-enable - Driven low to enable A↔B conduction; tied to VCC via pullup for default high-Z state during power-up.

Key Features

Feature Design Value
5-V-tolerant I/Os Supports 0–5.5 V signaling on A/B pins with 2.5/3.3 V VCC - eliminates external level translators in mixed-voltage USB or memory interfaces.
Output voltage translation VOH ≈ VCC - Ensures compatible logic-high levels for downstream 2.5-V or 3.3-V receivers without voltage droop.
Partial-power-down support Ioff ≤ 10 µA at VCC = 0 V - Enables safe isolation of unpowered domains while other system sections remain active.
Low ON-state resistance ron = 5 Ω typ - Maintains signal integrity for 24-mA drive strength and minimizes IR drop in high-speed data paths.
Undershoot clamp diodes Integrated on all I/Os - Absorbs negative transients down to –1.2 V, protecting connected logic from ESD or crosstalk-induced undershoot.

Applications

USB 1.1 Signal Isolation Microcontroller GPIO Expansion

Use Scenario: Isolating D+ and D− lines between a 3.3-V host MCU and legacy 5-V USB peripheral during enumeration.

IC Role / Device Role / Timing Role: Bidirectional bus switch enabling voltage translation and hot-plug-safe signal routing with sub-nanosecond delay.

Use Value: Eliminates need for discrete level-shifter ICs; preserves USB full-speed timing budget while supporting Ioff-driven power sequencing.

Use Scenario: Expanding GPIO count on a battery-powered IoT sensor node by sharing a single 3.3-V I²C bus among multiple 5-V sensors.

IC Role / Device Role / Timing Role: Low-capacitance (5 pF), low-ron (5 Ω) switch enabling clean signal pass-through with minimal rise-time degradation.

Use Value: Reduces BOM cost and PCB area vs. dedicated level translators; supports 400-kHz I²C timing with no added propagation delay.

Low-Power Portable Equipment Mixed-Voltage Memory Interface

Use Scenario: Enabling dynamic power gating of a 3.3-V display interface while retaining 5-V backlight control in a handheld medical device.

IC Role / Device Role / Timing Role: Power-domain isolator with Ioff protection, ensuring no leakage current flows into unpowered display controller.

Use Value: Extends battery life by eliminating standby current paths; meets IEC 60601-1 leakage safety limits during partial shutdown.

Use Scenario: Interfacing a 2.5-V FPGA I/O bank to a 3.3-V parallel flash memory in an industrial PLC module.

IC Role / Device Role / Timing Role: Voltage-tracking bus switch providing bidirectional data flow with VOH ≈ VCC and VIH compatible with both logic families.

Use Value: Avoids timing closure issues caused by external resistive dividers; supports 25-MHz read/write cycles without setup/hold violation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CB3T1G125DBVR Same silicon, identical electrical specs; differs only in RoHS finish (NIPDAU vs. NIPDAU/Sn) and top-side marking (W25_ vs. W25F). No functional difference; suitable for identical use cases including USB and GPIO isolation. Select 74CB3T1G125DBVRE4 for TI's standard production release with NIPDAU finish and full traceability documentation.
SN74CB3T1G125DCKR Same functionality and specs, but in SC-70 (DCK) 5-pin package - 0.65-mm lead pitch vs. DBV's 0.95-mm pitch; 1.1-mm max height vs. 1.45-mm. Better suited for ultra-dense layouts where footprint area is constrained more than height; thermal impedance higher (252°C/W vs. 206°C/W). Choose SN74CB3T1G125DCKR only when PCB real estate is critical and thermal derating is acceptable.

Compared with SN74CB3T1G125DBVR, 74CB3T1G125DBVRE4 offers identical performance with standardized packaging documentation; versus SN74CB3T1G125DCKR, it provides lower thermal resistance and easier hand-soldering due to larger pitch and taller profile - critical for industrial rework and thermal reliability.

Availability

74CB3T1G125DBVRE4 is available at Aetrix Electronics and suitable for USB interface isolation, microcontroller GPIO expansion, and low-power portable equipment requiring stable component supply across extended product lifecycles.

Supply support for 74CB3T1G125DBVRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability components.

The SN74CB3T1G125 family is designed for low-voltage, high-speed digital interface applications requiring level translation, bus isolation, and partial-power-down capability in space- and power-constrained systems.

FAQ

What is the maximum operating temperature range for the 74CB3T1G125DBVRE4?

The 74CB3T1G125DBVRE4 is rated for operation from –40°C to +85°C ambient temperature. This range is validated per TI's recommended operating conditions and applies to all electrical specifications including ron, tpd, and Ioff. Thermal derating is not required within this range, and the device maintains full functionality across the entire span without parameter drift beyond datasheet limits.

Does the 74CB3T1G125DBVRE4 support true bidirectional signal flow?

Yes, the 74CB3T1G125DBVRE4 supports fully bidirectional data flow between its A and B ports when OE is low. Its FET-based architecture has no intrinsic directionality - signal propagation delay, ON-resistance, and voltage translation behavior are symmetric regardless of whether data originates at A or B. This is confirmed in the functional table and simplified schematic in the official datasheet.

Can the 74CB3T1G125DBVRE4 be used with a 2.5-V VCC to translate 5-V inputs to 2.5-V outputs?

Yes, the 74CB3T1G125DBVRE4 supports 5-V-to-2.5-V level shifting when VCC = 2.5 V. Per Figure 1 and the "Data I/Os Support 0- to 5-V Signaling Levels" specification, VOH tracks VCC, so a 5-V input produces a ~2.5-V output. This is verified across the full operating range (2.3–3.6 V) and is explicitly supported for 2.5-V CMOS systems.

Is the 74CB3T1G125DBVRE4 pin-compatible with other members of the SN74CB3T1G125 family?

Yes, the 74CB3T1G125DBVRE4 shares identical pinout and function with SN74CB3T1G125DBVR and SN74CB3T1G125DCKR - all have 5-pin configurations with VCC, A, GND, B, and OE in the same order for DBV (SOT-23). However, DBV and DCK packages are physically incompatible due to differing lead pitch and body dimensions, so PCB layout must match the specific package variant.

What is the purpose of the Ioff feature in the 74CB3T1G125DBVRE4?

The Ioff feature in the 74CB3T1G125DBVRE4 ensures that leakage current remains below 10 µA when VCC = 0 V, preventing damaging backflow through the switch during partial-power-down states. This allows safe isolation of unpowered subsystems (e.g., a dormant sensor interface) while other sections of the system remain active - a requirement for modern low-power and hot-plug architectures.

74CB3T1G125DBVRE4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CB
Package/Case:
SC-74A, SOT-753
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Type:
Bus Switch
Circuit:
1 x 1:1
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-23-5

74CB3T1G125DBVRE4 FAQ

1.How can I place an order for 74CB3T1G125DBVRE4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CB3T1G125DBVRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CB3T1G125DBVRE4 reliable?

The price and inventory of 74CB3T1G125DBVRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CB3T1G125DBVRE4 is usually 5 days.

3.What payment methods are accepted for 74CB3T1G125DBVRE4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CB3T1G125DBVRE4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74CB3T1G125DBVRE4?

74CB3T1G125DBVRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CB3T1G125DBVRE4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CB3T1G125DBVRE4?

For technical support, including 74CB3T1G125DBVRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CB3T1G125DBVRE4 requirements.

6.How does Aetrix verify that 74CB3T1G125DBVRE4 is sourced from the original manufacturer or authorized distributors?

All 74CB3T1G125DBVRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CB3T1G125DBVRE4 meets industry standards.

7.What is the process for return or replacement of 74CB3T1G125DBVRE4?

All 74CB3T1G125DBVRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CB3T1G125DBVRE4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CB3T1G125DBVRE4 part is unused and in its original packaging.

Return procedure for 74CB3T1G125DBVRE4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74CB3T1G125DBVRE4 Tags

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