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Texas Instruments 74CB3T1G125DBVRG4

Part No.:
74CB3T1G125DBVRG4
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
SC-74A, SOT-753
Datasheet:
Aetrix74CB3T1G125DBVRG4.pdf
Description:
IC BUS SWITCH 1 X 1:1 SOT23-5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,553

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Product details

Overview

74CB3T1G125DBVRG4 from Texas Instruments is a single-channel 5-V-tolerant FET bus switch optimized for mixed-voltage system interfacing, featuring 5 Ω typical ON-state resistance (ron), 0.25 ns typical propagation delay, and bidirectional level translation between 0–5 V I/Os with 2.3–3.6 V VCC supply-used in USB interface isolation and voltage-domain bridging in portable embedded systems.

For engineers reviewing the 74CB3T1G125DBVRG4 datasheet, 74CB3T1G125DBVRG4 pinout, 74CB3T1G125DBVRG4 application, or 74CB3T1G125DBVRG4 equivalent, key selection criteria include Ioff partial-power-down support, 5-V-tolerant I/Os with device powered up or down, low 5 pF OFF-state capacitance, and SOT-23 (DBV) 5-pin package compatibility with space-constrained PCB layouts.

Technical Context

The 74CB3T1G125DBVRG4 implements a single NMOS transmission gate controlled by an OE input, enabling bidirectional signal flow between A and B ports when OE is low. Its voltage-tracking output behavior ensures VOH ≈ VCC across 2.3–3.6 V supply range, supporting level shifting from 5-V/3.3-V inputs down to 2.5-V outputs.

It integrates undershoot clamp diodes on all data and control inputs, supports TTL- and CMOS-compatible control logic at 2.5 V/3.3 V VCC, and guarantees latch-up immunity exceeding 250 mA per JESD 17-critical for robust operation in mixed-signal industrial and portable applications.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range2.3 V to 3.6 V - enables interoperability across 2.5-V and 3.3-V logic domains while maintaining 5-V tolerance on I/Os
ron (Typ)5 Ω - minimizes voltage drop and power loss during signal pass-through, critical for high-speed digital integrity
tpd (Typ)0.25 ns - delivers near-zero propagation delay for timing-critical interconnects such as USB 2.0 data lines
Cio(OFF) (Typ)5 pF - reduces capacitive loading on upstream drivers and preserves signal edge rates in high-frequency buses
Ioff10 µA max at VCC = 0 V - prevents backflow current during partial power-down, ensuring system-level isolation
VI/O Range0 V to 5.5 V - supports direct connection to 5-V legacy peripherals without external level-shifting circuitry
ESD Rating2000-V HBM, 1000-V CDM - meets industrial-grade ESD robustness requirements without added protection components

Pinout & Package

SOT-23 (DBV) 5-pin package: 1.45 mm max height, 2.9 mm × 1.6 mm footprint, lead pitch 0.95 mm, RoHS-compliant NiPdAu finish, MSL Level-1.

Pin/TerminalCircuit RoleDesign Meaning
1VCCPositive supply input - powers internal control logic and sets output voltage reference; must be decoupled locally
2AData input/output port A - bidirectional terminal connected to source-side logic domain (e.g., 5-V microcontroller)
3GNDGround reference - common return path for supply and signal currents; requires low-impedance PCB connection
4BData input/output port B - bidirectional terminal connected to sink-side logic domain (e.g., 3.3-V FPGA I/O bank)
5OEActive-low output enable - drives switch ON (low) or high-impedance OFF (high); TTL/CMOS compatible with 2.5-V min VIH

Key Features

FeatureDesign Value
5-V-tolerant I/OsOperates with 0–5.5 V signals on A/B pins regardless of VCC state - eliminates need for external clamping or translation ICs
Mixed-mode signal supportSimultaneous 5-V, 3.3-V, 2.5-V, 1.8-V, and 1.5-V signaling on same bus - enables seamless integration across heterogeneous SoC subsystems
Ioff partial-power-downIsolates A and B ports when VCC = 0 V - prevents current leakage into unpowered sections during sleep or hot-swap events
Low ON-state resistance5 Ω typ ensures <100 mV voltage drop at 20 mA - preserves logic thresholds and reduces dynamic power dissipation
Undershoot clamp diodesIntegrated protection on all I/O and control pins - suppresses negative transients below –1.2 V without external components

Applications

USB 2.0 Data Line IsolationMicrocontroller-to-FPGA Voltage Bridging

Use Scenario: Isolating D+ and D− lines between a 5-V USB host controller and a 3.3-V USB transceiver IC in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Bidirectional bus switch providing 5-V-to-3.3-V level translation with sub-nanosecond delay and zero added jitter.

Use Value: Eliminates discrete resistor-divider or active translator circuits, reducing BOM count and board area while maintaining full USB 2.0 signal integrity.

Use Scenario: Interfacing a 5-V legacy MCU GPIO bank to a 2.5-V FPGA I/O bank in industrial PLC I/O expansion modules.

IC Role / Device Role / Timing Role: Single-bit voltage-domain translator enabling synchronous data exchange without timing skew or level mismatch errors.

Use Value: Supports simultaneous operation across multiple voltage rails without violating FPGA input voltage limits or requiring complex power sequencing.

Hot-Swappable Peripheral InterfaceLow-Power Sensor Hub Signal Routing

Use Scenario: Enabling safe insertion/removal of 5-V sensor modules into a powered-down 3.3-V mainboard in field-deployable environmental monitors.

IC Role / Device Role / Timing Role: Ioff-enabled isolation switch preventing backfeed current from live 5-V peripherals into unpowered 3.3-V subsystems.

Use Value: Achieves true hot-swap capability without auxiliary power management ICs or mechanical interlocks.

Use Scenario: Routing I²C clock/data lines from a 3.3-V MCU to multiple 1.8-V or 2.5-V analog sensors in battery-powered wearable health trackers.

IC Role / Device Role / Timing Role: Low-capacitance (5 pF OFF), low-leakage (±10 µA IOZ) switch minimizing bus loading and standby current draw.

Use Value: Extends battery life by >12% versus standard translators and maintains I²C timing margins at 400 kHz operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74CB3T1G125DBVRSame silicon die, identical electrical specs; differs only in tape-and-reel packaging and top-side marking (W25_ vs W25F)No functional difference; suitable for identical use cases including USB isolation and mixed-voltage routingSelect when standard TI part marking or legacy reel configuration is required for traceability or ERP alignment
SN74CB3T1G125DCKRIdentical functionality but in SC-70 (DCK) 5-pin package - 1.1 mm max height, 2.2 mm × 1.3 mm footprint, 0.65 mm pitchBetter suited for ultra-dense layouts where 0.25 mm height reduction and smaller land pattern are prioritized over SOT-23 rework familiarityChoose for next-generation miniaturized designs where PCB real estate is constrained and assembly process supports SC-70 handling

Compared with SN74CB3T1G125DBVR and SN74CB3T1G125DCKR, the 74CB3T1G125DBVRG4 offers identical core switching performance and 5-V tolerance in the industry-standard SOT-23 DBV package with enhanced RoHS compliance (NIPDAU finish) and consistent MSL-1 rating-making it optimal for high-volume production with legacy footprint compatibility and simplified procurement.

Availability

74CB3T1G125DBVRG4 is available at Aetrix Electronics and suitable for USB interface isolation, microcontroller-to-FPGA voltage bridging, and hot-swappable peripheral interfaces requiring stable component supply, long-term lifecycle assurance, and full RoHS compliance.

Supply support for 74CB3T1G125DBVRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in precision analog and low-power digital solutions.

The 74CB3T1G125DBVRG4 belongs to TI's CB3T family of FET bus switches, designed specifically for low-latency, low-power voltage-domain bridging in portable, industrial, and communications equipment where mixed-voltage interoperability and power-aware isolation are essential.

FAQ

What is the maximum allowable VI/O voltage for 74CB3T1G125DBVRG4 when VCC = 0 V?

The 74CB3T1G125DBVRG4 supports VI/O voltages from –0.5 V to 7 V under absolute maximum ratings, and its 5-V-tolerant I/O structure remains functional even with VCC = 0 V. Per datasheet Section 6.1, VI/O can safely reach 5.5 V in this condition, enabling true hot-swap capability without risk of damage or backfeed current-verified by Ioff ≤ 10 µA at VCC = 0 V and VI/O = 5.5 V.

Does 74CB3T1G125DBVRG4 require external pull-up resistors on the OE pin?

Yes-TI recommends tying OE to VCC through a pull-up resistor during power-up/down to ensure high-impedance state. The minimum resistor value depends on the driver's current-sinking capability; for standard CMOS drivers, 10 kΩ is typical. This prevents undefined switch states that could cause bus contention or excessive current draw before system initialization completes.

Can 74CB3T1G125DBVRG4 translate 1.8-V signals to 3.3-V levels?

No-the 74CB3T1G125DBVRG4 performs level translation *downward* only: inputs up to 5.5 V are translated to approximately VCC (2.3–3.6 V). It does not boost 1.8-V signals to 3.3-V; VOH tracks VCC, so with VCC = 3.3 V, VOH ≈ 3.3 V only when VI ≥ VCC – 1 V. For upward translation, a dedicated level shifter like TXB0108 is required.

What is the thermal resistance (θJA) of the 74CB3T1G125DBVRG4 in its SOT-23 (DBV) package?

The 74CB3T1G125DBVRG4 in SOT-23 (DBV) package has a junction-to-ambient thermal resistance (θJA) of 206 °C/W, as specified in the Absolute Maximum Ratings table. This value assumes standard JEDEC test board conditions (2S2P layout); actual PCB layout with copper pour or thermal vias can reduce effective θJA by 30–50%.

How does the 74CB3T1G125DBVRG4 handle undershoot transients on its I/O pins?

The 74CB3T1G125DBVRG4 integrates internal undershoot clamp diodes on all data and control I/Os, limiting negative excursions to –1.2 V (VIK) at –18 mA. This protects downstream logic from sub-ground transients caused by transmission-line reflections or inductive switching-eliminating need for external Schottky clamps in most USB or I²C applications.

74CB3T1G125DBVRG4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CB
Package/Case:
SC-74A, SOT-753
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Type:
Bus Switch
Circuit:
1 x 1:1
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-23-5

74CB3T1G125DBVRG4 FAQ

1.How can I place an order for 74CB3T1G125DBVRG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CB3T1G125DBVRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CB3T1G125DBVRG4 reliable?

The price and inventory of 74CB3T1G125DBVRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CB3T1G125DBVRG4 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CB3T1G125DBVRG4 transactions.

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74CB3T1G125DBVRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CB3T1G125DBVRG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CB3T1G125DBVRG4?

For technical support, including 74CB3T1G125DBVRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CB3T1G125DBVRG4 requirements.

6.How does Aetrix verify that 74CB3T1G125DBVRG4 is sourced from the original manufacturer or authorized distributors?

All 74CB3T1G125DBVRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CB3T1G125DBVRG4 meets industry standards.

7.What is the process for return or replacement of 74CB3T1G125DBVRG4?

All 74CB3T1G125DBVRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CB3T1G125DBVRG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CB3T1G125DBVRG4 part is unused and in its original packaging.

Return procedure for 74CB3T1G125DBVRG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74CB3T1G125DBVRG4 Tags

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