Texas Instruments 74CB3T3306DCURE4
- Part No.:
- 74CB3T3306DCURE4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 8-VFSOP (0.091", 2.30mm Width)
- Datasheet:
-
74CB3T3306DCURE4.pdf
- Description:
- IC BUS SWITCH 1 X 1:1 8VSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,375
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Product details
Overview
74CB3T3306DCURE4 from Texas Instruments is a dual 1-bit FET bus switch optimized for mixed-mode voltage translation and bidirectional signal isolation in 2.5-V/3.3-V systems. It features 5-Ω typical ON-state resistance, 4.5-pF OFF-state I/O capacitance, 0.25-ns propagation delay at 3.3 V, 5-V tolerant I/Os, and Ioff support for partial-power-down operation - enabling use in USB interface level shifting between 5-V controllers and 3.3-V peripherals.
For engineers reviewing the 74CB3T3306DCURE4 datasheet, 74CB3T3306DCURE4 pinout, 74CB3T3306DCURE4 application, or 74CB3T3306DCURE4 equivalent, key selection criteria include its VCC range (2.3 V to 3.6 V), bidirectional zero-propagation-delay switching, 5-V tolerance with device powered up or down, and compatibility with TTL/CMOS control inputs across mixed-voltage domains.
Technical Context
The 74CB3T3306DCURE4 implements two independent FET-based transmission gates, each controlled by an active-low enable (1OE, 2OE). Its gate drive architecture ensures VG ≈ VCC + VT when ON and VI > VCC + VT, enabling rail-to-rail output voltage translation that tracks VCC. The device operates without direction control pins, supporting true bidirectional data flow.
It integrates undershoot clamp diodes on all data and control inputs, supports 0–5-V signaling levels (including 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V), and maintains high-impedance isolation during power-up/down via Ioff protection - preventing backflow current when VCC = 0 V while I/Os remain at 0–5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - enables direct integration into 2.5-V and 3.3-V logic domains without external level-shifting circuitry |
| ON-State Resistance (ron) | 5 Ω typical - minimizes voltage drop and power loss under 64-mA channel current, critical for low-noise signal integrity |
| I/O Capacitance (Cio(OFF)) | 4.5 pF typical - reduces capacitive loading on buses, preserving signal edge rates and timing margins |
| Propagation Delay (tpd) | 0.25 ns at 3.3 V - delivers near-zero latency for high-speed data paths such as PCI or memory interleaving |
| 5-V Tolerance | VI/O up to 5.5 V with VCC powered or unpowered - allows safe interfacing of legacy 5-V peripherals to modern low-voltage SoCs |
| Ioff Current | 20 µA maximum at VCC = 0 V - guarantees isolation and prevents backfeed damage during partial power-down sequences |
| ESD Rating | 2000-V HBM, 1000-V CDM - meets industrial-grade robustness requirements without external protection components |
Pinout & Package
VSSOP-8 (DCU) package: 2.30 mm × 2.00 mm body, 0.65-mm lead pitch, 1.3-mm max height, RoHS-compliant NIPDAU/SN lead finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE | Active-low enable for Switch 1 | Drives internal gate control; low = A1↔B1 path enabled; TTL/5-V/3.3-V compatible input |
| 1A / 1B | Bidirectional data terminals for Switch 1 | No direction pin required; signal flows freely between A1 and B1 when 1OE = L |
| GND | Ground reference | Common return for VCC and all I/O; must be low-impedance for noise immunity |
| 2A / 2B | Bidirectional data terminals for Switch 2 | Independent of Switch 1; supports dual 1-bit or single 2-bit bus isolation |
| 2OE | Active-low enable for Switch 2 | Separate control allows asymmetric enable/disable sequencing per channel |
| VCC | Positive supply | Powers internal FET biasing and clamp diodes; bypass capacitor (0.1 µF) required adjacent to pin |
Key Features
| Feature | Design Value |
|---|---|
| Output voltage translation tracking VCC | Enables seamless interoperation between 5-V, 3.3-V, and 2.5-V logic families without external resistors or translators |
| Bidirectional zero-propagation-delay switching | Eliminates direction-control overhead and timing skew in full-duplex or shared-bus applications like USB D+/D− lines |
| 5-V tolerant I/Os with VCC = 0 V | Permits hot-plug capability and safe system-level power sequencing where peripherals power up before host logic |
| Ioff-enabled partial-power-down mode | Prevents destructive back-current flow during sleep states, satisfying IEC 61000-4-2 and JEDEC JESD78 latch-up immunity (>250 mA) |
| Low 4.5-pF OFF-state capacitance | Maintains high-frequency signal integrity on stubbed or branched buses, reducing reflections and crosstalk in compact PCB layouts |
Applications
| PCI Interface Isolation | USB 2.0 D+/D− Level Shifting |
|---|---|
Use Scenario: Isolating 3.3-V PCI slot signals from 5-V legacy add-in cards while maintaining signal integrity and timing compliance. IC Role / Device Role / Timing Role: Dual 1-bit bus switch providing bidirectional, low-latency path control with 5-V tolerant inputs and VCC-referenced outputs. Use Value: Eliminates need for discrete level shifters and pull-up networks, reducing BOM count and board area while meeting PCI SIG timing budgets. |
Use Scenario: Translating 5-V USB host controller D+ and D− lines to 3.3-V microcontroller PHY without signal degradation. IC Role / Device Role / Timing Role: Voltage-tracking FET switch ensuring sub-nanosecond edge preservation and ESD-robust 5-V I/O tolerance. Use Value: Supports full-speed USB 2.0 (12 Mbps) signaling with no added jitter or rise-time penalty, validated per USB-IF electrical specs. |
| Memory Interleaving Control | Low-Power Portable Equipment Bus Switching |
Use Scenario: Dynamically routing address/data lines between two 2.5-V memory banks sharing a 3.3-V processor bus. IC Role / Device Role / Timing Role: Dual-channel ON/OFF gate enabling time-multiplexed access with ron ≤ 5 Ω to minimize voltage droop during burst transfers. Use Value: Reduces dynamic power by 30% versus standard logic buffers due to near-zero static current (ICC ≤ 20 µA) and low ron. |
Use Scenario: Enabling/disabling peripheral interfaces (e.g., SD card, UART) in battery-powered IoT nodes to extend runtime. IC Role / Device Role / Timing Role: Low-leakage bus isolator with Ioff < 20 µA at VCC = 0 V, supporting deep-sleep modes without signal leakage. Use Value: Achieves <1 µA system standby current when unused peripherals are disconnected, verified over –40°C to 85°C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3306DCUR | Lower ron (3 Ω typ), higher ICC (50 µA max), same VCC range and 5-V tolerance | Better for high-speed DDR clock distribution; less suitable for ultra-low-power portable designs | Select when propagation delay and ON-resistance are prioritized over quiescent current |
| 74LVC1G3157GW,125 | Single-channel, 3.3-V only VCC (1.65–5.5 V), no Ioff, 6-Ω ron, 5-V tolerant | Limited to single-bit isolation; lacks partial-power-down safety for multi-rail systems | Choose for cost-sensitive, space-constrained single-line applications without power sequencing requirements |
Compared with SN74CBTLV3306DCUR and 74LVC1G3157GW,125, the 74CB3T3306DCURE4 uniquely balances ultra-low ICC (≤20 µA), robust Ioff protection, and dual-channel flexibility - making it optimal for mixed-voltage embedded systems requiring both performance and power-aware reliability.
Availability
74CB3T3306DCURE4 is available at Aetrix Electronics and suitable for PCI interface isolation, USB 2.0 level shifting, memory interleaving, and low-power portable equipment requiring stable component supply across industrial temperature ranges (–40°C to 85°C).
Supply support for 74CB3T3306DCURE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.
The SN74CB3T3306 product line targets mixed-signal voltage translation and bus isolation in resource-constrained, multi-rail digital systems - emphasizing low power, high speed, and interoperability across legacy and modern logic families.
FAQ
What is the maximum allowable I/O voltage for 74CB3T3306DCURE4 when VCC = 0 V?
The 74CB3T3306DCURE4 supports 5-V tolerant I/Os even when unpowered: VI/O can safely range from –0.5 V to 5.5 V with VCC = 0 V, enabled by integrated clamp diodes and Ioff protection. This allows hot-plug operation and safe power sequencing in multi-rail systems without risk of backfeed current or latch-up.
Does 74CB3T3306DCURE4 require external pull-up resistors on its enable pins?
Yes - to ensure high-impedance state during power-up or power-down, 1OE and 2OE must be tied to VCC via pull-up resistors. TI specifies minimum resistor value based on driver sink capability; typical design uses 10-kΩ to 100-kΩ. Leaving OE floating risks undefined switch states and potential bus contention.
Can 74CB3T3306DCURE4 translate 5-V inputs to 2.5-V outputs?
Yes - with VCC = 2.5 V, the 74CB3T3306DCURE4 translates 5-V inputs down to 2.5-V outputs while maintaining bidirectional operation and 5-V tolerance. Output voltage tracks VCC, so VOH ≈ VCC – 0.2 V under load, validated across –40°C to 85°C per datasheet Figure 9.
What is the thermal resistance (RθJA) of the 74CB3T3306DCURE4 in its VSSOP-8 package?
The 74CB3T3306DCURE4 in VSSOP-8 (DCU) package has RθJA = 209.4°C/W, measured per JEDEC JESD51-2. This value assumes standard 2-layer PCB with 1-in² copper pad; actual junction temperature rise depends on layout, airflow, and power dissipation - peak dissipation is limited to ~150 mW given 150°C max TJ.
How does the 74CB3T3306DCURE4 handle undershoot on data lines?
The 74CB3T3306DCURE4 integrates undershoot clamp diodes on all data and control inputs, sinking up to –50 mA when VI/O < 0 V. This protects downstream logic from negative transients caused by transmission-line reflections or inductive switching, eliminating need for external Schottky clamps in most PCB implementations.
74CB3T3306DCURE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 8-VFSOP (0.091", 2.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSSOP
74CB3T3306DCURE4 FAQ
1.How can I place an order for 74CB3T3306DCURE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CB3T3306DCURE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 74CB3T3306DCURE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CB3T3306DCURE4 is usually 5 days.
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5.How can I obtain technical support or documentation for 74CB3T3306DCURE4?
For technical support, including 74CB3T3306DCURE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CB3T3306DCURE4 requirements.
6.How does Aetrix verify that 74CB3T3306DCURE4 is sourced from the original manufacturer or authorized distributors?
All 74CB3T3306DCURE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CB3T3306DCURE4 meets industry standards.
7.What is the process for return or replacement of 74CB3T3306DCURE4?
All 74CB3T3306DCURE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CB3T3306DCURE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CB3T3306DCURE4 part is unused and in its original packaging.
Return procedure for 74CB3T3306DCURE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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