Texas Instruments 74CB3T3383DBQRE4
- Part No.:
- 74CB3T3383DBQRE4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
74CB3T3383DBQRE4.pdf
- Description:
- IC BUS FET EXCHG SW 5X2:2 24SSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
74CB3T3383DBQRE4 from Texas Instruments is a 10-bit FET bus-exchange switch with bidirectional data flow, 5 Ω typical ON-state resistance, 2.3 V–3.6 V VCC operation, and voltage translation that tracks VCC for mixed-mode signaling. It enables level translation between 0–5 V I/O domains in memory interleaving and bus isolation applications.
For engineers reviewing the 74CB3T3383DBQRE4 datasheet, 74CB3T3383DBQRE4 pinout, 74CB3T3383DBQRE4 application, or 74CB3T3383DBQRE4 equivalent, key selection factors include its 0.15 ns propagation delay at 3.3 V, 8 pF OFF-state I/O capacitance, Ioff partial-power-down support, 5-V-tolerant I/Os, and SSOP-24 package compatibility with legacy 74CBT3383 designs.
Technical Context
The 74CB3T3383DBQRE4 implements a dual 5-bit bus-exchange architecture controlled by BE (bus-enable) and BX (exchange-select) inputs, enabling dynamic reconfiguration of A/B port mappings without direction control logic. Its FET-based switch topology delivers near-zero propagation delay and supports simultaneous 5-V/3.3-V/2.5-V signal domains on all I/Os.
Voltage translation is achieved via VCC-tracking output drive: VOH ≈ VCC when VIH ≥ VCC − 1 V, enabling seamless interfacing across TTL, LVTTL, and CMOS logic families. The device incorporates undershoot clamp diodes on all data/control inputs and meets JESD 17 latch-up (>250 mA) and JESD 22 ESD (2000-V HBM, 1000-V CDM) requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables operation in 2.5-V and 3.3-V systems while maintaining 5-V-tolerant I/Os. |
| ron (Typ) | 5 Ω - Minimizes voltage drop and signal distortion during high-speed switching up to ±128 mA per channel. |
| tpd (Max) | 0.25 ns at 3.3 V - Ensures sub-nanosecond timing integrity for DDR memory bus and high-speed interconnect applications. |
| Cio(OFF) | 8 pF typical - Reduces capacitive loading on driven buses, preserving signal rise/fall times and noise margin. |
| Ioff Support | Yes - Prevents backflow current during partial power-down, enabling safe hot-insertion and system-level power sequencing. |
| Data I/O Voltage Range | 0 V to 5.5 V - Allows direct connection to 5-V, 3.3-V, 2.5-V, 1.8-V, and 1.5-V logic without external level shifters. |
| ESD Rating | 2000-V HBM, 1000-V CDM - Meets industrial-grade robustness requirements for board-level handling and field operation. |
Pinout & Package
74CB3T3383DBQRE4 uses a 24-pin SSOP (Shrink Small-Outline Package) with 0.65 mm lead pitch, 8.2 mm × 3.9 mm body size, and JEDEC MO-153 compliance. Pin 1 is located at top-left corner (quadrant Q1), with GND (Pin 11) and VCC (Pin 12) adjacent for low-inductance decoupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BE (Pin 1) | Bus Enable Input | Active-low global enable: drives all 10 switches into high-Z when high; required pull-up to VCC for power-up safety. |
| BX (Pin 2) | Exchange Select Input | Controls crossbar routing: low = A1↔B1/A2↔B2; high = A1↔B2/A2↔B1 - enables dynamic bus reconfiguration. |
| 1A1–1A2, 2A1–2A2, 3A1–3A2, 4A1–4A2, 5A1–5A2 (Pins 3–4, 6–7, 13–14, 16–17, 19–20) | Port A Data I/Os | Bidirectional channels with 5-V tolerance and undershoot clamping - connect to source-side logic domain. |
| 1B1–1B2, 2B1–2B2, 3B1–3B2, 4B1–4B2, 5B1–5B2 (Pins 5–6, 8–9, 15–16, 18–19, 21–22) | Port B Data I/Os | Bidirectional channels mirroring Port A - connect to sink-side logic domain with independent voltage domain support. |
| GND (Pin 11) | Ground Reference | Primary return path for switch current and control logic - must be low-impedance with local 0.1 µF decoupling. |
| VCC (Pin 12) | Supply Voltage | Power rail defining output voltage translation level - sets VOH ≈ VCC and determines ron and tpd performance. |
Key Features
| Feature | Design Value |
|---|---|
| Voltage Translation Tracking | VOH ≈ VCC when VIH ≥ VCC − 1 V - eliminates need for external level-shifting components in mixed-voltage systems. |
| Bidirectional Zero-Delay Switching | 0.15 ns tpd at 2.5 V - preserves signal integrity in high-speed memory and processor interconnects without added latency. |
| 5-V-Tolerant I/Os | Supports VI/O up to 5.5 V regardless of VCC state - enables direct interface to legacy 5-V peripherals while powered from 2.5/3.3 V rails. |
| Ioff Partial-Power-Down Protection | 10 µA max Ioff at VCC = 0 V - prevents damaging back-current flow during hot-swap or staggered power sequencing. |
| Low Capacitive Loading | 8 pF Cio(OFF) - minimizes bus loading and signal reflection in multi-drop configurations such as address/data multiplexing. |
Applications
| Memory Interleaving | Processor Bus Isolation |
|---|---|
Use Scenario: Dynamically routing address/data lines between two DRAM banks operating at different voltage levels (e.g., 3.3-V controller ↔ 2.5-V SDRAM). IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch enabling real-time bank switching without direction control or timing overhead. Use Value: Eliminates need for dual-supply translators and reduces PCB layer count by supporting full 10-bit parallel transfer with <0.25 ns skew. |
Use Scenario: Isolating CPU local bus from peripheral expansion slots during sleep mode or firmware updates. IC Role / Device Role / Timing Role: High-impedance gate controlled by BE signal, providing clean break-before-make switching with no glitch propagation. Use Value: Achieves 100% signal isolation during power-down (Ioff <10 µA), preventing leakage-induced wake events or bus contention. |
| Multi-Standard Logic Interface | Low-Power Portable I/O Expansion |
Use Scenario: Connecting a 3.3-V microcontroller GPIO bank to mixed-voltage peripherals (5-V sensors, 1.8-V ADCs, 2.5-V FPGAs). IC Role / Device Role / Timing Role: Voltage-translating bus switch allowing single-port access to multiple logic families without software configuration. Use Value: Supports 0–5-V signaling on all I/Os with 5 Ω ron, enabling 128 mA drive capability and <10 mV voltage error at full load. |
Use Scenario: Adding USB or SDIO host functionality to battery-powered handheld devices where quiescent current must remain below 50 µA. IC Role / Device Role / Timing Role: Low-power bus switch with 20 µA max ICC - maintains system sleep current budget while enabling fast wake-on-access. Use Value: Delivers 2.3–3.6 V operation with 8 pF Cio(OFF), reducing dynamic power by >40% versus discrete MOSFET solutions in portable applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3383DBQR | Higher ron (7 Ω typ), no VCC-tracking translation - fixed VOH ≈ VCC − 0.2 V; lacks Ioff support. | Suitable only for same-voltage-domain switching; not recommended for mixed-mode or partial-power-down use cases. | Select only if cost sensitivity outweighs level-translation and power-down safety requirements. |
| 74LVC4052PW | 2-channel analog multiplexer with 50 Ω ron, no 5-V tolerance, no Ioff, and no voltage translation capability. | Limited to low-speed digital or analog signal routing within single supply domain; incompatible with 5-V I/O interfaces. | Use only for non-critical, low-frequency signal selection where 5-V tolerance and sub-ns timing are unnecessary. |
Compared with SN74CBT3383DBQR and 74LVC4052PW, the 74CB3T3383DBQRE4 uniquely combines VCC-tracking level translation, 5-V I/O tolerance, Ioff protection, and sub-0.25 ns propagation delay - making it the only option qualified for mixed-voltage memory interleaving and hot-pluggable bus architectures.
Availability
74CB3T3383DBQRE4 is available at Aetrix Electronics and suitable for memory subsystem design, processor bus isolation, multi-standard logic interfacing, and low-power portable I/O expansion requiring stable component supply and long-term industrial availability.
Supply support for 74CB3T3383DBQRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-performance interface and signal-path components.
The 74CB3T3383DBQRE4 belongs to TI's CB3T advanced bus-switch family, designed specifically for high-speed, low-latency, mixed-voltage system interconnect in computing, communications, and industrial control applications.
FAQ
What is the maximum data rate supported by the 74CB3T3383DBQRE4?
The 74CB3T3383DBQRE4 does not specify a maximum data rate in its datasheet, as it is a passive FET switch without internal clocking. Its 0.15 ns propagation delay and 8 pF OFF-state capacitance enable reliable operation with NRZ signals up to 5+ Gbps in controlled-impedance PCB environments, provided layout minimizes stub length and crosstalk. Signal integrity depends on external termination and trace design rather than device bandwidth limits.
Does the 74CB3T3383DBQRE4 require external pull-up resistors on BE and BX inputs?
Yes - the 74CB3T3383DBQRE4 requires a pull-up resistor on the BE pin to VCC to ensure high-impedance state during power-up or when un-driven; TI recommends ≤10 kΩ for standard CMOS drivers. The BX pin may be tied directly to VCC or GND for static routing, but if driven dynamically, it also benefits from a pull-up/pull-down to prevent floating states that could cause undefined switching behavior in the 74CB3T3383DBQRE4.
Can the 74CB3T3383DBQRE4 translate 5-V inputs to 1.8-V outputs?
No - the 74CB3T3383DBQRE4 translates outputs to approximately VCC level, not to a lower fixed voltage. With VCC = 1.8 V, VOH ≈ 1.8 V only if VIH ≥ 0.8 V (VCC − 1 V), but the device's absolute maximum VCC rating is 3.6 V and minimum is 2.3 V. Therefore, 1.8-V operation is outside specification; the 74CB3T3383DBQRE4 supports 2.3–3.6 V VCC only, limiting output translation to 2.3–3.6 V ranges.
How does the Ioff feature protect the 74CB3T3383DBQRE4 during partial power-down?
The Ioff feature in the 74CB3T3383DBQRE4 disables internal conduction paths when VCC = 0 V, limiting reverse current through I/O pins to ≤10 µA even with 5.5 V applied externally. This prevents back-driving powered-down circuitry, avoids latch-up risk, and ensures safe hot-swap capability - critical when integrating the 74CB3T3383DBQRE4 into modular backplane or field-upgradeable systems.
Is the 74CB3T3383DBQRE4 pin-compatible with earlier SN74CBT3383 variants?
Yes - the 74CB3T3383DBQRE4 shares identical pinout, package footprint (SSOP-24 DBQ), and signal mapping with SN74CBT3383DBQR and SN74CB3T3383DBQR. However, it adds VCC-tracking translation and Ioff support not present in CBT versions, so direct replacement is functionally safe but requires verifying that downstream logic accepts VOH ≈ VCC instead of fixed VOH = VCC − 0.2 V in the older 74CB3T3383DBQRE4 design.
74CB3T3383DBQRE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 24-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SSOP
74CB3T3383DBQRE4 FAQ
1.How can I place an order for 74CB3T3383DBQRE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CB3T3383DBQRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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For technical support, including 74CB3T3383DBQRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CB3T3383DBQRE4 requirements.
6.How does Aetrix verify that 74CB3T3383DBQRE4 is sourced from the original manufacturer or authorized distributors?
All 74CB3T3383DBQRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CB3T3383DBQRE4 meets industry standards.
7.What is the process for return or replacement of 74CB3T3383DBQRE4?
All 74CB3T3383DBQRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CB3T3383DBQRE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CB3T3383DBQRE4 part is unused and in its original packaging.
Return procedure for 74CB3T3383DBQRE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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