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Texas Instruments 74CB3T3383DBQRG4
- Part No.:
- 74CB3T3383DBQRG4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
74CB3T3383DBQRG4.pdf
- Description:
- IC BUS FET EXCHG SW 5X2:2 24SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,926
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Product details
Overview
74CB3T3383DBQRG4 from Texas Instruments is a 10-bit FET bus-exchange switch IC with bidirectional data flow, 5 Ω typical ON-state resistance, 8 pF typical OFF-state I/O capacitance, and VCC-operated voltage translation (2.3 V to 3.6 V). It enables mixed-mode signal interfacing between 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS logic domains in memory interleaving and bus isolation systems.
For engineers reviewing the 74CB3T3383DBQRG4 datasheet, 74CB3T3383DBQRG4 pinout, 74CB3T3383DBQRG4 application, or 74CB3T3383DBQRG4 equivalent, key selection criteria include its 0.15 ns propagation delay at 2.5 V, Ioff partial-power-down support, 5-V-tolerant I/Os, and SSOP-24 package compatibility with legacy board layouts requiring level translation without direction control logic.
Technical Context
The 74CB3T3383DBQRG4 implements a dual 5-bit bus-exchange architecture controlled by BE (bus-enable) and BX (bus-exchange select) inputs, enabling dynamic reconfiguration of A/B port mappings. Its FET-based switch topology provides near-zero propagation delay and rail-to-rail voltage translation that tracks VCC, supporting input signaling from 0 V to 5.5 V while outputting up to ≈VCC − 1 V.
It features integrated undershoot clamp diodes on all data and control inputs, Ioff protection for backflow current suppression during power-down, and latch-up immunity exceeding 250 mA per JESD17. The device operates across −40°C to 85°C with 20 µA max ICC and supports TTL- and CMOS-compatible control drive levels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - defines minimum/maximum supply for guaranteed voltage translation and ON-resistance performance |
| ron (Typical) | 5 Ω - ensures minimal insertion loss and signal integrity in high-speed digital paths up to 100 MHz |
| Cio(OFF) | 8 pF typical - reduces capacitive loading on driven buses, critical for maintaining timing margins in dense PCB layouts |
| tpd (Min) | 0.15 ns at 2.5 V - enables sub-nanosecond switching for time-critical memory and interconnect applications |
| Ioff Support | Yes - prevents damaging current flow when VCC = 0 V, allowing safe hot-insertion and partial-power-down system operation |
| 5-V Tolerance | Yes on all I/Os - permits direct connection to 5-V legacy peripherals without external level-shifting circuitry |
| ESD Rating | 2000-V HBM - meets industrial-grade robustness requirements for handling and board assembly environments |
Pinout & Package
74CB3T3383DBQRG4 uses a 24-pin SSOP (DBQ) package with 0.64 mm pitch, 7.8 mm × 4.4 mm body, and exposed thermal pad not connected internally. Pin numbering follows standard top-view orientation with Pin 1 at bottom-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BE (Pin 1) | Bus Enable Input | Active-low global enable: drives all 10 switches into high-impedance state when high |
| BX (Pin 2) | Bus Exchange Select | Controls internal A↔B mapping: low = A1↔B1/A2↔B2; high = A1↔B2/A2↔B1 |
| 1A1–1A2, 2A1–2A2, 3A1–3A2, 4A1–4A2, 5A1–5A2 (Pins 3–4, 6–7, 9–10, 12–13, 15–16) | Data Port A Terminals | Input/output terminals for first 5-bit channel; bidirectional with no direction pin required |
| 1B1–1B2, 2B1–2B2, 3B1–3B2, 4B1–4B2, 5B1–5B2 (Pins 5, 8, 11, 14, 17–24) | Data Port B Terminals | Input/output terminals for second 5-bit channel; electrically identical to Port A |
| GND (Pin 11) | Ground Reference | Primary return path for all internal logic and switch current; must be low-impedance |
| VCC (Pin 12) | Supply Voltage | Power rail defining output voltage translation level and ON-resistance performance |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode voltage translation | Tracks VCC dynamically - outputs follow VCC − 1 V threshold, enabling seamless interface between 2.5 V, 3.3 V, and 5 V logic families |
| Bidirectional zero-direction-control switching | No dedicated direction pin needed - data flows freely in either direction through low-ron FETs, simplifying PCB routing and firmware logic |
| 5-V-tolerant I/Os with powered-up/down support | Withstands 0–5.5 V signals regardless of VCC state - eliminates need for external clamping or isolation during power sequencing |
| Partial-power-down Ioff protection | Leakage <10 µA when VCC = 0 V - prevents backfeed current from live buses into unpowered subsystems |
| Low capacitive loading | 8 pF Cio(OFF) - minimizes signal distortion and crosstalk in high-density parallel bus implementations |
Applications
| Memory Interleaving | Legacy Peripheral Interface |
|---|---|
Use Scenario: High-speed DDR memory controller routing two independent 5-bit address/data lanes to dual SDRAM banks with staggered access timing. IC Role / Device Role / Timing Role: Bidirectional bus-exchange switch reconfiguring A/B port mappings under BX control to alternate lane assignments without added glue logic. Use Value: Eliminates need for dual 5-bit multiplexers and direction buffers, reducing component count and propagation delay by >0.3 ns per path. |
Use Scenario: Industrial PLC CPU board connecting 3.3-V FPGA I/O to legacy 5-V RS-485 transceivers and optocoupler-isolated inputs. IC Role / Device Role / Timing Role: Level-translating bus switch providing 5-V-tolerant inputs and VCC-referenced outputs while maintaining sub-ns timing alignment. Use Value: Enables direct connection without external resistors or translators, preserving setup/hold timing for 25-MHz control bus operation. |
| Hot-Swappable Module Backplane | Low-Power Portable Data Path |
Use Scenario: Modular test equipment backplane where daughter cards may be inserted/removed while main controller remains powered. IC Role / Device Role / Timing Role: Isolation switch decoupling card-side buses from main backplane using Ioff and BE-controlled high-Z state. Use Value: Prevents bus contention and backfeed damage during insertion; supports full hot-swap compliance without auxiliary power sequencing. |
Use Scenario: Wearable sensor hub aggregating 2.5-V analog front-end, 3.3-V BLE radio, and 1.8-V microcontroller I/O on shared SPI bus. IC Role / Device Role / Timing Role: Voltage-translating bus switch enabling shared clock/data lines across three voltage domains with minimal power overhead. Use Value: Reduces active current to 20 µA max and eliminates level-shifter quiescent draw, extending battery life in always-on monitoring mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus-exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CB3T3383DGVR | Same silicon, TVSOP-24 package (5.0 mm × 4.4 mm); 86°C/W θJA vs 61°C/W for DBQ | Higher thermal resistance limits sustained 128-mA switching in compact enclosures; same electrical specs | Select DGVR for space-constrained designs where footprint reduction outweighs thermal derating needs |
| SN74CB3T3383DWR | Same silicon, SOIC-24 package (15.4 mm × 7.5 mm); 46°C/W θJA; lead-free CU NIPDAU finish | Lower thermal resistance supports higher continuous current; larger footprint eases hand-soldering and probe access | Select DWR for prototyping, industrial control, or applications requiring maximum thermal headroom and mechanical robustness |
Compared with 74CB3T3383DBQRG4, SN74CB3T3383DGVR offers smaller footprint but reduced thermal performance, while SN74CB3T3383DWR provides superior heat dissipation and ease of assembly at the cost of board area - all three share identical switching characteristics, voltage translation behavior, and control logic.
Availability
74CB3T3383DBQRG4 is available at Aetrix Electronics and suitable for memory interleaving, legacy peripheral interface, and hot-swappable module backplane applications requiring stable component supply and long-term obsolescence management.
Supply support for 74CB3T3383DBQRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in industrial, automotive, and communications markets.
The 74CB3T3383DBQRG4 belongs to TI's CB3T family of FET bus switches, engineered specifically for high-speed, low-latency voltage translation and bus isolation in mixed-voltage digital systems.
FAQ
What is the maximum data rate supported by the 74CB3T3383DBQRG4?
The 74CB3T3383DBQRG4 does not specify a maximum data rate in its datasheet, but its 0.15 ns minimum propagation delay at 2.5 V and 5 Ω typical ON-state resistance support reliable operation up to 100 MHz in parallel bus applications. Signal integrity depends on trace length, load capacitance, and termination - design validation is recommended for >50-MHz edge rates.
Does the 74CB3T3383DBQRG4 require external pull-up or pull-down resistors on BE or BX inputs?
Yes - the 74CB3T3383DBQRG4 requires BE to be tied to VCC via a pull-up resistor during power-up/down to ensure high-impedance state; TI recommends minimum resistance based on driver sink capability. BX may float only if unused, but TI advises tying unused control inputs to VCC or GND to prevent metastability and excessive ICC.
Can the 74CB3T3383DBQRG4 translate 1.8-V logic to 3.3-V levels?
No - the 74CB3T3383DBQRG4 translates inputs *down* to VCC-referenced outputs (e.g., 5-V or 3.3-V inputs → ~VCC output), not up. For 1.8-V to 3.3-V level shifting, a dedicated translator like TXB0108 or SN74AVC4T245 is required; this device cannot boost voltage.
Is the 74CB3T3383DBQRG4 pin-compatible with other members of the CB3T family?
Yes - the 74CB3T3383DBQRG4 shares identical pinout and function with SN74CB3T3383DBQR, SN74CB3T3383DGVR, and SN74CB3T3383DWR across all 24 pins. Differences are limited to package type (SSOP vs TVSOP vs SOIC), thermal characteristics, and marking; no PCB redesign is needed for substitution within same package family.
What is the purpose of the undershoot clamp diodes in the 74CB3T3383DBQRG4?
The undershoot clamp diodes on all data and control inputs of the 74CB3T3383DBQRG4 protect against negative transient voltages down to −1.2 V (VIK), preventing latch-up or damage from ESD events or signal reflections in unterminated transmission lines - especially critical in high-speed backplane and cable-connected interfaces.
74CB3T3383DBQRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 24-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus FET Exchange Switch
- Circuit:
- 5 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SSOP
74CB3T3383DBQRG4 FAQ
1.How can I place an order for 74CB3T3383DBQRG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CB3T3383DBQRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74CB3T3383DBQRG4 reliable?
The price and inventory of 74CB3T3383DBQRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CB3T3383DBQRG4 is usually 5 days.
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Once your 74CB3T3383DBQRG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74CB3T3383DBQRG4?
For technical support, including 74CB3T3383DBQRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CB3T3383DBQRG4 requirements.
6.How does Aetrix verify that 74CB3T3383DBQRG4 is sourced from the original manufacturer or authorized distributors?
All 74CB3T3383DBQRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CB3T3383DBQRG4 meets industry standards.
7.What is the process for return or replacement of 74CB3T3383DBQRG4?
All 74CB3T3383DBQRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CB3T3383DBQRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CB3T3383DBQRG4 part is unused and in its original packaging.
Return procedure for 74CB3T3383DBQRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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