Texas Instruments 74CB3T3384DBQRG4
- Part No.:
- 74CB3T3384DBQRG4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 24-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
74CB3T3384DBQRG4.pdf
- Description:
- IC BUS SWITCH 5 X 1:1 24SSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
74CB3T3384DBQRG4 from Texas Instruments is a 10-bit FET bus switch IC with dual 5-bit configurable switching, 5 Ω typical ON-state resistance, 0.15 ns propagation delay at 2.5 V, and 2.3–3.6 V VCC operation. It enables bidirectional voltage-level translation across mixed-mode systems (e.g., 5-V TTL to 3.3-V LVTTL) in memory interleaving and bus isolation applications.
For engineers reviewing the 74CB3T3384DBQRG4 datasheet, 74CB3T3384DBQRG4 pinout, 74CB3T3384DBQRG4 application, or 74CB3T3384DBQRG4 equivalent, key selection criteria include Ioff-enabled partial-power-down support, 5-pF OFF-state I/O capacitance, 5-V-tolerant I/Os with device powered up or down, and SSOP-24 package compatibility for space-constrained PCB layouts.
Technical Context
The 74CB3T3384DBQRG4 implements two independent 5-bit FET bus switches controlled by separate OE inputs (1OE, 2OE), supporting either dual 5-bit or unified 10-bit operation. Its voltage-translation architecture tracks VCC, enabling output levels ≈VCC − 1 V when VIH ≥ VCC − 1 V and ≤5.5 V.
Each switch uses low-threshold FETs with gate drive derived internally from VCC and input signals, delivering near-zero propagation delay and high-impedance isolation during power-up/down. The device meets JESD 17 latch-up immunity (>250 mA) and JESD 22 ESD ratings (2000-V HBM, 1000-V CDM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.3 V to 3.6 V - Enables operation in 2.5-V and 3.3-V system rails without level-shifter biasing. |
| ron (Typ) | 5 Ω - Minimizes voltage drop and signal distortion under 64-mA load, critical for high-speed data integrity. |
| tpd (Max) | 0.25 ns at 3.3 V - Supports sub-nanosecond timing budgets in DDR memory routing and high-frequency bus switching. |
| Cio(OFF) | 5 pF typical - Reduces capacitive loading on driven buses, preserving signal rise/fall times in multi-drop configurations. |
| Ioff | 10 µA at VCC = 0 V - Prevents backflow current during partial power-down, protecting upstream drivers and ensuring system-level fault containment. |
| VI/O Range | 0 V to 5.5 V - Allows direct interfacing with 5-V, 3.3-V, 2.5-V, 1.8-V, and 1.5-V logic families without external translators. |
| ESD Rating | 2000-V HBM, 1000-V CDM - Meets industrial handling requirements and reduces need for external protection circuitry. |
Pinout & Package
74CB3T3384DBQRG4 is packaged in a 24-pin SSOP (DBQ) with 0.65-mm lead pitch, 7.9 mm × 4.5 mm body, and 1.2-mm max height - optimized for automated assembly and thermal performance (θJA = 61°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE | Output-enable control inputs | Active-low enables respective 5-bit switch sections; must be pulled to VCC via resistor during power-up to ensure Hi-Z state. |
| 1A1–1A5, 2A1–2A5 | Switch port A terminals | Input/output nodes connected bidirectionally to B-side when OE is low; support 0–5.5-V signaling regardless of VCC. |
| 1B1–1B5, 2B1–2B5 | Switch port B terminals | Electrically identical to A-side; no directionality - data flows freely between A and B ports when enabled. |
| VCC | Supply rail | Powers internal control logic and defines translation reference; tolerates 2.3–3.6 V only - not 5-V compatible as supply. |
| GND | Ground reference | Common return for all I/O and control paths; required for proper clamp diode operation and Ioff functionality. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode voltage translation | Tracks VCC to deliver output ≈VCC − 1 V, enabling seamless interface between 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS without external bias networks. |
| Bidirectional zero-delay switching | ON-state resistance of 5 Ω and 0.15 ns tpd preserve signal edge fidelity in high-speed memory and address/data bus applications. |
| Ioff partial-power-down protection | Blocks reverse current flow when VCC = 0 V, allowing safe hot-insertion and enabling power-gating strategies in modular systems. |
| 5-V-tolerant I/Os | Supports 0–5.5-V signal swing on all A/B pins regardless of VCC state - eliminates need for external clamping diodes or series resistors. |
| Undershoot clamp diodes | Integrated diodes on data and control inputs limit negative transients to −1.2 V, improving robustness against ESD and crosstalk-induced undershoot. |
Applications
| Memory Interleaving | Bus Isolation |
|---|---|
Use Scenario: Splitting a 10-bit address/data bus across two memory banks operating at different voltage domains (e.g., 3.3-V controller to 2.5-V SDRAM). IC Role / Device Role / Timing Role: Bidirectional bus switch providing voltage-translation and timing-transparent path enable/disable control. Use Value: Eliminates external level shifters while maintaining <0.25 ns propagation delay, reducing BOM count and board area in compact memory subsystems. | Use Scenario: Isolating debug/test interfaces (e.g., JTAG or UART) from main system power domain during firmware updates or field diagnostics. IC Role / Device Role / Timing Role: High-impedance switch enabling clean break between subsystems without signal contention or leakage paths. Use Value: Ioff ensures zero backfeed current when main VCC is off, preventing unintended peripheral activation and simplifying power sequencing. |
| Low-Power Portable Interface | Mixed-Logic System Integration |
Use Scenario: Connecting a 1.8-V sensor interface to a 3.3-V microcontroller in battery-powered IoT edge node. IC Role / Device Role / Timing Role: Voltage-translating bus switch with 40 µA max ICC, minimizing quiescent current impact on battery life. Use Value: Delivers 1.8-V ↔ 3.3-V translation with 5-pF OFF-capacitance, preserving signal integrity while drawing <0.1 mW at 3.3 V. | Use Scenario: Integrating legacy 5-V peripherals (e.g., UART transceivers, GPIO expanders) into modern 2.5-V or 3.3-V SoC-based designs. IC Role / Device Role / Timing Role: 5-V-tolerant bidirectional switch enabling direct connection without pull-up resistors or discrete MOSFET translators. Use Value: Supports 0–5.5-V I/O swing with VCC as low as 2.3 V, eliminating level-shifter ICs and associated layout complexity in heterogeneous logic systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT3384DBQR | Higher VCC range (4.5–5.5 V); no Ioff; 6 Ω ron; 5-V-only operation. | Requires 5-V supply; unsuitable for partial-power-down or mixed-voltage systems with sub-3.3-V rails. | Select when system operates exclusively at 5 V and lowest possible ron is prioritized over power-down safety. |
| SN74LVC1G3157DBVR | Single-pole double-throw (SPDT) analog switch; 3.3-V only; 10 Ω ron; no voltage translation. | Not scalable to 10-bit width; lacks bidirectional translation and 5-V tolerance; limited to single-signal routing. | Choose only for low-pin-count, single-channel signal routing where translation and bus-width are irrelevant. |
Compared with SN74CBT3384DBQR and SN74LVC1G3157DBVR, the 74CB3T3384DBQRG4 uniquely combines 10-bit width, VCC-tracked translation, Ioff protection, and 2.3–3.6-V operation - making it the sole option for compact, mixed-voltage, power-aware bus switching in modern embedded designs.
Availability
74CB3T3384DBQRG4 is available at Aetrix Electronics and suitable for memory subsystems, portable instrumentation, industrial I/O modules, and automotive infotainment interfaces requiring stable component supply and long-term manufacturability.
Supply support for 74CB3T3384DBQRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-reliability interface solutions.
The SN74CB3T series targets low-latency, mixed-voltage digital interconnects - designed specifically for memory expansion, bus arbitration, and power-aware system partitioning in space- and power-constrained applications.
FAQ
What is the maximum data rate supported by the 74CB3T3384DBQRG4?
The 74CB3T3384DBQRG4 does not specify a maximum data rate in its datasheet, but its 0.25 ns maximum propagation delay and 5 pF OFF-state capacitance support signal integrity up to several hundred MHz in well-terminated PCB traces. Actual usable frequency depends on layout, load capacitance, and driver strength - verified in practice for DDR1/DDR2 address/control bus applications.
Can the 74CB3T3384DBQRG4 translate from 3.3 V to 5 V?
No - the 74CB3T3384DBQRG4 performs downward translation only: outputs track VCC or approximate VCC − 1 V, so with VCC = 3.3 V, maximum output is ~2.3 V. It accepts 5-V inputs safely (5-V-tolerant I/Os), but cannot generate 5-V outputs. For 3.3-V-to-5-V translation, a dedicated level shifter like TXS0108E is required.
Is the 74CB3T3384DBQRG4 pin-compatible with other SN74CB3T3384 variants?
Yes - all SN74CB3T3384 variants (e.g., DBQR, DWR, PWR) share identical 24-pin functional pinouts and logic behavior. The 74CB3T3384DBQRG4 uses the SSOP-24 (DBQ) package, matching pin-for-pin with SN74CB3T3384DBQR and SN74CB3T3384DBQR.B, differing only in tape-and-reel packaging and marking suffixes.
Does the 74CB3T3384DBQRG4 require external pull-up resistors on OE pins?
Yes - to guarantee high-impedance state during power-up or power-down, 1OE and 2OE must be tied to VCC through external pull-up resistors. TI recommends minimum values based on driver sink capability; typical values range from 4.7 kΩ to 10 kΩ for standard CMOS drivers.
What is the thermal performance of the 74CB3T3384DBQRG4 in its SSOP package?
The 74CB3T3384DBQRG4 in SSOP-24 (DBQ) package has a junction-to-ambient thermal resistance (θJA) of 61°C/W under JEDEC-standard conditions. At 40 µA max ICC and typical 5 Ω ron, self-heating is negligible (<0.1°C rise) in ambient temperatures up to 85°C, supporting reliable operation in sealed industrial enclosures.
74CB3T3384DBQRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CB
- Package/Case:
- 24-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Type:
- Bus Switch
- Circuit:
- 5 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SSOP
74CB3T3384DBQRG4 FAQ
1.How can I place an order for 74CB3T3384DBQRG4 through Aetrix?
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The price and inventory of 74CB3T3384DBQRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CB3T3384DBQRG4 is usually 5 days.
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For technical support, including 74CB3T3384DBQRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CB3T3384DBQRG4 requirements.
6.How does Aetrix verify that 74CB3T3384DBQRG4 is sourced from the original manufacturer or authorized distributors?
All 74CB3T3384DBQRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CB3T3384DBQRG4 meets industry standards.
7.What is the process for return or replacement of 74CB3T3384DBQRG4?
All 74CB3T3384DBQRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CB3T3384DBQRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CB3T3384DBQRG4 part is unused and in its original packaging.
Return procedure for 74CB3T3384DBQRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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