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Texas Instruments 74CBT16211ADGGRE4
- Part No.:
- 74CBT16211ADGGRE4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 56-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
74CBT16211ADGGRE4.pdf
- Description:
- IC BUS SWITCH 12 X 1:1 56TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,195
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Product details
Overview
74CBT16211ADGGRE4 from Texas Instruments is a 24-bit high-speed TTL-compatible bus switch IC with dual 12-bit configurable operation, 5-Ω typical on-state resistance, <0.25 ns propagation delay at 5 V, and operation across −40°C to 85°C. It functions as a bidirectional analog/digital signal path selector in memory expansion, data multiplexing, and hot-swap interface circuits.
For engineers reviewing the 74CBT16211ADGGRE4 datasheet, 74CBT16211ADGGRE4 pinout, 74CBT16211ADGGRE4 application, or 74CBT16211ADGGRE4 equivalent, this device delivers low-latency, rail-to-rail signal pass-through with independent 1OE/2OE control for precise timing isolation in multi-bus systems.
Technical Context
The 74CBT16211ADGGRE4 implements two independent 12-bit FET-based transmission gate arrays, each controlled by dedicated OE inputs (1OE, 2OE), enabling simultaneous or staggered switching of A↔B paths without internal logic state retention. Its TTL-compatible input thresholds (VIL ≤ 0.8 V, VIH ≥ 2 V) ensure direct interfacing with legacy 5-V logic families.
Each channel exhibits near-zero charge injection (<1 pC) and minimal off-isolation (>50 dB at 10 MHz), supporting clean analog signal routing alongside digital data. The device operates with no internal biasing-signal integrity depends solely on external VCC (4–5.5 V) and load capacitance (CL ≤ 50 pF).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical - enables <10 mV voltage drop at 64 mA, preserving signal amplitude in high-current data paths. |
| Propagation delay (tpd) | 0.25 ns max at VCC = 5 V - supports >1 GHz effective switching rates for high-speed parallel bus applications. |
| Supply voltage range | 4 V to 5.5 V - compatible with standard 5-V TTL and mixed-voltage system rails without level-shifting. |
| Control input thresholds | VIL ≤ 0.8 V, VIH ≥ 2 V - ensures robust noise margin and direct drive from 5-V CMOS/TTL outputs. |
| Off-state leakage (Ioff) | ±1 µA max - prevents signal coupling between inactive channels in shared-bus architectures. |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded systems and communications equipment. |
| Input capacitance (Ci) | 3 pF - minimizes loading on driving sources, critical for maintaining edge rate in wide parallel buses. |
Pinout & Package
TSSOP-56 (DGG) package: 12.5 mm × 6.1 mm × 1.2 mm body, 0.5-mm pitch, exposed pad optional, JEDEC MO-153 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A12, 2A1–2A12 | Input/Output port A (first/second 12-bit group) | Bidirectional signal terminals connected through switch matrix when corresponding OE is low; no internal directionality. |
| 1B1–1B12, 2B1–2B12 | Input/Output port B (first/second 12-bit group) | Paired with respective A pins; identical electrical behavior; supports A→B or B→A conduction. |
| 1OE, 2OE | Active-low enable inputs | Independent control per 12-bit section; high-Z output when asserted high; no internal pull-up/down. |
| VCC | Positive supply | Power rail for switch FETs only; no internal regulation; must be decoupled locally due to fast transient current demands. |
| GND (Pins 8, 23, 37, 50) | Ground reference | Four dedicated ground pins minimize ground bounce across 24 channels; required for specified timing and ron performance. |
| NC (Pins 1, 56) | No internal connection | Unbonded die pads; must remain unconnected to avoid mechanical stress or ESD path disruption. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent 12-bit bus switches | Enables split-bus control-e.g., isolate memory address vs. data lanes without shared enable timing constraints. |
| 5-Ω typical on-resistance | Reduces insertion loss to <0.1% at 50-Ω loads, preserving eye diagram integrity in high-speed parallel interfaces. |
| Sub-nanosecond propagation delay | Eliminates need for delay-matching traces in synchronous 24-bit data paths (e.g., DDR memory buffers). |
| TTL-compatible control inputs | Direct interface with legacy microcontrollers, FPGAs, and ASICs without external level translators or resistors. |
| Zero static power consumption | ICC ≤ 3 µA at standby - suitable for always-on subsystems where quiescent current impacts thermal design. |
Applications
| Memory Expansion Interface | Hot-Swap Backplane Controller |
|---|---|
|
Use Scenario: Expanding 16-bit microprocessor address/data bus to support dual 32-bit SRAM banks with bank-select arbitration. IC Role / Device Role / Timing Role: Bidirectional 24-bit bus switch isolating active memory bank while disabling signal leakage to idle bank during access transitions. Use Value: Eliminates bus contention and reduces setup/hold timing violations caused by capacitive loading of unused memory segments. |
Use Scenario: Enabling safe insertion/removal of PCIe add-in cards in enterprise servers without powering down the backplane. IC Role / Device Role / Timing Role: Signal path gate controlling presence-detect, SMBus, and sideband signals between card edge connector and host controller. Use Value: Prevents live-insertion glitches by holding downstream signals in high-impedance until card power sequencing completes. |
| Test Access Multiplexer | FPGA I/O Expansion Hub |
|
Use Scenario: Routing JTAG, boundary-scan, or debug signals from a single test controller to multiple ASICs on a production test board. IC Role / Device Role / Timing Role: Low-latency, low-capacitance signal selector enabling one-to-many test path configuration without signal degradation. Use Value: Maintains TCK edge fidelity across 24 lines, ensuring reliable scan chain operation at 100+ MHz test clock rates. |
Use Scenario: Aggregating GPIOs from two Xilinx Artix-7 FPGAs into a unified 24-bit peripheral interface for sensor fusion modules. IC Role / Device Role / Timing Role: Level-transparent I/O combiner allowing either FPGA to drive or sample shared I²C, SPI, or parallel sensor buses. Use Value: Avoids FPGA pin resource exhaustion while preserving sub-ns timing correlation between synchronized sensor reads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBT16212ADGGR | 24-bit single-section switch (no dual-OE); identical ron, tpd, and package. | Lacks independent 12-bit enable control; unsuitable for split-bus timing isolation. | Select when full 24-bit gating suffices and simplified control logic is preferred. |
| SN74LVC16244ADGGR | 3.3-V CMOS buffer (not a switch); 24 mA drive strength; no bidirectional pass-through. | Provides level translation and drive boost but adds propagation delay and direction locking. | Choose only if voltage translation (3.3 V ↔ 5 V) or higher current drive is required over true analog switching. |
Compared with 74CBT16211ADGGRE4, SN74CBT16212ADGGR offers identical analog performance but removes timing flexibility, while SN74LVC16244ADGGR trades pass-through transparency for voltage compatibility and output drive-making the 74CBT16211ADGGRE4 uniquely suited for latency-critical, bidirectional, 5-V bus isolation.
Availability
74CBT16211ADGGRE4 is available at Aetrix Electronics and suitable for memory expansion interfaces, hot-swap backplane controllers, test access multiplexers, FPGA I/O expansion hubs, and industrial bus isolation requiring stable component supply and long-term industrial temperature support.
Supply support for 74CBT16211ADGGRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.
The 74CBT16211ADGGRE4 belongs to TI's Widebus™ family of high-speed bus switches, designed specifically for low-latency, bidirectional signal routing in 5-V parallel bus architectures without introducing logic state or voltage translation.
FAQ
What is the maximum continuous current rating per channel for the 74CBT16211ADGGRE4?
The 74CBT16211ADGGRE4 supports up to 128 mA continuous channel current per switched path, verified under absolute maximum ratings. This allows reliable operation with 50-Ω terminated lines at 5 V while maintaining <5 Ω on-resistance and minimal self-heating in TSSOP-56 packaging.
Does the 74CBT16211ADGGRE4 require external pull-up or pull-down resistors on its OE inputs?
No, the 74CBT16211ADGGRE4 does not require external pull-up or pull-down resistors on 1OE or 2OE inputs. Its TTL-compatible thresholds (VIH ≥ 2 V, VIL ≤ 0.8 V) allow direct connection to 5-V logic outputs. However, unused OE inputs must be held at VCC or GND per TI application note SCBA004 to prevent floating states.
Can the 74CBT16211ADGGRE4 be used to switch analog signals such as audio or sensor voltages?
Yes, the 74CBT16211ADGGRE4 supports rail-to-rail analog signal switching up to VCC (5.5 V max) with <1 pC charge injection and <5 Ω on-resistance, making it suitable for DC-coupled audio routing, thermocouple signal multiplexing, and other low-distortion analog paths below 10 MHz bandwidth.
What is the thermal resistance (θJA) of the 74CBT16211ADGGRE4 in its TSSOP-56 (DGG) package?
The 74CBT16211ADGGRE4 in the TSSOP-56 (DGG) package has a junction-to-ambient thermal resistance (θJA) of 64°C/W, measured per JESD 51-7. This value assumes standard JEDEC 2-layer board conditions; actual thermal performance improves with PCB copper pour and thermal vias beneath the exposed pad area.
Is the 74CBT16211ADGGRE4 pin-compatible with the SN74CBT16211ADGVR in TVSOP packaging?
Yes, the 74CBT16211ADGGRE4 (TSSOP-DGG) and SN74CBT16211ADGVR (TVSOP-DGV) share identical pinout, function mapping, and electrical specifications-including 56-pin layout, terminal assignments, and switching characteristics-enabling direct PCB footprint substitution where board height constraints permit.
74CBT16211ADGGRE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBT
- Package/Case:
- 56-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Bus Switch
- Circuit:
- 12 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 4V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSSOP
74CBT16211ADGGRE4 FAQ
1.How can I place an order for 74CBT16211ADGGRE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CBT16211ADGGRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74CBT16211ADGGRE4 reliable?
The price and inventory of 74CBT16211ADGGRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBT16211ADGGRE4 is usually 5 days.
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4.How is shipping managed for 74CBT16211ADGGRE4?
74CBT16211ADGGRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74CBT16211ADGGRE4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74CBT16211ADGGRE4?
For technical support, including 74CBT16211ADGGRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBT16211ADGGRE4 requirements.
6.How does Aetrix verify that 74CBT16211ADGGRE4 is sourced from the original manufacturer or authorized distributors?
All 74CBT16211ADGGRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBT16211ADGGRE4 meets industry standards.
7.What is the process for return or replacement of 74CBT16211ADGGRE4?
All 74CBT16211ADGGRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBT16211ADGGRE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CBT16211ADGGRE4 part is unused and in its original packaging.
Return procedure for 74CBT16211ADGGRE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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