Texas Instruments 74CBT16214CDGGRE4

Overview

74CBT16214CDGGRE4 from Texas Instruments is a 12-bit, 1-of-3 FET bus switch with bidirectional signal routing, 3 Ω typical ON-state resistance, <0.24 ns propagation delay at 4 V, and −2 V undershoot protection on A/B ports. It operates from 4 V to 5.5 V and supports mixed-voltage signaling (0.8 V to 5 V) in PCI interface and bus isolation applications.

For engineers reviewing the 74CBT16214CDGGRE4 datasheet, 74CBT16214CDGGRE4 pinout, 74CBT16214CDGGRE4 application, or 74CBT16214CDGGRE4 equivalent, key selection criteria include Ioff partial-power-down capability, 5.5 pF typical OFF-state B-port capacitance, 3 µA max ICC, TSSOP-56 package compatibility, and 12-channel 1-of-3 multiplexer/demultiplexer logic configuration.

Technical Context

The 74CBT16214CDGGRE4 implements twelve independent 1-of-3 analog switches controlled by three select lines (S0–S2), enabling bidirectional signal flow between A and one of three B-group terminals per channel. Each switch uses low-threshold FETs with active undershoot-protection circuitry that clamps transient excursions down to −2 V while maintaining OFF-state isolation.

It features Ioff functionality for partial-power-down operation, ensuring no backflow current when VCC = 0 V and VI/O up to 5.5 V applied. The device maintains high-impedance isolation during power-up/down when select inputs are pulled to GND, and supports TTL- and CMOS-compatible control inputs across 3.3 V and 5 V logic families.

Key Specifications

Pinout & Package

TSSOP-56 package (DGG), 13.9 mm × 6.1 mm × 1.2 mm body, 0.5 mm pitch, exposed pad not present, moisture sensitivity level 1 (260 °C peak reflow).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBT16214CDGGR, the 74CBT16214CDGGRE4 shares full electrical equivalence but carries TI's legacy "E4" suffix indicating enhanced traceability and extended lifecycle support; versus 74CBTLV16214DGGR, it delivers 5 V tolerance, −2 V transient resilience, and broader voltage interoperability essential for industrial backplane and legacy interface use cases.

Availability

74CBT16214CDGGRE4 is available at Aetrix Electronics and suitable for PCI interface isolation, hot-swap backplane design, multi-voltage signal translation, test equipment signal routing, and industrial bus gating requiring stable component supply and long-term sourcing continuity.

Supply support for 74CBT16214CDGGRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability components.

The 74CBT16214CDGGRE4 belongs to TI's Widebus™ family of high-speed FET bus switches, engineered specifically for low-distortion, bidirectional signal gating in mixed-voltage computing and communications infrastructure.

FAQ

What is the maximum undershoot voltage the 74CBT16214CDGGRE4 can withstand on its A and B ports?

The 74CBT16214CDGGRE4 provides active undershoot protection rated to −2 V on both A and B ports. This is verified under test conditions with VCC = 5.5 V and the switch disabled. The internal protection circuit senses the undershoot event and forces the switch into a guaranteed OFF state to prevent erroneous conduction or latch-up, making it suitable for hot-plug and noisy industrial environments where transients occur.

Does the 74CBT16214CDGGRE4 support partial-power-down operation, and how does it behave when VCC = 0 V?

Yes, the 74CBT16214CDGGRE4 supports partial-power-down via its Ioff feature. When VCC = 0 V and any I/O port is biased between 0 V and 5.5 V, the device limits reverse current to ≤10 µA. This prevents damaging backflow between powered and unpowered sections of a system-critical for modular backplanes and hot-swap architectures. The 74CBT16214CDGGRE4 maintains high-impedance isolation under these conditions without requiring external blocking diodes.

What is the ON-state resistance (ron) specification for the 74CBT16214CDGGRE4, and how does it vary with operating conditions?

The 74CBT16214CDGGRE4 has a typical ON-state resistance of 3 Ω at VCC = 4.5 V, VI = 0 V, and IO = 30 mA. At VCC = 4 V and IO = −15 mA, ron is 8–12 Ω (min–max). The parameter is measured as the voltage drop between A and B terminals divided by channel current, referenced to the lower of the two terminal voltages. This low ron ensures minimal insertion loss and signal attenuation in high-speed digital and analog signal paths.

Can the 74CBT16214CDGGRE4 be used to interface 1.8 V logic with 5 V logic without external level shifters?

Yes, the 74CBT16214CDGGRE4 supports bidirectional 0.8 V to 5 V signaling on its data I/Os while powered from 4 V to 5.5 V. Its FET-based architecture allows pass-through of voltage levels below VCC without translation-enabling direct connection between 1.8 V FPGA I/O and 5 V peripheral buses. Control inputs accept TTL or 3.3/5 V CMOS levels, eliminating the need for discrete level shifters in mixed-voltage system interconnects.

What package type and dimensions does the 74CBT16214CDGGRE4 use, and what are its PCB assembly requirements?

The 74CBT16214CDGGRE4 uses the TSSOP-56 (DGG) package: 13.9 mm × 6.1 mm × 1.2 mm body, 0.5 mm pin pitch, four GND pins for noise control, and MSL Level-1 rating (unlimited floor life at ≤30 °C/60 % RH). Recommended stencil aperture is 0.3 mm × 1.5 mm with trapezoidal walls; land pattern follows IPC-7351 density B. No exposed thermal pad is present, so standard reflow profiles for thin shrink small-outline packages apply.