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Texas Instruments 74CBT16245DGVRG4

Part No.:
74CBT16245DGVRG4
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
48-TFSOP (0.173", 4.40mm Width)
Datasheet:
Aetrix74CBT16245DGVRG4.pdf
Description:
IC BUS SWITCH 8 X 1:1 48TVSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,296

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Product details

Overview

74CBT16245DGVRG4 from Texas Instruments is a 16-bit FET bus switch organized as two independent 8-bit bidirectional switches, featuring 5-Ω typical on-state resistance, TTL-compatible control inputs (VIH = 2 V, VIL = 0.8 V), and operation across –40°C to 85°C. It enables low-latency, high-isolation data routing in memory expansion and peripheral interface applications.

For engineers reviewing the 74CBT16245DGVRG4 datasheet, 74CBT16245DGVRG4 pinout, 74CBT16245DGVRG4 application, or 74CBT16245DGVRG4 equivalent, this device supports high-speed bidirectional switching with sub-nanosecond propagation delay (0.25 ns at VCC = 5 V), minimal channel-to-channel skew, and robust ESD protection (2000-V HBM).

Technical Context

The 74CBT16245DGVRG4 implements dual 8-bit FET-based transmission gates with separate OE controls per bank, enabling independent enable/disable of A↔B paths without internal logic or level translation. Its zero-threshold NMOS pass transistors deliver symmetric conduction and rail-to-rail signal swing.

Each switch operates with no DC bias requirement, supports hot-swap capability via high-impedance isolation when disabled, and maintains latch-up immunity exceeding 100 mA per JESD 78 Class II. The device draws only 3 µA ICC at VCC = 5.5 V with all inputs at valid logic levels.

Key Specifications

Parameter Value and Actual Design Meaning
On-state resistance (ron) 5 Ω typical - ensures <100 mV voltage drop at 64 mA per switch, preserving signal integrity in 3.3 V/5 V systems.
Propagation delay (tpd) 0.25 ns at VCC = 5 V - enables timing-critical interconnects such as CPU-to-SRAM or FPGA-to-ASIC data buses.
Supply voltage range 4 V to 5.5 V - compatible with standard 5 V TTL and mixed-voltage 3.3 V–5 V board designs using level-shifting interfaces.
Input clamp current –50 mA - protects against negative transients during hot insertion or bus contention without external diodes.
ESD rating (HBM) 2000 V - exceeds JEDEC JESD22-A114A, reducing need for external ESD protection on I/O lines.
Operating temperature –40°C to 85°C - qualified for industrial-grade embedded control, test equipment, and communications infrastructure.

Pinout & Package

74CBT16245DGVRG4 is housed in a 48-pin TVSOP (DGV) package, 3.6 mm × 12.5 mm footprint, 1.2 mm max height, JEDEC MO-153 compliant, with 0.4 mm pitch and Q1 pin-1 quadrant orientation in tape.

Pin/Terminal Circuit Role Design Meaning
1OE, 2OE Output-enable control inputs Active-low enables respective 8-bit switch banks; high disables both ports into high-Z state with <4.5 pF off-capacitance.
1A1–1A8, 2A1–2A8 Port A terminals (Bank 1 & 2) Unidirectional input/output nodes tied directly to NMOS gate; support bidirectional signal flow when OE is low.
1B1–1B8, 2B1–2B8 Port B terminals (Bank 1 & 2) Electrically identical to Port A; no directionality-signal path determined solely by OE state and external drive.
VCC (Pins 7, 20, 29, 42) Power supply Four dedicated VCC pins reduce IR drop and improve noise immunity; must be decoupled locally with 0.1 µF ceramic capacitors.
GND (Pins 4, 11, 24, 31, 38) Ground reference Five GND pins provide low-inductance return paths; critical for maintaining <0.25 ns tpd and minimizing crosstalk between banks.
NC (Pins 1, 48) No internal connection Unbonded pads-must remain unconnected; no routing or thermal relief required.

Key Features

Feature Design Value
5-Ω low on-resistance Minimizes RC delay and voltage droop in high-speed parallel buses, supporting >100 MHz data rates without signal degradation.
TTL-compatible control inputs Accepts standard 5 V TTL logic thresholds (VIH ≥ 2 V, VIL ≤ 0.8 V), eliminating need for level shifters in legacy microcontroller or ASIC interfaces.
Independent dual-bank OE control Enables selective isolation of memory-mapped peripherals or multi-drop bus segments without affecting adjacent data lanes.
Latch-up immunity >100 mA Guarantees robust operation under transient overvoltage or ground bounce conditions per JESD 78 Class II compliance.
2000-V HBM ESD protection Reduces field failure risk in manufacturing handling and system-level ESD events, lowering qualification testing burden.

Applications

Memory Expansion Interface Peripheral Multiplexing

Use Scenario: Expanding address/data bus width between a microcontroller and external SRAM or Flash memory.

IC Role / Device Role / Timing Role: Bidirectional bus switch isolating memory subsystem during idle cycles while passing read/write signals with sub-ns delay.

Use Value: Enables seamless 16-bit data transfer without wait states or bus contention, preserving system timing margins.

Use Scenario: Sharing a single UART or SPI controller among multiple sensors or modems via time-division multiplexing.

IC Role / Device Role / Timing Role: Signal path selector that routes TX/RX or MOSI/MISO lines to one active peripheral at a time.

Use Value: Eliminates need for discrete analog switches or complex CPLD logic, reducing BOM count and PCB area.

FPGA I/O Expansion Legacy Bus Isolation

Use Scenario: Extending limited FPGA I/O pins to drive multiple 16-bit parallel displays or ADC/DAC arrays.

IC Role / Device Role / Timing Role: Low-latency, high-Z isolation switch allowing FPGA to dynamically reassign I/O resources across subsystems.

Use Value: Maintains signal fidelity up to 100 MHz while preventing back-driving between unselected devices.

Use Scenario: Isolating obsolete ISA or PCI bus segments from modern host controllers during system upgrades.

IC Role / Device Role / Timing Role: Hot-plug-capable bus barrier that blocks leakage current and noise coupling between legacy and new domains.

Use Value: Prevents ground loop interference and ensures clean power domain separation without galvanic isolation components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBT16245DGGR Same electrical specs and pinout; TSSOP-48 (DGG) package with 1.2 mm height and 0.5 mm pitch. Higher thermal resistance (θJA = 70°C/W vs. 58°C/W), limiting use in high-density, thermally constrained layouts. Select when board stack height allows taller profile or when DGG is preferred for existing assembly line compatibility.
SN74CBT16245DLR Identical functionality; SSOP-48 (DL) package with 1.98 mm height, 0.635 mm pitch, and tube/reel options. Lower pin density and larger footprint; less suitable for space-constrained portable or modular designs. Choose for cost-sensitive industrial boards where layout area is available and thermal performance is secondary.

Compared with SN74CBT16245DGGR and SN74CBT16245DLR, the 74CBT16245DGVRG4 offers the lowest profile (1.2 mm max) and best thermal performance (θJA = 58°C/W), making it optimal for compact, high-reliability embedded systems requiring minimal board real estate and stable junction temperature.

Availability

74CBT16245DGVRG4 is available at Aetrix Electronics and suitable for memory expansion interfaces, peripheral multiplexing, FPGA I/O extension, and legacy bus isolation requiring stable component supply and long-term industrial availability.

Supply support for 74CBT16245DGVRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on reliability, scalability, and broad design support.

The 74CBT16245DGVRG4 belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, low-power, and high-isolation signal routing in industrial computing and communications infrastructure.

FAQ

What is the maximum operating frequency supported by the 74CBT16245DGVRG4?

The 74CBT16245DGVRG4 does not specify a maximum clock frequency but supports data rates up to 100 MHz in practice due to its 0.25 ns propagation delay and 5-Ω on-resistance. Signal integrity depends on load capacitance and PCB layout; for 50 pF loads, rise/fall times remain below 1 ns, enabling reliable operation in high-speed parallel bus applications.

Does the 74CBT16245DGVRG4 require external pull-up or pull-down resistors on its control inputs?

No, the 74CBT16245DGVRG4 does not require external pull-up or pull-down resistors on OE inputs because its TTL-compatible inputs have defined VIH (≥2 V) and VIL (≤0.8 V) thresholds. However, TI recommends tying unused OE inputs to VCC or GND to prevent floating states that could cause unintended switching or increased ICC.

Can the 74CBT16245DGVRG4 operate with a 3.3 V supply?

No-the 74CBT16245DGVRG4 has a minimum recommended VCC of 4 V and absolute maximum of 7 V; operation at 3.3 V falls outside its specified operating range and may result in undefined on-resistance, increased propagation delay, or failure to meet VIH/VIL thresholds. Use TI's SN74CBTD16211 or similar 3.3 V–compatible bus switches instead.

How many 74CBT16245DGVRG4 devices can be cascaded on a single bus without signal degradation?

Cascading multiple 74CBT16245DGVRG4 devices introduces cumulative on-resistance and capacitance. With 5 Ω per switch and ~4.5 pF off-capacitance, more than two stages in series typically exceed timing budgets for >50 MHz operation. For multi-stage routing, TI recommends using a single device with sufficient channel count or evaluating active repeaters.

Is the 74CBT16245DGVRG4 RoHS compliant and lead-free?

Yes-the 74CBT16245DGVRG4 carries NIPDAU (nickel-palladium-gold) lead finish and is RoHS compliant per TI's packaging addendum. It meets JEDEC MSL Level-1 (260°C peak reflow) and is rated for industrial temperature range (–40°C to 85°C), with full traceability and documentation available through TI's official product page.

74CBT16245DGVRG4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBT
Package/Case:
48-TFSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Type:
Bus Switch
Circuit:
8 x 1:1
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
4V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TVSOP

74CBT16245DGVRG4 FAQ

1.How can I place an order for 74CBT16245DGVRG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBT16245DGVRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CBT16245DGVRG4 reliable?

The price and inventory of 74CBT16245DGVRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBT16245DGVRG4 is usually 5 days.

3.What payment methods are accepted for 74CBT16245DGVRG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBT16245DGVRG4 transactions.

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74CBT16245DGVRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CBT16245DGVRG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBT16245DGVRG4?

For technical support, including 74CBT16245DGVRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBT16245DGVRG4 requirements.

6.How does Aetrix verify that 74CBT16245DGVRG4 is sourced from the original manufacturer or authorized distributors?

All 74CBT16245DGVRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBT16245DGVRG4 meets industry standards.

7.What is the process for return or replacement of 74CBT16245DGVRG4?

All 74CBT16245DGVRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBT16245DGVRG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBT16245DGVRG4 part is unused and in its original packaging.

Return procedure for 74CBT16245DGVRG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74CBT16245DGVRG4 Tags

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