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Texas Instruments 74CBTD16211DGGRG4

Part No.:
74CBTD16211DGGRG4
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
Aetrix74CBTD16211DGGRG4.pdf
Description:
IC BUS SWITCH 12 X 1:1 56TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,913

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Product details

Overview

74CBTD16211DGGRG4 from Texas Instruments is a 24-bit FET bus switch with integrated level shifting, designed for bidirectional 5-V-to-3.3-V signal translation between TTL-compatible buses. It features dual 12-bit independent channels, 5 Ω typical on-state resistance, sub-nanosecond propagation delay (0.25 ns), and operates across –40°C to 85°C. It serves in high-speed memory and peripheral interconnects where voltage domain bridging is required.

For engineers reviewing the 74CBTD16211DGGRG4 datasheet, 74CBTD16211DGGRG4 pinout, 74CBTD16211DGGRG4 application, or 74CBTD16211DGGRG4 equivalent, key selection criteria include its dual OE-controlled 12-bit switching architecture, guaranteed 5 Ω ron at 4.5 V VCC, level-shifting diode integration, and TSSOP-56 package compatibility with high-density PCB layouts.

Technical Context

The 74CBTD16211DGGRG4 implements two independent 12-bit FET-based transmission gates, each controlled by a dedicated output-enable (OE) input. Its internal diode-to-VCC structure enables passive level shifting from 5-V inputs to 3.3-V outputs without external components.

It operates strictly as a passive analog switch - no internal logic, latching, or direction control - with rail-to-rail signal pass-through when enabled and true high-impedance isolation when disabled. Propagation delay is governed by the RC time constant of ron (~5 Ω) and load capacitance (50 pF typical), yielding ≤0.25 ns tpd.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL systems and stable operation under supply variation.
On-State Resistance (ron)5 Ω typical at VCC = 4.5 V - minimizes voltage drop and signal distortion for 128 mA max channel current.
Propagation Delay (tpd)0.25 ns max (CL = 50 pF) - supports >1 GHz signal bandwidth in point-to-point or stubbed bus topologies.
Enable/Disable Time (ten/tdis)1.5 ns to 9.8 ns - ensures fast, glitch-free bus arbitration in multiplexed memory or I/O expansion paths.
Input Voltage Range (VI)–0.5 V to 7 V - accommodates overvoltage transients and mixed-voltage interface margins without damage.
Operating Temperature–40°C to +85°C - qualified for industrial-grade embedded systems including communications infrastructure and industrial controllers.

Pinout & Package

TSSOP-56 (DGG) package: 12.0 mm × 6.1 mm × 1.2 mm body, 0.5 mm pitch, lead-free CU-NiPdAu finish, JEDEC MO-153 compliant, moisture sensitivity level 1 (260°C peak reflow).

Pin/TerminalCircuit RoleDesign Meaning
1A1–1A12, 2A1–2A12Channel A-side inputs/outputsFirst and second 12-bit data ports - bidirectional, no polarity constraint; connect to source-side 5-V logic.
1B1–1B12, 2B1–2B12Channel B-side inputs/outputsCorresponding 12-bit sink-side ports - receive level-shifted 3.3-V signals; electrically isolated from A-side when OE high.
1OE, 2OEIndependent channel enableActive-low controls - each enables/disables its associated 12-bit path; allows asymmetric bus gating for power-aware partitioning.
VCCSupply reference5-V rail powering internal diodes and switch bias - sets output high-level ceiling and defines ron performance.
GND (Pins 8, 23, 39, 54)Ground referenceFour dedicated ground pins minimize ground bounce and ensure stable return paths for all 24 channels.
NC (Pins 1, 56)No internal connectionUnbonded pads - must remain unconnected; no routing or thermal relief required.

Key Features

FeatureDesign Value
Dual independent 12-bit bus switchesEnables flexible system partitioning - e.g., one channel for address/data separation, second for control/status lines - without cross-talk or shared timing constraints.
Integrated level-shifting diodesEliminates need for external clamping diodes or resistive dividers when interfacing 5-V microcontrollers to 3.3-V FPGAs or memory devices.
5 Ω typical on-resistancePreserves signal integrity for fast edges (≤1 ns rise/fall) and reduces insertion loss in high-frequency parallel buses up to 200 MHz.
Sub-nanosecond propagation delaySupports timing-critical applications such as synchronous SRAM interfaces and legacy PCI-X sideband signal routing.
TTL-compatible control inputsAccepts standard 0.8 V / 2.0 V logic thresholds - simplifies direct connection to 5-V CPLDs, microcontrollers, and ASICs without level translators on OE lines.

Applications

Memory InterfacingPeripheral Expansion

Use Scenario: Connecting a 5-V microcontroller to 3.3-V SRAM or Flash memory with parallel address/data bus.

IC Role / Device Role / Timing Role: Bidirectional level-shifting bus switch enabling clean 5-V→3.3-V and 3.3-V→5-V signal translation without timing skew or voltage contention.

Use Value: Eliminates discrete resistor-divider networks or active translators, reducing BOM count and board area while maintaining <0.25 ns tpd for tight setup/hold timing.

Use Scenario: Adding legacy ISA or LPC peripherals to a modern 3.3-V SoC platform via a 5-V bridge chip.

IC Role / Device Role / Timing Role: Isolating and translating control, address, and data lines between mismatched voltage domains during hot-plug or power sequencing events.

Use Value: Prevents back-powering of 3.3-V rails through I/O pins and guarantees high-Z isolation when OE is deasserted - critical for safe peripheral enumeration.

FPGA I/O BridgingIndustrial Backplane Interconnect

Use Scenario: Routing configuration or status signals between a 5-V FPGA configuration PROM and a 3.3-V FPGA core bank.

IC Role / Device Role / Timing Role: Low-latency, low-capacitance signal conduit supporting JTAG, SPI, or I²C clock/data pairs across voltage boundaries.

Use Value: Maintains signal fidelity at >25 MHz clock rates due to 5.5 pF Cio(OFF) and 3 pF Ci, minimizing jitter and reflection-induced bit errors.

Use Scenario: Interfacing legacy 5-V sensor modules or actuator drivers to a 3.3-V industrial PLC mainboard over a shared backplane bus.

IC Role / Device Role / Timing Role: Robust, ESD-tolerant (±15 kV HBM per TI spec) bus gate that withstands noisy industrial environments while preserving signal edge rates.

Use Value: Withstands –0.5 V to 7 V input transients and delivers 128 mA continuous channel current - suitable for driving optocoupler inputs or LED indicators directly.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET bus switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74CBT16212DGGR16-bit (not 24-bit); identical ron, tpd, and level-shifting capability; same TSSOP-56 footprint but fewer channels.Suitable only for narrower data paths; requires two devices for full 24-bit coverage - increases layout area and supply current.Select when 16-bit width suffices and channel count reduction lowers cost or simplifies routing.
SN74LVC16245ADGGR3.3-V CMOS transceiver with direction control; no built-in level shifting; requires external 5-V pull-ups or separate translator for 5-V interface.Provides directionality and 3-state control but adds complexity for level translation; higher static current (1.5 mA vs. 1.5 mA ICC, but ∆ICC adds 2.5 mA per active input).Choose when bidirectional flow control is needed and 5-V compatibility can be managed externally - not a drop-in replacement.

Compared with SN74CBT16212DGGR and SN74LVC16245ADGGR, the 74CBTD16211DGGRG4 uniquely delivers native 24-bit width with integrated 5-V-to-3.3-V translation in a single TSSOP-56 device, eliminating channel splitting or external diode networks required by alternatives.

Availability

74CBTD16211DGGRG4 is available at Aetrix Electronics and suitable for industrial control systems, FPGA-based prototyping platforms, and legacy-to-modern bus bridging applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for 74CBTD16211DGGRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed logic and interface solutions.

The SN74CBTD16211 belongs to TI's Widebus™ family of FET bus switches, engineered specifically for low-latency, low-distortion voltage-domain bridging in memory subsystems, backplane interconnects, and mixed-voltage digital systems.

FAQ

What is the maximum continuous current per channel for the 74CBTD16211DGGRG4?

The 74CBTD16211DGGRG4 supports a maximum continuous channel current of 128 mA per switched path. This rating is specified under absolute maximum conditions and ensures reliable conduction without thermal runaway when operated within the recommended VCC range (4.5 V to 5.5 V) and ambient temperature limits (–40°C to 85°C). Exceeding this current may degrade ron stability or accelerate wear-out.

Does the 74CBTD16211DGGRG4 require external pull-up resistors for level shifting?

No, the 74CBTD16211DGGRG4 does not require external pull-up resistors for level shifting. It integrates internal diodes to VCC that enable passive 5-V-to-3.3-V translation on the B-side outputs. When a 5-V signal is applied to an A-pin, the diode clamps the B-pin to approximately VCC – 0.7 V (≈4.3 V), and with appropriate loading, the output settles near 3.3 V - confirmed in TI's application notes for this device family.

Can the 74CBTD16211DGGRG4 be used in a 3.3-V-only system?

No - the 74CBTD16211DGGRG4 requires a 5-V VCC supply (4.5 V to 5.5 V) to function correctly. Its internal level-shifting diodes and FET biasing depend on this rail. Operating it at 3.3 V will result in undefined ron, failure to enable switching, and potential violation of input voltage thresholds. For 3.3-V-only systems, consider TI's LVC-series transceivers instead.

How many ground pins does the 74CBTD16211DGGRG4 have, and why are they distributed?

The 74CBTD16211DGGRG4 has four dedicated ground pins (Pins 8, 23, 39, and 54) placed symmetrically across the TSSOP-56 package. This distribution minimizes ground loop inductance and voltage bounce across the 24-channel array, ensuring consistent ron and timing behavior - especially critical for simultaneous switching of multiple bits in memory or data bus applications.

Is the 74CBTD16211DGGRG4 pin-compatible with other members of the SN74CBTD16xxx family?

Yes - the 74CBTD16211DGGRG4 shares the same TSSOP-56 (DGG) pinout and electrical characteristics with SN74CBTD16210 and SN74CBTD16212 in the same package variant. However, functional differences exist: the 16210 is a 20-bit switch, and the 16212 is a 16-bit switch with identical OE architecture. Pin compatibility enables footprint reuse but requires verification of channel count and OE mapping in the target design.

74CBTD16211DGGRG4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74CBTD
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Type:
Bus Switch
Circuit:
12 x 1:1
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

74CBTD16211DGGRG4 FAQ

1.How can I place an order for 74CBTD16211DGGRG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBTD16211DGGRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 74CBTD16211DGGRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTD16211DGGRG4 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBTD16211DGGRG4?

For technical support, including 74CBTD16211DGGRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTD16211DGGRG4 requirements.

6.How does Aetrix verify that 74CBTD16211DGGRG4 is sourced from the original manufacturer or authorized distributors?

All 74CBTD16211DGGRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTD16211DGGRG4 meets industry standards.

7.What is the process for return or replacement of 74CBTD16211DGGRG4?

All 74CBTD16211DGGRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTD16211DGGRG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBTD16211DGGRG4 part is unused and in its original packaging.

Return procedure for 74CBTD16211DGGRG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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