Texas Instruments 74CBTD3384CDGVRG4

Overview

74CBTD3384CDGVRG4 from Texas Instruments is a 10-bit TTL-compatible FET bus switch with dual 5-bit sections, 3 Ω typical ON-state resistance, −2 V undershoot protection on A/B ports, and integrated VCC-level-shifting diode enabling 5-V-to-3.3-V bidirectional translation. It supports memory interleaving and bus isolation in industrial control backplanes.

For engineers reviewing the 74CBTD3384CDGVRG4 datasheet, 74CBTD3384CDGVRG4 pinout, 74CBTD3384CDGVRG4 application, or 74CBTD3384CDGVRG4 equivalent, key selection criteria include Ioff partial-power-down capability, 0.15 ns propagation delay, 5 pF OFF-state I/O capacitance, and TVSOP-24 package compatibility with high-density PCB layouts.

Technical Context

The device implements two independent 5-bit FET-based bidirectional switches controlled by separate 1OE and 2OE inputs, each enabling near-zero-delay signal pass-through when low. Its internal undershoot-protection circuitry actively monitors A/B port voltages and forces OFF-state retention during −2 V transients.

Level shifting is achieved via an integrated series diode between VCC and the switch core, allowing 5-V inputs to drive 3.3-V logic domains without external components. The Ioff specification ensures <10 µA backflow current when VCC = 0 V, supporting hot-swap and partial-power-down system architectures.

Key Specifications

Pinout & Package

74CBTD3384CDGVRG4 is housed in a 24-pin TVSOP (DGV) package measuring 4.9 mm × 3.9 mm × 1.2 mm, optimized for high-density routing and automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBTD3384CDBR and SN74CBTD3384CDWR, the 74CBTD3384CDGVRG4 offers the smallest PCB footprint (4.9 mm × 3.9 mm) and highest density integration, making it optimal for space-constrained industrial modules where thermal load is moderate and automated assembly is used.

Availability

74CBTD3384CDGVRG4 is available at Aetrix Electronics and suitable for memory interleaving, bus isolation, and hot-swappable module interfaces requiring stable component supply and long-term industrial lifecycle support.

Supply support for 74CBTD3384CDGVRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

The 74CBTD3384CDGVRG4 belongs to TI's CBTD bus switch family, engineered for high-speed, low-distortion signal routing in mixed-voltage digital systems with stringent reliability and power-management requirements.

FAQ

What is the maximum undershoot voltage the 74CBTD3384CDGVRG4 can withstand on its A and B ports?

The 74CBTD3384CDGVRG4 provides active undershoot protection up to −2 V on both A and B ports, as verified in the absolute maximum ratings and undershoot characteristics tables. This protection ensures the switch remains in the correct OFF state during transient negative excursions, preventing false logic transitions and latch-up in industrial backplane and hot-swap applications. The 74CBTD3384CDGVRG4 achieves this via dedicated sensing circuitry that overrides normal enable logic during undershoot events.

Does the 74CBTD3384CDGVRG4 support level shifting between 5-V and 3.3-V logic domains?

Yes, the 74CBTD3384CDGVRG4 integrates a diode in series with VCC to enable bidirectional 5-V-to-3.3-V level shifting without external components. When a 5-V signal drives an A-port pin, the internal diode drops ~0.7 V, resulting in ~4.3 V at the switch core, which is safely interpreted as HIGH by 3.3-V receivers on the B side. The 74CBTD3384CDGVRG4 maintains this behavior across its full 4.5–5.5 V VCC range and supports 0–5.5 V I/O signaling.

What is the ON-state resistance (ron) specification for the 74CBTD3384CDGVRG4, and how does it affect signal integrity?

The 74CBTD3384CDGVRG4 has a typical ON-state resistance of 3 Ω at VCC = 4.5 V, with a maximum of 6 Ω under worst-case conditions. This low ron minimizes voltage drop and power dissipation during high-current bidirectional data flow-critical for maintaining logic thresholds in memory and bus applications. The 74CBTD3384CDGVRG4's ron directly contributes to its 0.15 ns propagation delay and supports ±128 mA per switch, ensuring robust drive capability without signal degradation.

How does the Ioff feature of the 74CBTD3384CDGVRG4 enhance system reliability during partial-power-down?

The Ioff feature of the 74CBTD3384CDGVRG4 limits backflow current to ≤10 µA when VCC = 0 V and I/O pins are biased to 0–5.5 V, preventing damage to unpowered sections and ensuring clean isolation. This enables safe hot-swap operation and modular power sequencing in complex embedded systems. The 74CBTD3384CDGVRG4 meets JESD 78 Class II latch-up immunity, and its Ioff behavior is guaranteed across the full operating temperature range (−40°C to 85°C).

What package type and dimensions does the 74CBTD3384CDGVRG4 use, and what are its assembly implications?

The 74CBTD3384CDGVRG4 uses a 24-pin TVSOP (DGV) package measuring 4.9 mm × 3.9 mm × 1.2 mm with 0.4 mm lead pitch. Its compact size supports high-density PCB layouts, while its Level-1 moisture sensitivity rating allows unlimited floor life before reflow. The 74CBTD3384CDGVRG4 requires standard SnPb- or lead-free reflow profiles and is compatible with IPC-7351 land patterns; stencil design should use 0.125 mm thickness and trapezoidal apertures for optimal paste release.