Texas Instruments 74CBTLV16210DLG4
- Part No.:
- 74CBTLV16210DLG4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 48-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
74CBTLV16210DLG4.pdf
- Description:
- IC BUS SWITCH 10 X 1:1 48SSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,236
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74CBTLV16210DLG4 from Texas Instruments is a 20-bit low-voltage bus switch IC with dual 10-bit configurable switching, 5-Ω on-state resistance, rail-to-rail signal handling (2.3 V to 3.6 V), and Ioff partial-power-down support - used for high-speed data path isolation in memory expansion, FPGA I/O bridging, and hot-swap backplane interfaces.
For engineers reviewing the 74CBTLV16210DLG4 datasheet, 74CBTLV16210DLG4 pinout, 74CBTLV16210DLG4 application, or 74CBTLV16210DLG4 equivalent, key selection criteria include guaranteed 5 Ω ron at 3.3 V, sub-1 ns enable/disable timing, 48-pin TSSOP (DGG) package compatibility, and verified Ioff protection under 0-V VCC conditions.
Technical Context
This device implements two independent 10-bit FET-based analog bus switches controlled by separate OE inputs, enabling flexible partitioning of 20-bit data paths. Each switch operates bidirectionally with no internal level-shifting circuitry, supporting true rail-to-rail voltage transfer across A/B ports.
Its Ioff feature actively blocks current backflow when VCC = 0 V, ensuring system-level isolation during partial power-down sequences. The design uses CMOS-compatible control logic with VIH/VIL thresholds scaled to VCC, eliminating need for external level translators in mixed-supply environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 3.3 V - ensures minimal signal attenuation and <0.25 ns propagation delay in 50-pF load systems. |
| Supply voltage range | 2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V logic domains without level shifters. |
| Ioff leakage | 10 µA max at VCC = 0 V - guarantees safe isolation during partial power-down and prevents backdrive damage. |
| Enable/disable time | 1 ns to 7.4 ns - supports high-speed bus arbitration and dynamic reconfiguration in real-time systems. |
| Input capacitance (Ci) | 4.5 pF - minimizes loading on upstream drivers and preserves signal integrity at >100 MHz toggle rates. |
| Package | TSSOP-48 (DGG) - 6.2 mm × 12.6 mm footprint with 0.5 mm pitch, optimized for dense PCB layouts. |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded and communications equipment. |
Pinout & Package
48-pin TSSOP (DGG) package with 0.5 mm pitch, 1.2 mm max height, and JEDEC MO-153 compliance. Pin 1 located in Q1 quadrant per tape-and-reel orientation standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Port A input/output terminals (Group 1 & 2) | Bidirectional analog/data path connections; tolerate rail-to-rail voltages up to VCC. |
| 1B1–1B10, 2B1–2B10 | Port B input/output terminals (Group 1 & 2) | Electrically isolated mirror of Port A; switched connection enabled only when corresponding OE is low. |
| 1OE, 2OE | Output-enable controls (active-low) | Independent gating of each 10-bit switch; OE tied to VCC via pullup ensures Hi-Z during power sequencing. |
| VCC | Positive supply | Single 2.3–3.6 V rail powers all switch FETs and control logic; no separate analog/digital supplies required. |
| GND | Ground reference | Four dedicated ground pins (pins 8, 16, 35, 47) reduce ground bounce and improve noise immunity. |
| NC | No internal connection | Pins 1 and 48 are unconnected - must remain floating or grounded per layout guidelines to avoid parasitic coupling. |
Key Features
| Feature | Design Value |
|---|---|
| 5-Ω low on-resistance | Enables <10 mV voltage drop at 24 mA channel current - critical for maintaining signal fidelity in DDR memory buffers and test access ports. |
| Rail-to-rail analog switching | Supports full 0 V to VCC signal swing without distortion - eliminates need for external biasing in mixed-voltage interconnects. |
| Ioff partial-power-down protection | Prevents >10 µA back-current flow when VCC = 0 - allows safe hot-insertion into live backplanes and modular computing systems. |
| Dual independent 10-bit control | Permits asymmetric bus partitioning (e.g., 8-bit control + 12-bit data) without external logic - reduces BOM count in FPGA configuration interfaces. |
| Sub-1 ns propagation delay | tpd ≤ 0.25 ns at 3.3 V - meets timing closure requirements for >4 Gbps serial sideband signaling in server motherboard designs. |
Applications
| Memory Expansion Interface | FPGA I/O Bridging |
|---|---|
Use Scenario: Expanding DRAM address/data bus between SoC and additional memory modules in industrial controllers. IC Role / Device Role / Timing Role: Bidirectional 20-bit bus switch isolating memory channels during refresh cycles or power-gating events. Use Value: 5-Ω ron maintains signal rise/fall times below 150 ps, preventing setup/hold violations in DDR2/DDR3 interfaces. | Use Scenario: Interfacing heterogeneous FPGA banks operating at different voltage levels (2.5 V and 3.3 V). IC Role / Device Role / Timing Role: Voltage-agnostic signal path controller enabling seamless data exchange without level translators. Use Value: Rail-to-rail operation preserves logic thresholds across both domains, eliminating timing skew from translation delays. |
| Hot-Swap Backplane | Test Access Port (TAP) Multiplexing |
Use Scenario: Enabling safe insertion/removal of line cards in telecom chassis while main backplane remains powered. IC Role / Device Role / Timing Role: Isolation barrier that blocks fault currents during card mating/unmating sequences. Use Value: Ioff protection limits leakage to <10 µA at 0-V VCC, preventing disruption to active modules during hot-swap transitions. | Use Scenario: Sharing JTAG signals among multiple ASICs on a single PCB using boundary-scan test infrastructure. IC Role / Device Role / Timing Role: Low-capacitance (4.5 pF) multiplexer routing TCK/TMS/TDI/TDO between devices on demand. Use Value: Sub-1 ns propagation delay ensures JTAG clock integrity at 25 MHz, meeting IEEE 1149.1 timing compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3861PWR | 32-bit single-switch architecture; 6 Ω ron; 20-pin TSSOP package | Higher channel density but no dual-OE control - less flexible for asymmetric bus partitioning | Select when consolidating multiple 10-bit paths into one compact switch with shared enable. |
| 74LVC1G3157GW,125 | Single-pole double-throw (SPDT) 2-channel switch; 10 Ω ron; 6-pin SOT-363 package | Lower integration (2 bits only); lacks Ioff rating - unsuitable for partial-power-down systems | Choose for point-to-point signal routing where space constraints outweigh isolation requirements. |
Compared with SN74CBTLV3861PWR and 74LVC1G3157GW,125, the 74CBTLV16210DLG4 uniquely delivers dual independent 10-bit control with verified Ioff protection and 5 Ω ron, making it the only option qualified for industrial hot-swap and memory expansion where timing, isolation, and configurability are jointly critical.
Availability
74CBTLV16210DLG4 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, hot-swap backplanes, and JTAG test access port multiplexing requiring stable component supply across extended industrial temperature ranges.
Supply support for 74CBTLV16210DLG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability electronic components.
The 74CBTLV16210DLG4 belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, low-distortion signal routing in memory subsystems and programmable logic interconnects.
FAQ
What is the maximum continuous current rating for each channel of the 74CBTLV16210DLG4?
The 74CBTLV16210DLG4 supports a continuous channel current of 128 mA per switch path, as specified in its absolute maximum ratings. This rating applies across the full operating temperature range (−40°C to +85°C) and ensures reliable conduction without thermal derating under typical 3.3 V supply conditions. Exceeding this current may trigger thermal shutdown or permanent damage.
Does the 74CBTLV16210DLG4 require external pull-up resistors on its OE pins?
Yes - to ensure a defined high-impedance state during power-up or power-down, the 74CBTLV16210DLG4 OE pins must be tied to VCC through external pull-up resistors. The minimum resistor value depends on the current-sinking capability of the driving source; TI recommends verifying driver strength against the 10 µA input leakage spec to avoid false enable states.
Can the 74CBTLV16210DLG4 operate with a 2.5 V supply while interfacing with 3.3 V signals?
No - the 74CBTLV16210DLG4 does not support mixed-voltage operation beyond its supply rail. Its rail-to-rail switching means the maximum allowable signal voltage equals VCC. At 2.5 V supply, input signals must stay within 0 V to 2.5 V; applying 3.3 V signals violates the absolute maximum input voltage rating (−0.5 V to VCC + 0.1 V) and risks latch-up or damage.
Is the 74CBTLV16210DLG4 RoHS compliant and lead-free?
Yes - the 74CBTLV16210DLG4 is RoHS compliant and features NiPdAu (NIPDAU) lead finish, as confirmed in TI's official packaging addendum. It meets JEDEC Level-1 moisture sensitivity standards and is rated for peak reflow temperatures up to 260°C, supporting standard lead-free assembly processes without special handling.
How does the Ioff feature of the 74CBTLV16210DLG4 protect downstream circuitry during partial power-down?
The Ioff feature in the 74CBTLV16210DLG4 disables internal FET conduction paths when VCC = 0 V, limiting leakage current to ≤10 µA even if A/B port voltages reach 3.6 V. This prevents damaging back-current flow into unpowered sections of the system - a critical safeguard in modular systems where boards may be powered independently, such as telecom line cards or server blades.
74CBTLV16210DLG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 48-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-SSOP
74CBTLV16210DLG4 FAQ
1.How can I place an order for 74CBTLV16210DLG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CBTLV16210DLG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74CBTLV16210DLG4 reliable?
The price and inventory of 74CBTLV16210DLG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV16210DLG4 is usually 5 days.
3.What payment methods are accepted for 74CBTLV16210DLG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLV16210DLG4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74CBTLV16210DLG4?
74CBTLV16210DLG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74CBTLV16210DLG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74CBTLV16210DLG4?
For technical support, including 74CBTLV16210DLG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV16210DLG4 requirements.
6.How does Aetrix verify that 74CBTLV16210DLG4 is sourced from the original manufacturer or authorized distributors?
All 74CBTLV16210DLG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV16210DLG4 meets industry standards.
7.What is the process for return or replacement of 74CBTLV16210DLG4?
All 74CBTLV16210DLG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV16210DLG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CBTLV16210DLG4 part is unused and in its original packaging.
Return procedure for 74CBTLV16210DLG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74CBTLV16210DLG4 Tags
-
SN74HC138DR
Texas Instruments

-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage

-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments

-
74CBTLV3257GUX
Nexperia USA Inc.

-
74HC154BQ,118
Nexperia USA Inc.

-
P3S0200GMX
NXP USA Inc.

-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments

-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments

-
SN74HC138N
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

