Texas Instruments 74CBTLV16210GRG4

Overview

74CBTLV16210GRG4 from Texas Instruments is a 20-bit FET bus switch IC with dual 10-bit independent switching channels, 5-Ω typical on-state resistance (ron), rail-to-rail signal switching, and Ioff partial-power-down support. It operates from 2.3 V to 3.6 V and delivers sub-nanosecond propagation delay (0.15 ns typ at 2.5 V), enabling high-speed data path isolation in memory expansion and hot-swap interfaces.

For engineers reviewing the 74CBTLV16210GRG4 datasheet, 74CBTLV16210GRG4 pinout, 74CBTLV16210GRG4 application, or 74CBTLV16210GRG4 equivalent, this device serves as a low-latency, bidirectional bus switch for DDR memory buffering, FPGA I/O expansion, and PCIe lane multiplexing where minimal insertion loss and power-aware isolation are critical.

Technical Context

The 74CBTLV16210GRG4 implements two independent 10-bit NMOS pass-gate arrays controlled by separate OE inputs, supporting either dual 10-bit or single 20-bit switching configurations. Its rail-to-rail operation allows full-swing signal transmission across 0 V to VCC without level translation.

Ioff circuitry actively blocks current backflow when VCC = 0 V, ensuring isolation during partial power-down states. The device uses no internal pullups or level shifters-OE must be externally pulled to VCC via resistor to guarantee high-impedance state during power sequencing.

Key Specifications

Pinout & Package

TSSOP-48 package (DGG) with 0.5 mm pitch, 12.6 mm × 6.2 mm body, JEDEC MO-153 compliant, RoHS/Green (no Sb/Br) finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Compared with SN74CBTLV3861RGYR and 74CBTLV3245PWR, the 74CBTLV16210GRG4 uniquely delivers 20-bit density with dual independent OE control and true rail-to-rail performance under single-supply operation-making it optimal for high-pin-count memory and interconnect isolation where timing, power sequencing, and layout efficiency are co-constrained.

Availability

74CBTLV16210GRG4 is available at Aetrix Electronics and suitable for DDR memory expansion, FPGA I/O multiplexing, PCIe lane sharing, and hot-swap backplane interface designs requiring stable component supply across industrial and telecom production cycles.

Supply support for 74CBTLV16210GRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in high-reliability industrial and communications components.

The 74CBTLV16210GRG4 belongs to TI's Widebus™ family of high-speed CMOS bus switches, engineered specifically for low-latency, low-distortion signal routing in memory, FPGA, and high-speed interconnect applications.

FAQ

What is the maximum operating frequency supported by the 74CBTLV16210GRG4?

The 74CBTLV16210GRG4 does not specify a clock frequency limit because it is an analog pass-gate switch-not a clocked device. Its 0.15 ns typical propagation delay enables reliable operation in parallel buses running up to 500 MHz (2 ns period), provided PCB layout controls impedance and crosstalk. Signal integrity depends on trace length, termination, and load capacitance-not internal clocking.

Can the 74CBTLV16210GRG4 be used for level translation between 1.8 V and 3.3 V domains?

No-the 74CBTLV16210GRG4 is a single-supply rail-to-rail switch and does not perform level translation. It requires VCC to be set to the higher of the two domains (e.g., 3.3 V) and only passes signals within 0 V to VCC. For 1.8 V ↔ 3.3 V translation, use TI's 74CBTLV3245PWR or similar dual-supply bus switch instead.

How should OE pins be biased to ensure proper power-up behavior of the 74CBTLV16210GRG4?

OE pins must be tied to VCC through an external pullup resistor to guarantee high-impedance state at power-up. TI specifies minimum resistor value based on driver sink capability; for standard CMOS drivers, 4.7 kΩ is typical. Leaving OE floating or unconnected risks undefined switching states and potential bus contention during power sequencing.

Is the 74CBTLV16210GRG4 pin-compatible with other packages in the same family?

No-74CBTLV16210GRG4 uses TSSOP-48 (DGG), while SN74CBTLV16210DLR uses SSOP-48 (DL) and SN74CBTLV16210VR uses TVSOP-48 (DGV). Though all have identical pin functions and numbering, their footprints differ: DGG is 12.6 mm × 6.2 mm, DL is 15.8 mm × 7.5 mm, and DGV is 11.4 mm × 6.2 mm. PCB layout is not interchangeable.

Does the 74CBTLV16210GRG4 support hot-swap applications, and what design precautions are required?

Yes-the 74CBTLV16210GRG4 supports hot-swap via its Ioff feature, which limits leakage to 10 µA when VCC = 0 V. To ensure robust operation, connect all unused control inputs to VCC or GND, use local VCC decoupling near the device, and route OE traces with controlled impedance to prevent noise-induced false enable during insertion transients.