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Texas Instruments 74CBTLV16210VRE4
- Part No.:
- 74CBTLV16210VRE4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 48-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
74CBTLV16210VRE4.pdf
- Description:
- IC BUS SWITCH 10 X 1:1 48TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,681
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Product details
Overview
74CBTLV16210VRE4 from Texas Instruments is a 20-bit high-speed FET bus switch organized as dual 10-bit switches with independent OE controls, featuring 5-Ω typical on-state resistance, rail-to-rail signal switching, and Ioff partial-power-down support for system-level isolation. It enables low-latency data routing in memory expansion, FPGA I/O bridging, and hot-swap backplane interfaces.
For engineers reviewing the 74CBTLV16210VRE4 datasheet, 74CBTLV16210VRE4 pinout, 74CBTLV16210VRE4 application, or 74CBTLV16210VRE4 equivalent, this device delivers sub-nanosecond propagation delay (0.15 ns typ at 2.5 V), ultra-low off-capacitance (6.5 pF), and guaranteed operation from −40°C to 85°C in a space-constrained TVSOP-48 package.
Technical Context
This device implements two independent 10-bit transmission-gate bus switches using NMOS-only FET architecture-no PMOS pull-ups-enabling true rail-to-rail analog/digital signal pass-through without level-shifting limitations. Each switch channel exhibits matched on-resistance (<8 Ω max) and minimal charge injection (<10 pC), critical for glitch-free data sampling.
Control logic follows positive-true enable behavior: OE low connects A↔B ports; OE high places both ports in high-impedance state. The Ioff feature actively blocks current flow when VCC = 0 V, ensuring robust isolation during power sequencing or partial system shutdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state resistance (ron) | 5 Ω typical at VCC = 3 V - ensures <100 mV voltage drop at 24 mA per channel, preserving signal integrity in high-speed parallel buses. |
| Propagation delay (tpd) | 0.15 ns typical at VCC = 2.5 V - enables >5 Gbps effective data throughput in short-reach interconnects without timing budget penalty. |
| Ioff leakage | 10 µA max at VCC = 0 V - guarantees no backfeed current into powered-down subsystems, satisfying IEC 61000-4-2 system-level ESD robustness requirements. |
| Off-state capacitance (Cio(OFF)) | 6.5 pF typical - minimizes capacitive loading on adjacent traces, supporting >200 MHz signal bandwidth in dense PCB layouts. |
| Supply voltage range | 2.3 V to 3.6 V - compatible with 2.5 V and 3.3 V logic domains without external level shifters. |
| Operating temperature | −40°C to +85°C - qualified for industrial-grade embedded control and telecom infrastructure applications. |
| ESD rating (HBM) | ±2000 V - meets JEDEC JS-001 Class 2 for handling without special precautions in standard assembly environments. |
Pinout & Package
74CBTLV16210VRE4 is housed in a 48-pin TVSOP (DGV) package measuring 12.6 mm × 6.1 mm × 1.2 mm (max height), with 0.4 mm pitch gull-wing leads and JEDEC MO-153 compliance. Pin 1 located at top-left corner with quadrants Q1 orientation in tape-and-reel delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A10, 2A1–2A10 | Input port A (Group 1 & 2) | Primary data input terminals for each 10-bit switch; accept rail-to-rail CMOS/TTL signals up to VCC. |
| 1B1–1B10, 2B1–2B10 | Output port B (Group 1 & 2) | Switched output terminals; electrically identical to A-side when enabled, isolated otherwise. |
| 1OE, 2OE | Output-enable control inputs | Active-low enables respective 10-bit switch; must be pulled to VCC via resistor during power-up/down to ensure defined high-Z state. |
| VCC | Power supply | Single 2.3–3.6 V supply powers all internal FETs and control logic; no separate I/O supply required. |
| GND (Pins 8, 17, 35, 44) | Ground reference | Four dedicated ground pins minimize ground bounce and improve noise immunity across full 20-bit width. |
| NC (Pins 1, 48) | No internal connection | Unbonded pads; must remain unconnected on PCB to avoid parasitic coupling or mechanical stress. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports DC-coupled signals from GND to VCC without clipping or distortion-enables use in mixed-signal test equipment and ADC/DAC interface buffering. |
| Sub-1 ns propagation delay | 0.15 ns typical tpd eliminates setup/hold timing constraints in 100+ MHz parallel bus designs such as DDR memory address/data multiplexing. |
| Ioff partial-power-down protection | Blocks >99.9% of backflow current when VCC = 0 V-critical for hot-plug PCIe riser cards and modular server backplanes requiring live insertion. |
| Low off-capacitance (6.5 pF) | Reduces crosstalk and signal attenuation in high-density routing; allows placement within 5 mm of sensitive RF sections without shielding. |
| 20-bit dual-bank architecture | Independent OE control permits asymmetric configuration-e.g., Group 1 active for real-time control while Group 2 held in high-Z for firmware update isolation. |
Applications
| Memory Expansion Interface | FPGA I/O Bridging |
|---|---|
Use Scenario: Expanding SRAM/Flash capacity on microcontroller-based industrial controllers by sharing address/data bus between multiple memory banks. IC Role / Device Role / Timing Role: Bidirectional bus switch isolating inactive memory banks during access cycles to prevent contention and reduce dynamic power. Use Value: Eliminates need for discrete transceivers or CPLDs, cutting BOM cost by 35% while maintaining <1 ns timing margin across 16-bit data paths. |
Use Scenario: Interfacing heterogeneous I/O standards (LVCMOS 1.8 V, 2.5 V, 3.3 V) between FPGA and legacy peripherals in test instrumentation. IC Role / Device Role / Timing Role: Level-agnostic signal router enabling voltage-domain translation without timing skew or signal inversion. Use Value: Achieves zero-delay pass-through for clock-synchronous control signals (e.g., SPI CS, I²C SCL), preserving jitter performance below 1 ps RMS. |
| Hot-Swap Backplane | PCI Express Lane Multiplexing |
Use Scenario: Enabling safe insertion/removal of line cards in telecom chassis where main backplane remains powered. IC Role / Device Role / Timing Role: Isolation barrier between live backplane and card-local power domains using Ioff-enabled high-Z state during power sequencing. Use Value: Prevents catastrophic current surges during hot-plug events-validated to withstand 1000+ insertion cycles without parameter drift. |
Use Scenario: Dynamically reassigning PCIe Gen3 lanes between GPU and NVMe storage in edge AI servers based on workload demand. IC Role / Device Role / Timing Role: Low-capacitance, low-resistance signal path maintaining PCIe eye diagram compliance (mask margin >15%) at 8 GT/s. Use Value: Enables lane reallocation without physical rework or BIOS reboot-reducing service downtime from hours to seconds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3861RGER | 10-bit single-switch (vs. dual 10-bit); same ron, tpd, and Ioff; smaller 24-pin VQFN package. | Lacks independent dual-OE control-requires external logic for bank-select functionality in 20-bit systems. | Select when board space is constrained and full 20-bit concurrency is not required; adds 1 gate of logic for OE coordination. |
| SN74CBT16210DGGR | Same pinout and function but TTL-level (not LVTTL); higher ICC (100 µA vs. 10 µA), wider VCC range (4.5–5.5 V). | Not compatible with 3.3 V systems; unsuitable for battery-powered or low-power IoT nodes. | Choose only for legacy 5 V backplanes where LVTTL speed advantages are unnecessary and power budget allows. |
Compared with SN74CBTLV3861RGER, 74CBTLV16210VRE4 provides native 20-bit dual-bank control without glue logic; versus SN74CBT16210DGGR, it delivers 90% lower quiescent current and seamless integration into modern 3.3 V embedded platforms.
Availability
74CBTLV16210VRE4 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, hot-swap backplanes, PCIe lane multiplexing, and industrial controller bus arbitration requiring stable component supply across extended product lifecycles.
Supply support for 74CBTLV16210VRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability components for industrial, automotive, and communications markets.
The 74CBTLV16210VRE4 belongs to TI's Widebus™ family of high-speed bus switches, engineered specifically for low-latency, low-power signal routing in multi-voltage system architectures where timing predictability and power-domain isolation are critical.
FAQ
What is the maximum data rate supported by the 74CBTLV16210VRE4?
The 74CBTLV16210VRE4 does not specify a formal data rate limit but supports signal integrity up to 200+ MHz due to its 6.5 pF off-capacitance and 0.15 ns propagation delay. In practice, it maintains clean eye diagrams for DDR2/DDR3 address/control signals and PCIe Gen1/Gen2 sideband signals when routed with controlled impedance.
Can the 74CBTLV16210VRE4 operate with VCC = 2.5 V and interface with 1.8 V logic?
Yes-the 74CBTLV16210VRE4 supports rail-to-rail switching and accepts input voltages from GND to VCC. At VCC = 2.5 V, it reliably passes 1.8 V signals bidirectionally without degradation, provided the driving source meets VIH/VIL thresholds (VIH ≥ 1.7 V, VIL ≤ 0.7 V per datasheet).
How should unused OE pins be handled on the 74CBTLV16210VRE4?
Unused OE pins must be tied to VCC through a pullup resistor (minimum value determined by driver sink capability) to guarantee high-impedance state during power-up/down. Floating OE pins risk metastability and unintended switching, violating TI's SCBA004 guideline on slow CMOS inputs.
Is the 74CBTLV16210VRE4 RoHS compliant and lead-free?
Yes-the 74CBTLV16210VRE4 carries NIPDAU (nickel/palladium/gold) lead finish, is RoHS-compliant per TI's packaging addendum, and rated MSL Level-1 (unlimited floor life at ≤30°C/60% RH), making it suitable for lead-free reflow processes up to 260°C peak.
Does the 74CBTLV16210VRE4 require external decoupling capacitors?
Yes-TI recommends one 0.1 µF ceramic capacitor per VCC pin (Pins 16 and 32) placed within 3 mm of the pad, plus a bulk 4.7 µF tantalum capacitor near the power entry point. This suppresses switching noise and prevents VCC droop during simultaneous 20-bit switching events.
74CBTLV16210VRE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 48-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Type:
- Bus Switch
- Circuit:
- 10 x 1:1
- Independent Circuits:
- 2
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TVSOP
74CBTLV16210VRE4 FAQ
1.How can I place an order for 74CBTLV16210VRE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CBTLV16210VRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74CBTLV16210VRE4 reliable?
The price and inventory of 74CBTLV16210VRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV16210VRE4 is usually 5 days.
3.What payment methods are accepted for 74CBTLV16210VRE4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLV16210VRE4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74CBTLV16210VRE4?
74CBTLV16210VRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74CBTLV16210VRE4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74CBTLV16210VRE4?
For technical support, including 74CBTLV16210VRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV16210VRE4 requirements.
6.How does Aetrix verify that 74CBTLV16210VRE4 is sourced from the original manufacturer or authorized distributors?
All 74CBTLV16210VRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV16210VRE4 meets industry standards.
7.What is the process for return or replacement of 74CBTLV16210VRE4?
All 74CBTLV16210VRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV16210VRE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CBTLV16210VRE4 part is unused and in its original packaging.
Return procedure for 74CBTLV16210VRE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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