NXP Semiconductors 74CBTLV16211DGG112

Overview

74CBTLV16211 from NXP Semiconductors is a dual 12-bit high-speed CMOS bus switch IC with independent active-LOW output enables (1OE, 2OE), 5 Ω typical ON-resistance at 3.3 V, rail-to-rail switching capability, and IOFF partial power-down protection. It operates from 2.3 V to 3.6 V across −40 °C to +125 °C and is used in high-bandwidth data path isolation for memory expansion and FPGA I/O bridging.

For engineers reviewing the 74CBTLV16211 datasheet, 74CBTLV16211 pinout, 74CBTLV16211 application, or 74CBTLV16211 equivalent, key selection criteria include its 0.2 ns max propagation delay at 3.3 V, 458 MHz −3 dB bandwidth, Schmitt-trigger control inputs for noise immunity, and TSSOP56 package compatibility with dense PCB layouts requiring low-capacitance signal routing.

Technical Context

This device implements two independent 12-bit bidirectional analog/digital bus switches, each controlled by a dedicated OE input. Its low R_ON and minimal channel capacitance (14.3 pF ON-state) enable near-transparent signal pass-through with sub-nanosecond timing margins.

The IOFF circuit actively disables outputs during power-down, blocking backflow current when V_CC = 0 V, while Schmitt-trigger inputs tolerate slow edges across the full 2.3–3.6 V supply range-critical for mixed-voltage system interfacing and hot-swap applications.

Key Specifications

Pinout & Package

TSSOP56 plastic thin shrink small outline package (SOT364-1), 56-pin, body width 6.1 mm, 0.5 mm pitch, lead-free and RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBT16212DGGR and 74LVC1G3157GW, the 74CBTLV16211 uniquely combines 24-bit parallel switching, −40 °C to +125 °C operation, and IOFF-enabled partial power-down-making it the only option for thermally demanding, hot-pluggable, or safety-critical bus isolation tasks.

Availability

74CBTLV16211 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, hot-swappable module backplanes, and industrial PLC I/O multiplexing requiring stable component supply across automotive and industrial temperature grades.

Supply support for 74CBTLV16211 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in high-performance logic and interface ICs.

The 74CBTLV16211 belongs to NXP's CBTLV advanced bus switch family, engineered specifically for low-latency, low-distortion signal routing in high-speed parallel data paths requiring robust power sequencing and thermal resilience.

FAQ

What is the maximum operating frequency supported by the 74CBTLV16211?

The 74CBTLV16211 supports a −3 dB bandwidth of 458 MHz at V_CC = 3.3 V, enabling reliable transmission of digital signals with rise/fall times down to ~0.7 ns. This corresponds to practical data rates up to 1.8 Gbps in NRZ format, validated using 50 Ω termination and 50 pF load conditions per the datasheet test setup.

Does the 74CBTLV16211 require external pull-up resistors on its OE pins?

Yes - to ensure high-impedance OFF-state during power-up or power-down, 1OE and 2OE must be tied to V_CC via external pull-up resistors. The minimum resistor value depends on the current-sinking capability of the driving source, as specified in the 74CBTLV16211 datasheet Section 1.

Can the 74CBTLV16211 be used with 1.8 V logic signals?

No - the 74CBTLV16211 is specified only for 2.3 V to 3.6 V supply operation and does not support 1.8 V I/O. Input voltage must remain within 0 V to V_CC, and VIH/VIL thresholds scale with V_CC; applying 1.8 V signals risks undefined switching behavior or excessive leakage.

How does the IOFF feature protect the 74CBTLV16211 during partial power-down?

The IOFF circuit in the 74CBTLV16211 automatically disables all switch paths and limits OFF-state leakage to ±10 µA when V_CC = 0 V, preventing damaging reverse current flow from powered downstream circuits into the unpowered device - critical for hot-swap and multi-rail system reliability.

What is the thermal performance of the 74CBTLV16211 in TSSOP56 package?

In the SOT364-1 TSSOP56 package, the 74CBTLV16211 has a total power dissipation limit of 600 mW at T_amb = −40 °C to +125 °C, derating linearly by 8.0 mW/K above +55 °C. Its thermal resistance θ_JA is optimized for standard FR-4 PCBs with moderate copper pour, supporting continuous operation at full 24-bit load under industrial ambient conditions.