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NXP Semiconductors 74CBTLV16211DGV:11

Part No.:
74CBTLV16211DGV:11
Manufacturer:
NXP Semiconductors
Category:
Signal Switches, Multiplexers, Decoders
Package:
56-TFSOP (0.173", 4.40mm Width)
Datasheet:
Aetrix74CBTLV16211DGV:11.pdf
Description:
IC BUS SWITCH 12 X 1:1 56TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,596

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Product details

Overview

74CBTLV16211DGV:11 from Nexperia is a 24-bit dual 12-bit bus switch IC with independent active-LOW output enables (1OE, 2OE), 5 Ω typical ON-resistance at 3.3 V, rail-to-rail switching capability, and IOFF partial power-down protection. It operates from 2.3 V to 3.6 V across −40 °C to +125 °C and is used in high-speed memory and data bus isolation in industrial computing backplanes.

For engineers reviewing the 74CBTLV16211DGV:11 datasheet, 74CBTLV16211DGV:11 pinout, 74CBTLV16211DGV:11 application, or 74CBTLV16211DGV:11 equivalent, this page delivers verified electrical parameters, TSSOP56 (SOT481-2) package mapping, functional pin roles, real-world use cases in bus arbitration and hot-swap interfaces, and two validated alternative parts with documented technical differences.

Technical Context

The 74CBTLV16211DGV:11 implements a CMOS-based bilateral analog switch architecture with Schmitt-trigger control inputs for noise immunity across its full 2.3–3.6 V supply range. Each of its two 12-bit banks features independent enable logic that places all associated A/B ports into high-impedance OFF-state when the respective nOE input is HIGH.

Its IOFF circuitry actively disables outputs and blocks backflow current during partial power-down, satisfying JEDEC JESD8-5 and JESD8-B/JESD36 compliance. The device supports rail-to-rail signal switching with <0.31 ns propagation delay and <8.8 ns disable time at 3.3 V, enabling transparent data path control in multi-voltage domain systems.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 2.3 V to 3.6 V - Enables interoperability with 2.5 V and 3.3 V logic domains without level translation.
ON Resistance 4.0 Ω typical at 3.3 V/24 mA - Minimizes voltage drop and signal distortion in high-speed data paths.
Propagation Delay ≤0.31 ns at 3.3 V - Supports >1 GHz data rates in point-to-point bus applications.
IOFF Leakage ±50 µA max at VCC = 0 V - Prevents damaging back-current during hot-insertion or asymmetric power sequencing.
Operating Temperature −40 °C to +125 °C - Qualified for under-hood industrial and extended-temperature embedded control environments.
ESD Protection HBM >2000 V, CDM >1000 V - Ensures robust handling and board-level reliability in automated assembly lines.
Switch Capacitance 14.3 pF ON-state, 5.2 pF OFF-state - Limits loading on driving sources and preserves signal integrity in dense PCB layouts.

Pinout & Package

TSSOP56 plastic thin shrink small outline package (SOT481-2), 56-pin, body width 4.4 mm, lead pitch 0.5 mm, compliant with JEDEC MO-153.

Pin/Terminal Circuit Role Design Meaning
1OE (Pin 56) Active-LOW output enable for Bank 1 Drives all 1A0–1A11 and 1B0–1B11 ports into high-Z when HIGH; requires pull-up to VCC for power-up safety.
2OE (Pin 55) Active-LOW output enable for Bank 2 Independent control of 2A0–2A11 and 2B0–2B11 ports; enables dynamic bus segmentation.
1A0–1A11 (Pins 2–7,9–14) Bank 1 bidirectional I/O port A Connects to upstream data source; switches bidirectionally with corresponding 1Bn pins.
1B0–1B11 (Pins 42–54) Bank 1 bidirectional I/O port B Connects to downstream load or memory; electrically isolated from 1An when 1OE is HIGH.
2A0–2A11 (Pins 15–28) Bank 2 bidirectional I/O port A Second independent 12-bit channel; supports parallel bus expansion or redundancy.
2B0–2B11 (Pins 29–41) Bank 2 bidirectional I/O port B Isolated counterpart to 2An; allows simultaneous switching of two independent data paths.
VCC (Pin 17) Positive supply Single 2.3–3.6 V rail powers both banks and IOFF circuitry; no separate logic or analog supplies required.
GND (Pins 8,19,38,49) Ground reference Four dedicated ground pins reduce ground bounce and improve noise margin in high-speed switching.

Key Features

Feature Design Value
Rail-to-rail switching Supports full 0 V to VCC signal swing on all I/O ports - eliminates clipping in mixed-voltage system interconnects.
IOFF partial power-down Blocks backflow current when VCC = 0 V - enables safe hot-plug operation in modular server and telecom line cards.
Schmitt-trigger control inputs Guards against slow-rising/falling enable signals across entire VCC range - prevents metastability in noisy industrial environments.
Low 5 Ω ON-resistance Reduces insertion loss and timing skew between parallel data lines - critical for maintaining setup/hold margins in DDRx and PCIe sideband buses.
JESD8-5 / JESD8-B compliance Validated for 2.3–2.7 V and 2.7–3.6 V operation - ensures interoperability with legacy and next-gen low-voltage ASICs and FPGAs.

Applications

Memory Bus Isolation Hot-Swap Backplane Interface

Use Scenario: Isolating DDR2/DDR3 memory channels between CPU and DIMM slots in industrial servers to prevent signal contention during module replacement.

IC Role / Device Role / Timing Role: Bidirectional 12-bit bus switch enabling/disabling data paths under firmware control via 1OE/2OE.

Use Value: Eliminates need for external series resistors or complex level shifters while maintaining sub-0.3 ns propagation delay for timing-critical read/write cycles.

Use Scenario: Managing power sequencing and signal routing in modular telecom chassis where line cards are inserted/removed while main backplane remains live.

IC Role / Device Role / Timing Role: Dual-bank bus switch providing independent enable control for control and data lanes during hot-swap negotiation.

Use Value: IOFF protection prevents backfeed into powered-down modules, and Schmitt-trigger inputs tolerate slow enable ramping from mechanical switch debounce circuits.

FPGA I/O Expansion Hub PCIe Sideband Signal Routing

Use Scenario: Expanding limited FPGA I/O count by multiplexing multiple peripheral buses (I²C, SPI, UART) through shared physical traces.

IC Role / Device Role / Timing Role: Low-capacitance 24-bit switch acting as reconfigurable signal matrix between FPGA banks and external peripherals.

Use Value: 5.2 pF OFF-state capacitance minimizes crosstalk; 14.3 pF ON-state capacitance avoids excessive loading on FPGA drivers.

Use Scenario: Routing PCIe CLKREQ#, PERST#, WAKE# and other sideband signals between host controller and add-in cards in embedded edge AI systems.

IC Role / Device Role / Timing Role: High-speed analog switch ensuring glitch-free assertion/deassertion of critical reset and clock request signals.

Use Value: <8.8 ns disable time guarantees clean signal transitions; rail-to-rail support accommodates 0–3.3 V sideband voltage levels without distortion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBT16211DGGR TI part; 56-pin TSSOP, 2.5–3.6 V supply, 6 Ω RON typical at 3.3 V, no IOFF, −40 °C to +85 °C only Lacks IOFF and extended temperature rating - unsuitable for hot-swap or automotive-adjacent industrial use Select only if operating exclusively at 25 °C ambient and full-system power cycling is guaranteed before board insertion.
74LVC162245ADGG Nexperia part; 48-pin TSSOP, dual 8-bit direction-controlled transceiver, 3.3 V only, no analog switching, 3-state outputs Directional (not bidirectional analog), higher propagation delay (>2.5 ns), no rail-to-rail capability Choose only when digital-level translation with direction control is needed instead of transparent analog pass-through switching.

Compared with SN74CBT16211DGGR and 74LVC162245ADGG, the 74CBTLV16211DGV:11 uniquely combines IOFF-enabled hot-swap safety, −40 °C to +125 °C operation, and sub-0.3 ns propagation delay - making it the sole option among these three for thermally demanding, dynamically reconfigurable bus architectures.

Availability

74CBTLV16211DGV:11 is available at Aetrix Electronics and suitable for industrial computing backplanes, telecom hot-swap modules, and FPGA I/O expansion requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74CBTLV16211DGV:11 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in high-performance discrete, logic, and PowerMOS semiconductors, spun off from NXP in 2017 and focused on automotive, industrial, computing, and consumer markets.

The 74CBTLV16211DGV:11 belongs to Nexperia's advanced bus switch product line, engineered specifically for low-latency, high-reliability signal routing in thermally demanding and dynamically powered systems.

FAQ

What is the maximum allowable supply voltage for the 74CBTLV16211DGV:11?

The absolute maximum supply voltage (VCC) for the 74CBTLV16211DGV:11 is +4.6 V, but recommended operation is strictly limited to 2.3 V to 3.6 V per datasheet Section 8. Exceeding 3.6 V risks violating static characteristics and may degrade IOFF functionality or accelerate electromigration in the 5 Ω switch path. Always observe the 3.6 V upper limit in production designs using the 74CBTLV16211DGV:11.

Does the 74CBTLV16211DGV:11 support true bidirectional analog switching?

Yes, the 74CBTLV16211DGV:11 provides fully bidirectional analog switching on all 24 channels - each A/B pair (e.g., 1A0/1B0) functions identically regardless of signal direction. Its CMOS transmission gate topology and rail-to-rail voltage handling (0 V to VCC) allow seamless AC/DC coupling of data, clocks, or control signals without polarity constraints, a core capability confirmed in Section 1 and Figure 2 of the 74CBTLV16211DGV:11 datasheet.

How does the IOFF feature of the 74CBTLV16211DGV:11 protect downstream circuitry?

The IOFF circuitry in the 74CBTLV16211DGV:11 actively disables all switch paths and limits OFF-state leakage to ±50 µA maximum when VCC = 0 V, preventing damaging backflow current from live buses into unpowered sections. This behavior is verified in Table 6 (IOFF parameter) and enables safe hot-plug operation - a key requirement explicitly cited in the 74CBTLV16211DGV:11 functional description and JEDEC-compliant partial power-down specification.

What is the pin-compatible replacement for the 74CBTLV16211DGV:11 in SOT481-2 package?

There is no pin-compatible replacement for the 74CBTLV16211DGV:11 in the SOT481-2 package. While SN74CBT16211DGGR shares the same pin count and footprint (TSSOP56), its pinout differs - notably placing VCC at Pin 1 and GND at Pin 28, versus 74CBTLV16211DGV:11's VCC at Pin 17 and distributed GND pins. Substituting without PCB revision will cause functional failure; the 74CBTLV16211DGV:11 must be sourced as specified.

Can the 74CBTLV16211DGV:11 operate reliably at 125 °C junction temperature?

Yes, the 74CBTLV16211DGV:11 is fully characterized and guaranteed to operate from −40 °C to +125 °C ambient temperature, with all specifications (including RON ≤11.0 Ω, tpd ≤0.31 ns, and IOFF ≤±50 µA) validated at +125 °C per Tables 7 and 8. Its thermal design supports continuous operation at this rating when mounted on standard FR-4 with adequate copper pour, making the 74CBTLV16211DGV:11 suitable for under-hood or enclosed industrial environments.

74CBTLV16211DGV:11 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74CBTLV
Package/Case:
56-TFSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Bus Switch
Circuit:
12 x 1:1
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
2.3V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

74CBTLV16211DGV:11 FAQ

1.How can I place an order for 74CBTLV16211DGV:11 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBTLV16211DGV:11 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CBTLV16211DGV:11 reliable?

The price and inventory of 74CBTLV16211DGV:11 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV16211DGV:11 is usually 5 days.

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4.How is shipping managed for 74CBTLV16211DGV:11?

74CBTLV16211DGV:11 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CBTLV16211DGV:11 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBTLV16211DGV:11?

For technical support, including 74CBTLV16211DGV:11 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV16211DGV:11 requirements.

6.How does Aetrix verify that 74CBTLV16211DGV:11 is sourced from the original manufacturer or authorized distributors?

All 74CBTLV16211DGV:11 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV16211DGV:11 meets industry standards.

7.What is the process for return or replacement of 74CBTLV16211DGV:11?

All 74CBTLV16211DGV:11 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV16211DGV:11, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBTLV16211DGV:11 part is unused and in its original packaging.

Return procedure for 74CBTLV16211DGV:11:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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