Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments 74CBTLV16211GRG4

Name: 74CBTLV16211GRG4
Brand: Texas Instruments
SKU: 74CBTLV16211GRG4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: 74CBTLV16211GRG4

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 56-TFSOP (0.240", 6.10mm Width)

Datasheet:: 74CBTLV16211GRG4.pdf

Description:: IC BUS SWITCH 12 X 1:1 56TSSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,415

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

74CBTLV16211GRG4 from Texas Instruments is a 24-bit high-speed FET bus switch IC organized as dual 12-bit switches with independent OE controls, featuring 5-Ω on-state resistance, rail-to-rail signal switching, and I_off partial-power-down support for system-level isolation. It enables bidirectional, low-latency data routing in memory expansion, FPGA I/O bridging, and hot-swap-capable backplane interfaces.

For engineers reviewing the 74CBTLV16211GRG4 datasheet, 74CBTLV16211GRG4 pinout, 74CBTLV16211GRG4 application, or 74CBTLV16211GRG4 equivalent, key selection criteria include its 0.15 ns typical propagation delay at 2.5 V, ±10 µA I_off leakage at V_CC = 0 V, 2.3–3.6 V supply range, and TSSOP-56 package compatibility with high-density PCB layouts.

Technical Context

The 74CBTLV16211GRG4 implements two independent 12-bit transmission-gate-based bus switches, each controlled by a dedicated OE input. Its FET architecture delivers rail-to-rail analog/digital signal pass-through without level translation, supporting bidirectional operation across the full V_CC range (2.3 V to 3.6 V).

True partial-power-down operation is enabled via I_off, which limits current backflow to ≤10 µA when V_CC = 0 V and ports are biased between 0–3.6 V. The device maintains high-impedance isolation during power-up/down when OE is pulled to V_CC via an external resistor.

Key Specifications

Parameter	Value and Actual Design Meaning
On-state resistance (r_on)	5 Ω typical at V_CC = 2.5 V, enabling minimal voltage drop and signal distortion under 24 mA load per switch.
Propagation delay (t_pd)	0.15 ns typical at V_CC = 2.5 V, supporting >5 GHz effective switching bandwidth for high-speed parallel buses.
I_off leakage	10 µA maximum at V_CC = 0 V, ensuring safe inter-port isolation during partial system power-down.
Supply voltage range	2.3 V to 3.6 V, compatible with 2.5 V and 3.3 V logic domains without external level shifters.
ESD protection	2000-V HBM and 200-V MM, meeting industrial-grade robustness requirements for board-level handling and operation.
Operating temperature	−40°C to +85°C, qualified for extended industrial environments without derating.

Pinout & Package

TSSOP-56 (DGG) package: 12.0 mm × 6.1 mm × 1.2 mm body, 0.5 mm pitch, lead-free NiPdAu finish, MSL Level-1, RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
1A1–1A12, 2A1–2A12	Input/Output port A (Group 1 & 2)	First 12-bit and second 12-bit source/sink terminals; bidirectional, rail-to-rail capable.
1B1–1B12, 2B1–2B12	Input/Output port B (Group 1 & 2)	Corresponding switched endpoints; electrically identical to A-side pins with no internal directionality.
1OE, 2OE	Output-enable control inputs	Active-low enables respective 12-bit switch; high = high-Z isolation; requires pullup to V_CC for power-sequence safety.
V_CC	Power supply	Single 2.3–3.6 V supply powering all switch FETs and control logic; no separate I/O supply required.
GND	Ground reference	Four dedicated ground pins (pins 8, 18, 35, 47) minimize ground bounce in high-speed switching.
NC	No internal connection	Pins 1 and 56 are unconnected; must remain floating or grounded-no capacitive loading impact.

Key Features

Feature	Design Value
Rail-to-rail analog/digital switching	Supports full V_CC swing (0 V to V_CC) on both A and B ports without clamping or distortion.
I_off partial-power-down protection	Prevents damaging back-current flow when V_CC = 0 V and ports are externally biased, enabling live insertion.
Ultra-low propagation delay	0.15 ns typical ensures sub-nanosecond timing alignment critical for synchronous 100+ MHz parallel buses.
Low on-state capacitance	C_io(OFF) = 6.5 pF maximizes bandwidth and minimizes crosstalk in dense multi-bit routing.
Latch-up immunity	Exceeds 250 mA per JESD 17, eliminating risk of destructive latch-up under transient overvoltage conditions.

Applications

Memory Expansion Interface	FPGA I/O Expansion Bridge
Use Scenario: Expanding DRAM address/data bus width between controller and multiple memory banks using shared physical traces. IC Role / Device Role / Timing Role: Bidirectional 24-bit bus switch isolating memory banks during access arbitration; provides zero-latency path when enabled. Use Value: Eliminates need for tristate buffers or complex glue logic while maintaining signal integrity up to 200 MHz clock rates.	Use Scenario: Routing configurable I/O signals between FPGA banks and peripheral ASICs with mismatched voltage domains. IC Role / Device Role / Timing Role: Voltage-agnostic signal conduit enabling direct connection between 3.3 V FPGA I/O and 2.5 V peripheral logic. Use Value: Avoids level-shifter latency and power overhead while preserving setup/hold timing margins across 24-bit parallel paths.
Hot-Swap Backplane Interconnect	Test Access Multiplexer
Use Scenario: Enabling live insertion/removal of line cards in telecom chassis where backplane signals must be isolated during card power sequencing. IC Role / Device Role / Timing Role: Dual 12-bit switch providing independent enable control per card slot; blocks signal coupling during power-up/down transients. Use Value: Prevents bus contention and supply rail droop during hot-swap events, verified by I_off ≤10 µA at V_CC = 0 V.	Use Scenario: Sharing high-speed test instrumentation (e.g., logic analyzer, boundary scan) across multiple DUTs on production test fixtures. IC Role / Device Role / Timing Role: Low-capacitance 24-bit multiplexer selecting one DUT's debug bus to common test interface without signal degradation. Use Value: Maintains <10 ps skew across all 24 bits and supports >100 MHz test clock rates due to matched r_on and C_io.

Memory Expansion Interface

FPGA I/O Expansion Bridge

Use Scenario: Expanding DRAM address/data bus width between controller and multiple memory banks using shared physical traces.

IC Role / Device Role / Timing Role: Bidirectional 24-bit bus switch isolating memory banks during access arbitration; provides zero-latency path when enabled.

Use Value: Eliminates need for tristate buffers or complex glue logic while maintaining signal integrity up to 200 MHz clock rates.

Use Scenario: Routing configurable I/O signals between FPGA banks and peripheral ASICs with mismatched voltage domains.

IC Role / Device Role / Timing Role: Voltage-agnostic signal conduit enabling direct connection between 3.3 V FPGA I/O and 2.5 V peripheral logic.

Use Value: Avoids level-shifter latency and power overhead while preserving setup/hold timing margins across 24-bit parallel paths.

Hot-Swap Backplane Interconnect

Test Access Multiplexer

Use Scenario: Enabling live insertion/removal of line cards in telecom chassis where backplane signals must be isolated during card power sequencing.

IC Role / Device Role / Timing Role: Dual 12-bit switch providing independent enable control per card slot; blocks signal coupling during power-up/down transients.

Use Value: Prevents bus contention and supply rail droop during hot-swap events, verified by I_off ≤10 µA at V_CC = 0 V.

Use Scenario: Sharing high-speed test instrumentation (e.g., logic analyzer, boundary scan) across multiple DUTs on production test fixtures.

IC Role / Device Role / Timing Role: Low-capacitance 24-bit multiplexer selecting one DUT's debug bus to common test interface without signal degradation.

Use Value: Maintains <10 ps skew across all 24 bits and supports >100 MHz test clock rates due to matched r_on and C_io.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV16210GR	22-bit configuration (dual 11-bit), same r_on, t_pd, and I_off; TSSOP-56 pinout differs in A/B port mapping.	Suitable only when 22-bit width suffices; not pin-compatible-requires PCB layout change.	Select when exact 24-bit width is unnecessary and cost optimization is prioritized.
74CBTLV3244PW	8-bit dual-channel (16 total), TSSOP-24 package; identical electrical specs but lower channel count and smaller footprint.	Requires two devices for 24-bit coverage; increases component count but improves thermal distribution.	Choose for space-constrained designs where modularity and thermal management outweigh integration benefits.

Compared with SN74CBTLV16210GR and 74CBTLV3244PW, the 74CBTLV16211GRG4 uniquely delivers native 24-bit width in a single TSSOP-56 package with guaranteed sub-0.25 ns propagation delay and integrated I_off protection-critical for high-reliability hot-swap and memory subsystems.

Availability

74CBTLV16211GRG4 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, and hot-swap backplane interconnects requiring stable component supply across industrial temperature ranges and long production lifecycles.

Supply support for 74CBTLV16211GRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface and bus technology.

The 74CBTLV16211GRG4 belongs to TI's Widebus™ family of high-performance bus switches, designed specifically for low-latency, rail-to-rail signal routing in memory, FPGA, and telecom infrastructure applications.

FAQ

What is the maximum operating frequency supported by the 74CBTLV16211GRG4?

The 74CBTLV16211GRG4 does not specify a maximum clock frequency directly, but its 0.15 ns typical propagation delay and 5 Ω on-resistance support reliable operation in synchronous parallel buses up to 200 MHz. Signal integrity depends on trace length, load capacitance, and termination-designs should verify timing margins using the device's measured t_pd, t_en, and t_dis values at the target V_CC and temperature.

Can the 74CBTLV16211GRG4 be used with 1.8 V logic systems?

No-the 74CBTLV16211GRG4 is specified only for 2.3 V to 3.6 V supply operation. Applying V_CC < 2.3 V violates recommended operating conditions and risks undefined switching behavior, increased r_on, and failure to meet I_off or ESD specifications. For 1.8 V systems, consider TI's SN74AVC series or similar 1.65–3.6 V bus switches.

How should OE pins be handled during power-up to ensure safe startup?

To guarantee high-impedance state at power-up, both 1OE and 2OE must be held high until V_CC stabilizes. TI recommends connecting each OE to V_CC via a pullup resistor; minimum value is determined by the driving circuit's sink capability-typically 4.7 kΩ to 10 kΩ suffices for standard CMOS drivers. Floating OE pins may cause unintended switching or bus contention.

Does the 74CBTLV16211GRG4 support hot-plug operation in powered-backplane systems?

Yes-the 74CBTLV16211GRG4 supports hot-plug via its I_off feature, which limits reverse current to ≤10 µA when V_CC = 0 V and ports are biased between 0–3.6 V. This prevents damage during live insertion. However, external protection (e.g., series resistors, TVS diodes) is still recommended on A/B lines to handle inrush and ESD during mating.

What is the thermal performance of the 74CBTLV16211GRG4 in TSSOP-56 package?

The 74CBTLV16211GRG4 in TSSOP-56 (DGG) package has a junction-to-ambient thermal resistance (θ_JA) of 64°C/W under standard JEDEC PCB conditions. At maximum continuous channel current (128 mA per switch) and worst-case ambient (85°C), junction temperature remains within safe limits (<125°C) with proper copper pour and airflow-no heatsink required for typical 24-bit bus switching duty cycles.

74CBTLV16211GRG4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: 56-TFSOP (0.240", 6.10mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Type:: Bus Switch

Circuit:: 12 x 1:1

Independent Circuits:: 2

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSSOP

74CBTLV16211GRG4 FAQ

1.How can I place an order for 74CBTLV16211GRG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBTLV16211GRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CBTLV16211GRG4 reliable?

The price and inventory of 74CBTLV16211GRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV16211GRG4 is usually 5 days.

3.What payment methods are accepted for 74CBTLV16211GRG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLV16211GRG4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74CBTLV16211GRG4?

74CBTLV16211GRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CBTLV16211GRG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBTLV16211GRG4?

For technical support, including 74CBTLV16211GRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV16211GRG4 requirements.

6.How does Aetrix verify that 74CBTLV16211GRG4 is sourced from the original manufacturer or authorized distributors?

All 74CBTLV16211GRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV16211GRG4 meets industry standards.

7.What is the process for return or replacement of 74CBTLV16211GRG4?

All 74CBTLV16211GRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV16211GRG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBTLV16211GRG4 part is unused and in its original packaging.

Return procedure for 74CBTLV16211GRG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…