Texas Instruments 74CBTLV16212DLRG4

Overview

74CBTLV16212DLRG4 from Texas Instruments is a 24-bit high-speed bus switch with break-before-make switching, 4-Ω on-state resistance, rail-to-rail data I/O capability, and I_off support for partial-power-down mode. It functions as either a 24-bit bus switch or 12-bit bus exchanger across four signal ports (A1/A2/B1/B2), enabling dynamic data path routing in memory expansion and FPGA interconnect applications.

For engineers reviewing the 74CBTLV16212DLRG4 datasheet, 74CBTLV16212DLRG4 pinout, 74CBTLV16212DLRG4 application, or 74CBTLV16212DLRG4 equivalent, key selection criteria include its 56-pin TSSOP (DGG) package, sub-nanosecond propagation delay (0.15–0.25 ns at 2.5 V), guaranteed isolation during power-off, and compatibility with 2.3–3.6 V supply rails in hot-swap and low-voltage logic systems.

Technical Context

This device implements a CMOS FET-based analog switch architecture with three select inputs (S0–S2) to configure 24 bidirectional data paths between A and B ports. Its break-before-make timing prevents through-current during state transitions, and the I_off feature ensures <10 µA leakage when V_CC = 0 V and any I/O biased 0–3.6 V.

The 74CBTLV16212DLRG4 operates across −40°C to +85°C with rail-to-rail switching: input and output voltage ranges extend from −0.5 V to 4.6 V, supporting mixed-voltage domain interfacing. Its typical on-resistance of 5–7 Ω at V_CC = 3 V minimizes signal distortion and propagation delay in high-speed parallel buses.

Key Specifications

Pinout & Package

TSSOP-56 (DGG) package: 13.9 mm × 6.0 mm body, 0.5 mm lead pitch, 1.2 mm max height, JEDEC MO-153 compliant. RoHS-compliant NiPdAu lead finish, MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBTLV3244DGGR and SN74CBT16212DGGR, the 74CBTLV16212DLRG4 uniquely combines 24-bit exchange flexibility, 2.3–3.6 V operation, I_off protection, and sub-0.3 ns delay-making it the sole option for compact, low-voltage, hot-swap-capable bus routing in modern embedded platforms.

Availability

74CBTLV16212DLRG4 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA interconnects, hot-swappable backplanes, and automated test equipment requiring stable component supply and long-term industrial availability.

Supply support for 74CBTLV16212DLRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-speed logic and interface solutions.

The 74CBTLV16212DLRG4 belongs to TI's Widebus™ family of advanced bus switches, engineered specifically for low-voltage, high-bandwidth signal routing in space-constrained industrial, computing, and communications systems.

FAQ

What is the maximum operating frequency supported by the 74CBTLV16212DLRG4?

The 74CBTLV16212DLRG4 does not specify a clock frequency but supports signal toggle rates exceeding 500 MHz due to its 0.15–0.25 ns propagation delay and 5–7 Ω on-resistance. Actual usable frequency depends on load capacitance and PCB trace impedance; for 30 pF loads, rise/fall times remain below 100 ps, enabling reliable operation in DDR2/DDR3 address/control bus applications. The 74CBTLV16212DLRG4 is optimized for asynchronous parallel bus switching rather than synchronous clocked operation.

Does the 74CBTLV16212DLRG4 support level translation between different voltage domains?

Yes, the 74CBTLV16212DLRG4 supports rail-to-rail I/O operation from −0.5 V to 4.6 V, allowing bidirectional signal passage between 1.8 V, 2.5 V, and 3.3 V domains without external biasing. However, it does not perform active level translation: both sides of a switched path must share the same V_CC, and voltage translation occurs passively via the FET channel characteristics. The 74CBTLV16212DLRG4 is not a dedicated level shifter but excels in low-distortion, low-latency interconnection within mixed-voltage systems.

Can the 74CBTLV16212DLRG4 be used in hot-swap applications?

Yes, the 74CBTLV16212DLRG4 is explicitly designed for hot-swap use via its I_off feature, which limits leakage current to ≤10 µA when V_CC = 0 V and I/O pins are biased 0–3.6 V. This prevents damaging backflow current into unpowered circuit sections. Combined with break-before-make switching and latch-up immunity >100 mA, the 74CBTLV16212DLRG4 meets key requirements for IEEE 1394, PCI Express add-in card, and telecom line card hot-swap implementations.

What is the thermal performance of the 74CBTLV16212DLRG4 in its TSSOP-56 package?

The 74CBTLV16212DLRG4 in TSSOP-56 (DGG) package has a junction-to-ambient thermal resistance (θ_JA) of 64°C/W under standard JEDEC test conditions. With typical power dissipation below 1 mW (ICC ≤ 10 µA), self-heating is negligible (<0.1°C) in most applications. For high-density layouts, thermal vias under the exposed pad (if present in variant) or copper pour on inner layers further reduce thermal resistance. The 74CBTLV16212DLRG4 operates reliably from −40°C to +85°C ambient without derating.

How does the break-before-make feature work in the 74CBTLV16212DLRG4?

The 74CBTLV16212DLRG4 guarantees break-before-make timing through internal control logic that disables all switch paths before enabling new ones during S0–S2 transitions. This eliminates momentary short-circuits ("through-current") between A and B ports, preventing bus contention and power rail disturbances. Measured disable/enable times (t_dis/t_en) are 1–8.8 ns, ensuring clean signal path reconfiguration even at nanosecond-scale switching intervals. This behavior is intrinsic to the 74CBTLV16212DLRG4's silicon design and requires no external timing control.