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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments 74CBTLV16212GRE4

Name: 74CBTLV16212GRE4
Brand: Texas Instruments
SKU: 74CBTLV16212GRE4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74CBTLV16212GRE4

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 56-TFSOP (0.240", 6.10mm Width)

Datasheet:: 74CBTLV16212GRE4.pdf

Description:: IC BUS FET EXC SW 12X2:2 56TSSOP

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Product details

Overview

74CBTLV16212GRE4 from Texas Instruments is a 24-bit high-speed bus switch IC with rail-to-rail switching, 4-Ω on-state resistance, break-before-make operation, and I_off support for partial-power-down mode. It functions as either a 24-bit bus switch or 12-bit bus exchanger across four signal ports (A1/B1–A12/B12), enabling dynamic data path routing in memory expansion and FPGA interconnect applications.

For engineers reviewing the 74CBTLV16212GRE4 datasheet, 74CBTLV16212GRE4 pinout, 74CBTLV16212GRE4 application, or 74CBTLV16212GRE4 equivalent, key selection criteria include its 56-pin TSSOP (DGG) package, 2.3–3.6 V supply range, sub-nanosecond propagation delay (0.15 ns typ at 2.5 V), and guaranteed isolation during power-off via I_off.

Technical Context

The 74CBTLV16212GRE4 implements a CMOS FET-based analog bus switch architecture with independent control of 24 bidirectional channels via three select inputs (S0–S2). Its break-before-make logic ensures no through-current during port switching, critical for hot-swap and live-insertion systems.

Each channel features rail-to-rail voltage handling (−0.5 V to 4.6 V), latch-up immunity (>100 mA per JESD 78 Class II), and ESD protection exceeding 2000-V HBM and 200-V MM. The device operates with zero static current draw in powered-down state due to I_off circuitry that blocks backflow when V_CC = 0 V.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	2.3 V to 3.6 V - Enables direct interface with 2.5 V and 3.3 V logic families without level translation.
On-State Resistance (r_on)	5 Ω max (typ 4 Ω at V_CC = 3 V) - Minimizes voltage drop and signal distortion in high-speed data paths.
Propagation Delay (t_pd)	0.15 ns min / 0.25 ns max at 2.5 V - Supports >1 GHz data rates with negligible timing skew across 24-bit buses.
I_off Current	10 µA max at V_CC = 0 V - Ensures complete signal isolation and prevents backfeeding in partial-power-down systems.
Input/Output Voltage Range	−0.5 V to 4.6 V - Allows safe interfacing with overvoltage-tolerant peripherals and mixed-voltage domains.
ESD Protection	2000-V HBM, 200-V MM - Meets industrial-grade robustness requirements without external protection components.
Latch-Up Immunity	>100 mA per JESD 78 Class II - Guarantees fault tolerance under transient stress conditions.

Pinout & Package

TSSOP-56 (DGG) package, 1.2 mm maximum height, JEDEC MO-153 compliant, with exposed pad not electrically connected.

Pin/Terminal	Circuit Role	Design Meaning
1A1–12A1, 1A2–12A2	Port A input/output terminals	24 bidirectional data lines grouped as 12 pairs; each pair connects to corresponding B-side port under select control.
1B1–12B1, 1B2–12B2	Port B input/output terminals	24 bidirectional data lines mirroring Port A; physical separation enables clean signal routing between subsystems.
S0, S1, S2	Function select inputs	3-bit binary control determining connection mapping (e.g., A1↔B1, A1↔B2, A1↔B1 + A2↔B2, etc.) per function table.
V_CC	Power supply	Single 2.3–3.6 V supply powering internal logic and switch FETs; decoupling required within 1 cm.
GND (Pins 8, 17, 30, 43)	Ground reference	Four dedicated ground pins minimize ground bounce and ensure stable switching thresholds across all 24 channels.

Key Features

Feature	Design Value
Rail-to-rail analog switching	Supports full −0.5 V to 4.6 V signal swing without clipping or distortion, enabling interoperability with legacy and modern logic families.
Break-before-make switching	Guarantees zero overlap between old and new connections during reconfiguration, eliminating short-circuit transients in live systems.
I_off partial-power-down	Blocks current flow when V_CC = 0 V, allowing safe insertion/removal of daughter cards while host remains powered.
Low on-state capacitance	C_io(OFF) = 8 pF max - Reduces loading on driving sources and preserves signal integrity in high-frequency parallel buses.
High-density 56-pin TSSOP	0.5 mm pitch, 6.2 × 13.9 mm footprint - Optimized for space-constrained PCB layouts in telecom and computing modules.

Applications

Memory Expansion Interface	FPGA I/O Multiplexing
Use Scenario: Expanding DRAM capacity in embedded controllers by dynamically connecting multiple memory banks to a shared bus. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling time-multiplexed access to two 12-bit memory banks via S0–S2 control. Use Value: Eliminates need for discrete multiplexers and level shifters while maintaining sub-ns timing alignment across all 24 data lines.	Use Scenario: Routing configuration data and debug signals between FPGA JTAG pins and multiple test access ports. IC Role / Device Role / Timing Role: Low-latency signal path selector allowing FPGA to share boundary-scan resources across multiple daughterboards. Use Value: Achieves deterministic 0.15 ns propagation delay with no added jitter, preserving TCK timing margins in IEEE 1149.1 compliance testing.
Hot-Swappable Module Interconnect	PCI Express Lane Reconfiguration
Use Scenario: Enabling live insertion of compute modules into a backplane without disrupting active PCIe or SATA links. IC Role / Device Role / Timing Role: Isolation switch activated only after module power stabilization, using I_off to block backfeed during insertion. Use Value: Prevents system reset or data corruption during hot-plug events by guaranteeing zero current flow until V_CC reaches valid operating range.	Use Scenario: Dynamically reallocating PCIe Gen2 lanes between GPU and NVMe storage based on workload demands. IC Role / Device Role / Timing Role: High-bandwidth analog switch rerouting differential pairs without introducing impedance discontinuities. Use Value: Maintains 50 Ω characteristic impedance across switched paths and supports 5 GT/s signaling with <0.25 ns skew across all 24 lanes.

Memory Expansion Interface

FPGA I/O Multiplexing

Use Scenario: Expanding DRAM capacity in embedded controllers by dynamically connecting multiple memory banks to a shared bus.

IC Role / Device Role / Timing Role: Bidirectional bus switch enabling time-multiplexed access to two 12-bit memory banks via S0–S2 control.

Use Value: Eliminates need for discrete multiplexers and level shifters while maintaining sub-ns timing alignment across all 24 data lines.

Use Scenario: Routing configuration data and debug signals between FPGA JTAG pins and multiple test access ports.

IC Role / Device Role / Timing Role: Low-latency signal path selector allowing FPGA to share boundary-scan resources across multiple daughterboards.

Use Value: Achieves deterministic 0.15 ns propagation delay with no added jitter, preserving TCK timing margins in IEEE 1149.1 compliance testing.

Hot-Swappable Module Interconnect

PCI Express Lane Reconfiguration

Use Scenario: Enabling live insertion of compute modules into a backplane without disrupting active PCIe or SATA links.

IC Role / Device Role / Timing Role: Isolation switch activated only after module power stabilization, using I_off to block backfeed during insertion.

Use Value: Prevents system reset or data corruption during hot-plug events by guaranteeing zero current flow until V_CC reaches valid operating range.

Use Scenario: Dynamically reallocating PCIe Gen2 lanes between GPU and NVMe storage based on workload demands.

IC Role / Device Role / Timing Role: High-bandwidth analog switch rerouting differential pairs without introducing impedance discontinuities.

Use Value: Maintains 50 Ω characteristic impedance across switched paths and supports 5 GT/s signaling with <0.25 ns skew across all 24 lanes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV3245APWR	8-bit, non-exchangeable topology; lacks S0–S2 select logic and break-before-make feature.	Only supports fixed A↔B routing; unsuitable for dynamic bus exchange or multi-port arbitration.	Select when simpler point-to-point switching suffices and 24-bit density is unnecessary.
74LVC1G3157GW,125	Single-pole double-throw (SPDT) switch; 1-channel only; no I_off or rail-to-rail capability.	Requires 24 discrete units for equivalent functionality; increases board area and layout complexity.	Use only for low-density, cost-sensitive designs where integration and power-down safety are secondary.

Compared with SN74CBTLV3245APWR and 74LVC1G3157GW,125, the 74CBTLV16212GRE4 uniquely delivers 24-bit exchange capability with break-before-make timing, I_off-enabled hot-swap safety, and rail-to-rail analog performance in a single 56-pin TSSOP - reducing component count by ≥23× versus discrete alternatives while enabling dynamic reconfiguration impossible with fixed-path switches.

Availability

74CBTLV16212GRE4 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O multiplexing, hot-swappable module interconnects, and PCIe lane reconfiguration requiring stable component supply and long-term industrial lifecycle support.

Supply support for 74CBTLV16212GRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies, with decades of expertise in high-speed interface solutions.

The 74CBTLV16212GRE4 belongs to TI's Widebus™ family of bus switches, engineered specifically for low-latency, high-fidelity signal routing in memory subsystems, FPGA interconnects, and modular computing architectures.

FAQ

What is the maximum operating temperature range for the 74CBTLV16212GRE4?

The 74CBTLV16212GRE4 is rated for continuous operation from −40°C to +85°C ambient temperature, meeting industrial-grade thermal requirements. This range is validated across all electrical specifications including on-state resistance, propagation delay, and I_off leakage, ensuring reliable performance in fanless enclosures and outdoor equipment.

Does the 74CBTLV16212GRE4 support hot-plug operation?

Yes, the 74CBTLV16212GRE4 supports hot-plug operation via its I_off feature, which limits current to ≤10 µA when V_CC = 0 V. This prevents backfeeding into a powered-down system and eliminates risk of damage during live insertion - a requirement verified per JESD 78 Class II latch-up testing.

Can the 74CBTLV16212GRE4 be used with 5 V logic signals?

No, the 74CBTLV16212GRE4 does not support 5 V logic signals. Its absolute maximum input voltage is 4.6 V, and recommended operation is limited to 2.3–3.6 V supply. Applying 5 V violates absolute maximum ratings and risks permanent damage; level-shifting circuitry is required for 5 V system integration.

What is the significance of the 'GRE4' suffix in 74CBTLV16212GRE4?

The 'GRE4' suffix denotes a Texas Instruments packaging and marking variant: G = TSSOP package (DGG), R = tape-and-reel delivery, E4 = RoHS-compliant NiPdAu lead finish. This matches TI's official ordering nomenclature and confirms the part meets JEDEC MO-153 mechanical standards and IPC-7351 land pattern guidelines.

How does the break-before-make feature operate in the 74CBTLV16212GRE4?

The break-before-make feature in the 74CBTLV16212GRE4 is implemented in hardware via internal timing control of the FET gate drivers. When S0–S2 inputs change state, the device guarantees ≥1 ns of complete isolation between old and new paths before establishing the new connection - preventing momentary shorts and verified in functional testing per the datasheet's switching characteristics table.

74CBTLV16212GRE4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: 56-TFSOP (0.240", 6.10mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Type:: Bus FET Exchange Switch

Circuit:: 12 x 2:2

Independent Circuits:: 1

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSSOP

74CBTLV16212GRE4 FAQ

1.How can I place an order for 74CBTLV16212GRE4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBTLV16212GRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CBTLV16212GRE4 reliable?

The price and inventory of 74CBTLV16212GRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV16212GRE4 is usually 5 days.

3.What payment methods are accepted for 74CBTLV16212GRE4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLV16212GRE4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74CBTLV16212GRE4?

74CBTLV16212GRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CBTLV16212GRE4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBTLV16212GRE4?

For technical support, including 74CBTLV16212GRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV16212GRE4 requirements.

6.How does Aetrix verify that 74CBTLV16212GRE4 is sourced from the original manufacturer or authorized distributors?

All 74CBTLV16212GRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV16212GRE4 meets industry standards.

7.What is the process for return or replacement of 74CBTLV16212GRE4?

All 74CBTLV16212GRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV16212GRE4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBTLV16212GRE4 part is unused and in its original packaging.

Return procedure for 74CBTLV16212GRE4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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