Texas Instruments 74CBTLV16212GRG4

Overview

74CBTLV16212GRG4 from Texas Instruments is a 24-bit high-speed bus switch with rail-to-rail switching, 4-Ω on-state resistance, break-before-make operation, and Ioff partial-power-down support. It functions as either a 24-bit bus switch or 12-bit bus exchanger across four signal ports (A1/B1 through A12/B12), enabling dynamic data path routing in memory expansion and FPGA interconnect applications.

For engineers reviewing the 74CBTLV16212GRG4 datasheet, 74CBTLV16212GRG4 pinout, 74CBTLV16212GRG4 application, or 74CBTLV16212GRG4 equivalent, key selection criteria include its 56-pin TSSOP (DGG) package, 2.3–3.6 V supply range, sub-nanosecond propagation delay (0.15 ns typ at 2.5 V), ±1 µA ICC, and 10 µA Ioff leakage under full power-off conditions.

Technical Context

The 74CBTLV16212GRG4 implements a CMOS FET-based analog switch architecture with three select inputs (S0–S2) controlling 24 bidirectional signal paths between A and B port pairs. Its break-before-make logic prevents momentary shorting during state transitions, ensuring no through-current between B ports during switching.

It supports partial-power-down via Ioff, isolating ports when VCC = 0 V while maintaining ≤10 µA leakage across all terminals. Rail-to-rail switching enables compatibility with 2.3–3.6 V logic families without level translation, and latch-up immunity exceeds 100 mA per JESD 78 Class II.

Key Specifications

Pinout & Package

TSSOP-56 (DGG) package: 12.0 mm × 4.4 mm body, 0.4 mm lead pitch, 1.2 mm max height, exposed pad not present, RoHS-compliant NiPdAu finish, MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBTLV16212GR and SN74CBTLV16212VR, the 74CBTLV16212GRG4 offers identical switching performance and Ioff protection in a standard TSSOP-56 package with enhanced environmental compliance, making it optimal for new industrial designs requiring full RoHS/REACH traceability and long-term component availability.

Availability

74CBTLV16212GRG4 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O multiplexing, PCI bus signal routing, and legacy parallel interface bridging requiring stable component supply across industrial production lifecycles.

Supply support for 74CBTLV16212GRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.

The Widebus™ family-including the 74CBTLV16212GRG4-is engineered for high-speed digital interconnect applications requiring minimal propagation delay, rail-to-rail signal handling, and robust power-management features in compact packages.

FAQ

What is the maximum operating frequency supported by the 74CBTLV16212GRG4?

The 74CBTLV16212GRG4 does not specify a clock frequency but delivers 0.15 ns typical propagation delay at 2.5 V, supporting effective data rates exceeding 5 Gbps in point-to-point configurations. Its 4–7 Ω on-resistance and 8 pF off-capacitance preserve signal integrity up to ~3 GHz, making it suitable for DDR2/DDR3 address/control routing and high-speed parallel bus applications where timing margins are critical. Actual usable frequency depends on load capacitance and drive strength of connected devices.

Does the 74CBTLV16212GRG4 require external pull-up or pull-down resistors on its S0–S2 control inputs?

No, the 74CBTLV16212GRG4 does not require external biasing on S0–S2. Its control inputs have ±1 µA leakage (II) and defined VIH/VIL thresholds (2.0 V min / 0.8 V max at 3.6 V VCC), allowing direct connection to CMOS logic outputs. However, TI recommends tying unused control inputs to VCC or GND to prevent floating states that could cause unintended switching or increased ICC; this guidance is documented in application report SCBA004.

Can the 74CBTLV16212GRG4 be used in hot-swap applications?

Yes, the 74CBTLV16212GRG4 supports hot-swap operation via its Ioff feature: when VCC = 0 V, leakage remains ≤10 µA across all I/O terminals, preventing damaging back-current flow into powered subsystems. This enables safe insertion/removal in live-backplane systems such as modular PLCs or telecom line cards-provided board-level ESD protection and current-limiting circuitry comply with IEC 61000-4-2 and system-level power sequencing requirements.

What is the thermal performance of the 74CBTLV16212GRG4 in its TSSOP-56 (DGG) package?

The 74CBTLV16212GRG4 in TSSOP-56 (DGG) has a junction-to-ambient thermal resistance (θJA) of 64°C/W under standard JEDEC test conditions. At maximum continuous channel current (128 mA) and worst-case 3.6 V supply, power dissipation remains below 50 mW, resulting in <3.2°C junction rise above ambient-well within its −40°C to +85°C operating range. No heatsink is required for typical bus-switching duty cycles.

How does the break-before-make feature of the 74CBTLV16212GRG4 prevent bus contention?

During S0–S2 state transitions, the 74CBTLV16212GRG4 guarantees zero overlap between old and new switch paths: the previous connection fully disables before the new one activates. This eliminates momentary short-circuits between B-port signals, preventing current surges, data corruption, and potential damage to driving transceivers. The feature is hardware-implemented and verified per JESD 78 testing, requiring no external timing control or firmware coordination.