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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments 74CBTLV1G125DBVRE4

Name: 74CBTLV1G125DBVRE4
Brand: Texas Instruments
SKU: 74CBTLV1G125DBVRE4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74CBTLV1G125DBVRE4

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: SC-74A, SOT-753

Datasheet:: 74CBTLV1G125DBVRE4.pdf

Description:: IC BUS SWITCH 1 X 1:1 SOT23-5

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Product details

Overview

74CBTLV1G125DBVRE4 from Texas Instruments is a low-voltage single FET bus switch in SOT-23 (DBV) package with 5 pins, featuring 5 Ω typical on-state resistance, rail-to-rail switching, and I_off support for partial-power-down mode. It operates from 2.3 V to 3.6 V supply and is used in high-speed data path isolation for portable computing and interface bridging.

For engineers reviewing the 74CBTLV1G125DBVRE4 datasheet, 74CBTLV1G125DBVRE4 pinout, 74CBTLV1G125DBVRE4 application, or 74CBTLV1G125DBVRE4 equivalent, key selection criteria include on-resistance stability across voltage range, I_off leakage under power-down, propagation delay below 0.25 ns at 3.3 V, and compatibility with 1.8-V/2.5-V/3.3-V logic systems.

Technical Context

This device implements a single-channel analog switch using NMOS FET topology with no internal level-shifting circuitry. Its control logic is positive-true: OE low enables A↔B conduction; OE high places both ports in high-impedance state. The switch supports bidirectional signal flow with no polarity restriction.

Designed for low-voltage mixed-signal environments, it guarantees rail-to-rail analog/digital signal handling across its full 2.3–3.6 V V_CC range and maintains sub-10 pF off-capacitance (C_io(OFF)) to minimize signal integrity degradation in high-frequency data paths.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	2.3 V to 3.6 V - Ensures interoperability with 1.8-V, 2.5-V, and 3.3-V logic families without level shifters.
r_on (Typical)	5 Ω at V_CC = 3 V - Enables minimal voltage drop and signal distortion for ≤64 mA data-path currents.
I_off	10 µA max at V_CC = 0 - Prevents backflow current during system partial power-down, protecting powered sections.
t_pd	0.15–0.25 ns at V_CC = 3.3 V - Supports >1 GHz data rates in point-to-point interconnects with negligible timing skew.
C_io(OFF)	7 pF - Limits capacitive loading on adjacent traces, preserving signal rise/fall times in dense PCB layouts.
Propagation Delay Variation	±0.3 V input swing tolerance - Maintains consistent timing across TTL- and CMOS-compatible input thresholds.

Pinout & Package

SOT-23 (DBV) package, 5-pin, 1.45 mm maximum height, JEDEC MO-178 compliant, tape-and-reel packaging (3000 units/reel), Q3 pin-1 orientation.

Pin/Terminal	Circuit Role	Design Meaning
1 (OE)	Output Enable input	Active-low control: logic low enables A↔B conduction; must be pulled up to V_CC during power sequencing to ensure defined high-Z state.
2 (GND)	Ground reference	Primary return path for switch current and control logic; requires low-inductance connection to system ground plane.
3 (A)	Data port A	Bidirectional analog/digital I/O terminal; electrically identical to B port with no internal directionality or buffering.
4 (V_CC)	Power supply	Supplies bias for internal FET gate drive and control logic; decoupling capacitor required within 1 cm of pin.
5 (B)	Data port B	Bidirectional analog/digital I/O terminal; symmetric with A port; no internal termination or ESD protection beyond specification limits.

Key Features

Feature	Design Value
5 Ω typical on-resistance	Minimizes insertion loss and voltage droop in high-speed digital and analog signal routing applications.
I_off partial-power-down support	Enables safe integration into multi-rail systems where V_CC may be sequenced or disabled independently.
Rail-to-rail signal switching	Preserves full logic swing (0 V to V_CC) without clipping or threshold-dependent distortion.
Sub-0.25 ns propagation delay	Meets timing budgets for DDR memory address/control lines and PCIe Gen1/Gen2 sideband signals.
7 pF off-state capacitance	Reduces crosstalk and reflection in parallel bus architectures operating above 100 MHz.

Applications

Memory Interface Isolation	USB Signal Routing
Use Scenario: Isolating DDR2/DDR3 address and command lines between memory controller and DRAM modules during power-state transitions. IC Role / Device Role / Timing Role: Bidirectional analog switch enabling/disabling signal paths without adding propagation delay or logic inversion. Use Value: Prevents bus contention during memory self-refresh mode while maintaining <0.25 ns timing margin for 400+ MHz clock domains.	Use Scenario: Routing USB 2.0 D+/D− differential pairs through multiplexing or hot-swap detection circuits in portable docking stations. IC Role / Device Role / Timing Role: Low-capacitance, low-resistance analog switch placed inline with data lanes to enable dynamic reconfiguration. Use Value: Delivers 7 pF C_io(OFF) and 5 Ω r_on to preserve USB eye diagram integrity up to 480 Mbps without equalization.
Processor Debug Port Switching	FPGA Configuration Bus Multiplexing
Use Scenario: Sharing JTAG or SWD debug interfaces among multiple microcontrollers on a shared test access port. IC Role / Device Role / Timing Role: Single-pole single-throw (SPST) analog switch controlled by host processor to route debug signals selectively. Use Value: Provides rail-to-rail switching and <10 µA I_off to avoid disturbing powered targets during debug session handover.	Use Scenario: Selecting between primary and backup configuration bitstreams for Xilinx Spartan or Intel Cyclone FPGAs. IC Role / Device Role / Timing Role: High-speed bus switch isolating dual SPI flash devices connected to FPGA configuration pins. Use Value: Ensures sub-10 pF off-capacitance prevents signal reflections on 20+ MHz configuration clocks and eliminates cross-talk between flash devices.

Memory Interface Isolation

USB Signal Routing

Use Scenario: Isolating DDR2/DDR3 address and command lines between memory controller and DRAM modules during power-state transitions.

IC Role / Device Role / Timing Role: Bidirectional analog switch enabling/disabling signal paths without adding propagation delay or logic inversion.

Use Value: Prevents bus contention during memory self-refresh mode while maintaining <0.25 ns timing margin for 400+ MHz clock domains.

Use Scenario: Routing USB 2.0 D+/D− differential pairs through multiplexing or hot-swap detection circuits in portable docking stations.

IC Role / Device Role / Timing Role: Low-capacitance, low-resistance analog switch placed inline with data lanes to enable dynamic reconfiguration.

Use Value: Delivers 7 pF C_io(OFF) and 5 Ω r_on to preserve USB eye diagram integrity up to 480 Mbps without equalization.

Processor Debug Port Switching

FPGA Configuration Bus Multiplexing

Use Scenario: Sharing JTAG or SWD debug interfaces among multiple microcontrollers on a shared test access port.

IC Role / Device Role / Timing Role: Single-pole single-throw (SPST) analog switch controlled by host processor to route debug signals selectively.

Use Value: Provides rail-to-rail switching and <10 µA I_off to avoid disturbing powered targets during debug session handover.

Use Scenario: Selecting between primary and backup configuration bitstreams for Xilinx Spartan or Intel Cyclone FPGAs.

IC Role / Device Role / Timing Role: High-speed bus switch isolating dual SPI flash devices connected to FPGA configuration pins.

Use Value: Ensures sub-10 pF off-capacitance prevents signal reflections on 20+ MHz configuration clocks and eliminates cross-talk between flash devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV1G125DCKR	SC-70 (DCK) package, same electrical specs, 1.1 mm max height vs. DBV's 1.45 mm.	Preferred for ultra-thin portable designs where board thickness is constrained.	Select when footprint area is secondary to Z-height; verify thermal derating due to higher θ_JA (252°C/W vs. 206°C/W).
74LVC1G3157DBVR	SPDT analog switch with select input instead of OE; 6.5 Ω r_on; 3.3-V only operation.	Used where signal routing between two sources to one destination is required, not simple enable/disable.	Choose only if SPDT functionality is needed; not a drop-in replacement due to different pinout and control logic.

Compared with SN74CBTLV1G125DCKR, 74CBTLV1G125DBVRE4 offers lower thermal resistance and wider board-level layout flexibility; compared with 74LVC1G3157DBVR, it provides simpler OE-based control and broader V_CC range but lacks multiplexing capability.

Availability

74CBTLV1G125DBVRE4 is available at Aetrix Electronics and suitable for memory interface isolation, USB signal routing, processor debug port switching, and FPGA configuration bus multiplexing requiring stable component supply across industrial temperature ranges.

Supply support for 74CBTLV1G125DBVRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The CBTLV logic family-including 74CBTLV1G125DBVRE4-is engineered for low-voltage, high-speed bus switching in portable and space-constrained systems where signal integrity and power sequencing robustness are critical.

FAQ

What is the recommended pull-up resistor value for the OE pin of the 74CBTLV1G125DBVRE4?

The OE pin of the 74CBTLV1G125DBVRE4 must be tied to V_CC via a pull-up resistor to ensure high-impedance state during power-up/down. TI specifies the minimum resistor value based on the driver's current-sinking capability-typically 10 kΩ is sufficient for standard CMOS drivers. Lower values (e.g., 4.7 kΩ) improve noise immunity but increase static current; values above 100 kΩ risk slow edge rates in noisy environments. Always verify against actual driver output characteristics in your design.

Does the 74CBTLV1G125DBVRE4 support 1.8-V logic levels on its A and B ports?

Yes, the 74CBTLV1G125DBVRE4 supports rail-to-rail switching and fully operates with 1.8-V logic levels on A and B ports when V_CC is set to 1.8 V-but its specified V_CC range is 2.3 V to 3.6 V per datasheet. At 1.8 V, performance is not guaranteed: r_on increases significantly, t_pd degrades, and I_off may exceed 10 µA. For true 1.8-V operation, TI recommends the SN74LVC1G3157 or SN74AUC1G125 families instead.

Can the 74CBTLV1G125DBVRE4 be used in analog signal paths such as audio or sensor interfaces?

Yes, the 74CBTLV1G125DBVRE4 can be used in analog signal paths including audio line-level switching and low-bandwidth sensor interfaces, provided signals remain within the 0 V to V_CC range and frequency content stays below ~100 MHz. Its 5 Ω r_on introduces negligible THD at audio frequencies, and 7 pF C_io(OFF) limits crosstalk. However, it lacks rail-to-rail input common-mode range beyond V_CC, so bipolar or AC-coupled signals require external biasing to stay within spec.

What is the maximum continuous current rating for the 74CBTLV1G125DBVRE4 switch channel?

The 74CBTLV1G125DBVRE4 has no explicit continuous current rating in its absolute maximum ratings table, but electrical characteristics specify r_on test conditions up to 64 mA. TI's application guidance indicates sustained currents above 24 mA may cause thermal stress in SOT-23 packages without heatsinking. For reliable long-term operation, limit DC current to ≤24 mA per channel; pulsed operation up to 64 mA is acceptable with duty cycle <10% and adequate PCB copper area for heat dissipation.

Is the 74CBTLV1G125DBVRE4 RoHS compliant and lead-free?

Yes, the 74CBTLV1G125DBVRE4 is RoHS compliant and lead-free. Per TI's packaging documentation, it features NIPDAU (nickel/palladium/gold) or NIPDAU/SN (tin-lead) lead finish, with MSL Level-1 rating and peak reflow temperature of 260°C. The "E4" suffix confirms TI's green packaging standard, and all active orderable variants-including SN74CBTLV1G125DBVR and 74CBTLV1G125DBVRG4-are certified to meet EU RoHS Directive 2011/65/EU and JEDEC J-STD-020 requirements.

74CBTLV1G125DBVRE4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: SC-74A, SOT-753

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Type:: Bus Switch

Circuit:: 1 x 1:1

Independent Circuits:: 1

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: SOT-23-5

74CBTLV1G125DBVRE4 FAQ

1.How can I place an order for 74CBTLV1G125DBVRE4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBTLV1G125DBVRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CBTLV1G125DBVRE4 reliable?

The price and inventory of 74CBTLV1G125DBVRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV1G125DBVRE4 is usually 5 days.

3.What payment methods are accepted for 74CBTLV1G125DBVRE4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLV1G125DBVRE4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74CBTLV1G125DBVRE4?

74CBTLV1G125DBVRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CBTLV1G125DBVRE4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBTLV1G125DBVRE4?

For technical support, including 74CBTLV1G125DBVRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV1G125DBVRE4 requirements.

6.How does Aetrix verify that 74CBTLV1G125DBVRE4 is sourced from the original manufacturer or authorized distributors?

All 74CBTLV1G125DBVRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV1G125DBVRE4 meets industry standards.

7.What is the process for return or replacement of 74CBTLV1G125DBVRE4?

All 74CBTLV1G125DBVRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV1G125DBVRE4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBTLV1G125DBVRE4 part is unused and in its original packaging.

Return procedure for 74CBTLV1G125DBVRE4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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