Texas Instruments 74CBTLV3125DBQRG4
- Part No.:
- 74CBTLV3125DBQRG4
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
74CBTLV3125DBQRG4.pdf
- Description:
- IC BUS SWITCH 1 X 1:1 16SSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
74CBTLV3125DBQRG4 from Texas Instruments is a low-voltage quadruple FET bus switch with independent 5Ω bidirectional switches, rail-to-rail signal switching (0–3.6 V), and Ioff partial-power-down protection. It operates from 2.3 V to 3.6 V, supports −40°C to +85°C ambient, and is used for protocol isolation in JTAG/SPI/GPIO routing on industrial and enterprise computing boards.
For engineers reviewing the 74CBTLV3125DBQRG4 datasheet, 74CBTLV3125DBQRG4 pinout, 74CBTLV3125DBQRG4 application, or 74CBTLV3125DBQRG4 equivalent, key selection criteria include on-resistance (5–8 Ω), Ioff leakage (<10 µA at VCC = 0), OE-controlled high-impedance state, and SSOP-16 package compatibility with hot-swap signal routing requirements.
Technical Context
The 74CBTLV3125DBQRG4 implements four independent analog/digital bidirectional FET switches, each controlled by a dedicated active-high output-enable (OE) input. Its CMOS transmission-gate architecture enables rail-to-rail operation without level-shifting and maintains channel isolation when powered down via Ioff.
Each switch exhibits low on-state resistance (5–8 Ω typical at VCC = 3.3 V, II = 64 mA), sub-nanosecond propagation delay (tpd ≤ 0.25 ns), and fast enable/disable timing (ten ≤ 4.4 ns, tdis ≤ 4.2 ns). The device complies with JESD 78 Class II latch-up immunity (>100 mA) and supports 2.3–3.6 V supply operation across −40°C to +85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.3 V to 3.6 V - Enables direct interface with 2.5 V and 3.3 V logic systems without level translation. |
| On-State Resistance | 5–8 Ω (typical at VCC = 3.3 V, 64 mA) - Minimizes voltage drop and signal attenuation in high-speed data paths. |
| Ioff Leakage | <10 µA at VCC = 0 V - Prevents backflow current during partial power-down, enabling safe hot-swap operation. |
| Propagation Delay | ≤0.25 ns at VCC = 3.3 V - Supports >1 GHz signal integrity in JTAG, SPI, and GPIO isolation applications. |
| Operating Temperature | −40°C to +85°C - Qualified for industrial and enterprise computing environments with no derating required. |
| ESD Rating | ±2000 V HBM - Meets standard handling requirements for automated PCB assembly and field service. |
| Latch-Up Immunity | >100 mA per JESD 78 Class II - Ensures robustness against transient overcurrent events in shared-bus systems. |
Pinout & Package
74CBTLV3125DBQRG4 uses the SSOP-16 (DBQ) package: 4.90 mm × 3.90 mm body, 0.65 mm lead pitch, 16-pin surface-mount with two NC (no internal connection) pins. Pin 1 is marked via package notch; pin 16 is VCC, pin 8 is GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 1B, 2A, 2B, 3A, 3B, 4A, 4B | I/O Channel Terminals | Bidirectional signal path per switch; fully rail-to-rail (0–3.6 V); interchangeable A/B directionality. |
| 1OE, 2OE, 3OE, 4OE | Active-High Enable Inputs | High = open-circuit (high-Z); low = closed switch; requires pullup to VCC for power-up safety. |
| VCC | Power Supply | Single 2.3–3.6 V supply; decoupling capacitor (0.1 µF) required adjacent to pin 16. |
| GND | Ground Reference | Common return for all channels and control logic; must connect to solid ground plane. |
| NC (Pins 9 & 16) | No Internal Connection | Unbonded pads; must remain unconnected and unstubbed on PCB layout. |
Key Features
| Feature | Design Value |
|---|---|
| 5Ω On-Resistance | Enables minimal insertion loss (<50 mV drop at 10 mA) for clean signal pass-through in high-speed digital buses. |
| Rail-to-Rail Switching | Supports full 0–3.6 V swing on all I/O ports - eliminates need for external level shifters in mixed-voltage systems. |
| Ioff Partial-Power-Down | Blocks damaging back-current when VCC = 0 V - allows safe live insertion of peripheral modules without sequencing. |
| Independent Channel Control | Four separate OE inputs permit granular enable/disable of individual data lines - critical for JTAG boundary scan and SPI multiplexing. |
| Class II Latch-Up Immunity | Withstands >100 mA transient faults per JESD 78 - ensures reliability in noisy industrial backplane environments. |
Applications
| Protocol Isolation | JTAG Debug Routing |
|---|---|
|
Use Scenario: Isolating SPI flash memory and RAM from CPU during firmware update or secure boot sequences. IC Role / Device Role / Timing Role: Bidirectional bus switch enabling/disabling data paths under software control via discrete OE signals. Use Value: Prevents unintended writes or reads during reconfiguration; eliminates need for complex power sequencing. |
Use Scenario: Sharing a single JTAG debug port among multiple SoCs or FPGA devices on a multi-processor board. IC Role / Device Role / Timing Role: Low-latency, low-capacitance signal router that preserves TCK/TMS/TDI/TDO timing integrity. Use Value: Achieves sub-ns propagation delay and <7 pF OFF-capacitance - maintains JTAG compliance up to 50 MHz. |
| Hot-Swap Peripheral Interface | GPIO Multiplexing |
|
Use Scenario: Enabling live insertion of PCIe add-in cards or modular I/O daughterboards in enterprise servers. IC Role / Device Role / Timing Role: Signal gate protecting host-side logic from backfeed during card power-up/down transitions. Use Value: Ioff functionality blocks >100 µA leakage at VCC = 0 - prevents system reset or data corruption during hot-plug events. |
Use Scenario: Reconfiguring shared GPIO pins between UART, I²C, and PWM functions on microcontroller-based edge nodes. IC Role / Device Role / Timing Role: Direction-agnostic analog switch allowing dynamic signal path assignment without firmware overhead. Use Value: 5Ω Ron and rail-to-rail support ensure full logic-level fidelity across 1.8 V, 2.5 V, and 3.3 V GPIO standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FET bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3126DBQR | Hex (6-channel) version in same SSOP-16 package; identical Ron, Ioff, and timing specs. | Provides two additional independent switches - suitable when board layout accommodates extra I/O routing. | Select when expanding signal isolation count without changing footprint or thermal profile. |
| 74LVC1G66GW,125 | Single-channel variant in SOT363 (6-pin); higher Ron (10 Ω typ), lower drive capability (32 mA), same VCC range. | Requires six discrete packages to match quad functionality - increases board area and BOM count. | Choose only for ultra-low-density routing where space constraints prohibit quad integration. |
Compared with SN74CBTLV3126DBQR and 74LVC1G66GW,125, the 74CBTLV3125DBQRG4 delivers optimal density-efficiency trade-off: four matched switches in one SSOP-16 package, lowest Ron per channel, and full industrial temperature support without derating.
Availability
74CBTLV3125DBQRG4 is available at Aetrix Electronics and suitable for enterprise computing, wired networking, and industrial automation applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for 74CBTLV3125DBQRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-reliability logic and interface solutions.
The SN74CBTLV3125 product line was designed specifically for low-voltage, high-speed signal routing in enterprise infrastructure and industrial control systems - prioritizing rail-to-rail fidelity, power-down safety, and ESD robustness.
FAQ
What is the maximum continuous current rating per channel for the 74CBTLV3125DBQRG4?
The 74CBTLV3125DBQRG4 supports a continuous channel current of 128 mA per switch, as specified in Absolute Maximum Ratings. This rating applies across the full operating temperature range (−40°C to +85°C) and ensures reliable conduction without thermal shutdown or parametric shift under sustained load conditions.
Does the 74CBTLV3125DBQRG4 require external pull-up resistors on its OE pins?
Yes - to guarantee high-impedance state during power-up or power-down, each OE pin of the 74CBTLV3125DBQRG4 must be tied to VCC through a pull-up resistor. The minimum value depends on the driver's current-sinking capability, but typical designs use 4.7 kΩ to 10 kΩ resistors placed close to the IC.
Can the 74CBTLV3125DBQRG4 operate with a 1.8 V supply voltage?
No - the 74CBTLV3125DBQRG4 has a minimum recommended supply voltage of 2.3 V. Operation below this threshold violates Recommended Operating Conditions and may result in undefined switching behavior, increased Ron, or failure to achieve rail-to-rail output swing. For 1.8 V systems, consider TI's SN74LVC1G66 or similar 1.65–5.5 V switches.
What is the thermal resistance (RθJA) of the 74CBTLV3125DBQRG4 in its SSOP-16 package?
The 74CBTLV3125DBQRG4 in SSOP-16 (DBQ) package has a junction-to-ambient thermal resistance (RθJA) of 90°C/W, as documented in Section 5.4. This value assumes standard JEDEC 2-layer board conditions and confirms suitability for industrial ambient temperatures without forced airflow or heatsinking.
How does the Ioff feature of the 74CBTLV3125DBQRG4 protect downstream circuitry?
The Ioff feature of the 74CBTLV3125DBQRG4 limits leakage current to <10 µA when VCC = 0 V and any I/O port is biased between 0–3.6 V. This prevents damaging back-current flow into a powered-down device, safeguarding upstream drivers and maintaining signal integrity during hot-swap or partial-system power-down scenarios.
74CBTLV3125DBQRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74CBTLV
- Package/Case:
- 16-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Type:
- Bus Switch
- Circuit:
- 1 x 1:1
- Independent Circuits:
- 4
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SSOP
74CBTLV3125DBQRG4 FAQ
1.How can I place an order for 74CBTLV3125DBQRG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CBTLV3125DBQRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74CBTLV3125DBQRG4 reliable?
The price and inventory of 74CBTLV3125DBQRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV3125DBQRG4 is usually 5 days.
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5.How can I obtain technical support or documentation for 74CBTLV3125DBQRG4?
For technical support, including 74CBTLV3125DBQRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV3125DBQRG4 requirements.
6.How does Aetrix verify that 74CBTLV3125DBQRG4 is sourced from the original manufacturer or authorized distributors?
All 74CBTLV3125DBQRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV3125DBQRG4 meets industry standards.
7.What is the process for return or replacement of 74CBTLV3125DBQRG4?
All 74CBTLV3125DBQRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV3125DBQRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CBTLV3125DBQRG4 part is unused and in its original packaging.
Return procedure for 74CBTLV3125DBQRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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