Nexperia USA Inc. 74CBTLV3126PW,118

Overview

74CBTLV3126PW,118 from Nexperia is a 4-bit high-speed CMOS bus switch with independent output enable inputs (1OE–4OE), operating from 2.3 V to 3.6 V supply. It delivers ≤5 Ω ON-state resistance at 3.3 V, <0.31 ns propagation delay, and rail-to-rail switching across A/B I/O ports-used in low-latency data path isolation for DDR memory buffers and FPGA I/O expansion.

For engineers reviewing the 74CBTLV3126PW,118 datasheet, 74CBTLV3126PW,118 pinout, 74CBTLV3126PW,118 application, or 74CBTLV3126PW,118 equivalent, key selection criteria include guaranteed IOFF partial power-down behavior, Schmitt-triggered OE inputs for slow-edge tolerance, and TSSOP14 package compatibility with high-density PCB layouts.

Technical Context

This device implements four independent bilateral analog switches controlled by dedicated OE pins, enabling per-channel signal path gating without affecting adjacent channels. Each switch exhibits bidirectional conduction, zero DC offset, and no internal level-shifting circuitry-supporting true rail-to-rail voltage translation between A and B ports.

The IOFF circuit actively disables outputs when VCC = 0 V, blocking backflow current up to ±50 μA, while Schmitt-triggered OE inputs maintain noise immunity across the full 2.3–3.6 V VCC range. Dynamic performance is defined by RC-limited propagation (not logic-gated), with tpd scaling linearly with load capacitance and RON.

Key Specifications

Pinout & Package

TSSOP14 (SOT402-1) package: plastic thin shrink small outline, 14 leads, 4.4 mm body width, 0.65 mm lead pitch, 1.20 mm max height.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 4-bit bus switch applications.

Compared with SN74CBT3126PWR and 74LVC1G3157GW,125, the 74CBTLV3126PW,118 uniquely combines per-channel OE, IOFF, and sub-5 Ω RON in a single 14-pin TSSOP-making it optimal for thermally managed, hot-pluggable, and multi-domain power systems.

Availability

74CBTLV3126PW,118 is available at Aetrix Electronics and suitable for DDR memory buffering, FPGA I/O expansion, hot-swappable module interfaces, and test access port multiplexing requiring stable component supply across industrial temperature ranges.

Supply support for 74CBTLV3126PW,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions optimized for efficiency-critical applications.

The 74CBTLV series targets high-speed digital interconnects in industrial, computing, and communications equipment-designed specifically for low-latency, low-power bus switching with robust power-down safety.

FAQ

What is the maximum allowable load capacitance for maintaining <0.31 ns propagation delay?

At VCC = 3.6 V, the 0.31 ns tpd specification assumes a 50 pF load capacitance per channel, as defined in Table 11 of the datasheet. Exceeding 50 pF increases tpd linearly per the RC time constant (RON × CL); for 100 pF, expect ~0.62 ns typical delay. Layout parasitics must be included in total CL calculation.

Can 1OE–4OE be tied together and driven by a single microcontroller GPIO?

Yes-OE inputs are CMOS-compatible and can be paralleled. However, doing so eliminates per-channel control and forfeits the key advantage of independent lane gating. If unified control suffices, verify that the combined input capacitance (4 × CI = 3.6 pF) remains within the driving GPIO's slew-rate capability at the target edge rate.

Does the device support level shifting between different VCC domains?

No-the 74CBTLV3126PW,118 is not a level shifter. It operates only within a single VCC domain (2.3–3.6 V) and passes signals bi-directionally between A and B ports at the same voltage rail. For level translation, use dedicated translators like NXH0108 or TXB0108.

How is the thermal pad on the DHVQFN variant handled in the TSSOP version?

The TSSOP14 (SOT402-1) package has no thermal pad-it relies on lead-frame conduction and PCB copper for heat dissipation. The DHVQFN14 (SOT762-1) variant includes an exposed thermal pad (pin 1), but this is absent in the PW variant. No thermal pad connection or soldering is required or possible for 74CBTLV3126PW,118.