Nexperia USA Inc. 74CBTLV3253BQ,115
- Part No.:
- 74CBTLV3253BQ,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
74CBTLV3253BQ,115.pdf
- Description:
- IC MUX/DEMUX 2 X 4:1 16DHVQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,127
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74CBTLV3253BQ,115 from Nexperia is a dual 1-of-4 CMOS bus switch multiplexer/demultiplexer in DHVQFN16 package, operating from 2.3 V to 3.6 V supply, featuring 5 Ω typical ON-resistance at 3.3 V, <0.25 ns propagation delay, and IOFF partial power-down protection. It routes bidirectional signals between two A ports and four B ports per channel under shared S0/S1 select and independent 1OE/2OE enable controls, used in high-speed data path switching for FPGA I/O expansion and memory interface isolation.
For engineers reviewing the 74CBTLV3253BQ,115 datasheet, 74CBTLV3253BQ,115 pinout, 74CBTLV3253BQ,115 application, or 74CBTLV3253BQ,115 equivalent, this page delivers verified electrical parameters, thermal-enhanced QFN package details, Schmitt-trigger control input behavior, IOFF leakage specs at VCC = 0 V, and real-world multiplexer timing constraints for signal integrity validation.
Technical Context
This device implements two independent analog/digital bidirectional 1-of-4 switch arrays with rail-to-rail voltage handling on all I/O ports and common select logic (S0, S1) shared across both channels. Each channel has dedicated active-low output enable (1OE, 2OE), enabling selective channel activation without affecting the other.
Its IOFF circuitry ensures sub-50 μA power-off leakage when VCC = 0 V, while Schmitt-trigger inputs tolerate slow edges across the full 2.3–3.6 V VCC range. The DHVQFN16 package provides enhanced thermal performance with exposed thermal pad and 0.85 mm profile, supporting high-density PCB layouts in industrial and telecom infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.3 V to 3.6 V - Enables direct interfacing with 2.5 V and 3.3 V logic families without level translation. |
| ON Resistance | Typ. 4.0 Ω at VCC = 3.3 V, ISW = 64 mA - Minimizes insertion loss and voltage drop in high-current signal paths. |
| Propagation Delay | Max. 0.25 ns - Supports >1 GHz data rates with negligible timing skew in critical routing applications. |
| IOFF Leakage | ±50 μA at VCC = 0 V - Prevents backflow current during hot-swap or partial power-down sequences. |
| Operating Temperature | −40 °C to +125 °C - Qualified for extended industrial and automotive under-hood environments. |
| ESD Protection | HBM >2000 V, CDM >1000 V - Ensures robustness against handling and board-level electrostatic events. |
| Switch Capacitance | CS(ON) = 20.0 pF - Limits capacitive loading on source drivers, preserving signal rise/fall times. |
Pinout & Package
DHVQFN16 (SOT763-1) package: 2.5 × 3.5 × 0.85 mm body, no leads, 16 terminals, exposed thermal pad (GND-connected recommended), compliant with JEDEC MO-241.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1OE | Active-low enable for Channel 1 - Must be pulled HIGH via resistor during power-up to ensure OFF-state default. |
| 2 | VCC | Main supply - Decoupling capacitor required within 1 cm for stable high-speed switching. |
| 3 | S1 | MSB select input - Shared by both channels; determines B-port index (0–3) with S0. |
| 4 | 2OE | Active-low enable for Channel 2 - Independent control allows asymmetric channel activation. |
| 5 | 1B4 | Channel 1 B-port 4 - Bidirectional I/O; low-impedance path to 1A when selected and 1OE = LOW. |
| 6 | S0 | LSB select input - Paired with S1 to decode 1-of-4 selection (00→1B1, 11→1B4). |
| 7 | 1B3 | Channel 1 B-port 3 - Supports hot-swap isolation when IOFF is active during VCC ramp. |
| 8 | 2B4 | Channel 2 B-port 4 - Electrically isolated from Channel 1; no crosstalk at DC or <302 MHz. |
| 9 | 1B2 | Channel 1 B-port 2 - Rail-to-rail compatible - passes signals from 0 V to VCC without clipping. |
| 10 | 2B3 | Channel 2 B-port 3 - Matches 1Bx timing specs; tpd and tdis identical across both channels. |
| 11 | 1B1 | Channel 1 B-port 1 - Lowest capacitance node (CS(OFF) = 5.2 pF) for minimal signal degradation. |
| 12 | 2B2 | Channel 2 B-port 2 - Shares same ON-resistance profile as 1Bx ports under identical bias conditions. |
| 13 | 1A | Channel 1 A-port - Primary bidirectional data path; connects to FPGA I/O banks or memory data lines. |
| 14 | 2B1 | Channel 2 B-port 1 - Used for redundant signal routing or parallel bus segmentation. |
| 15 | GND | Ground reference - Terminal 15 is functional GND; thermal pad must be soldered and connected to system GND plane. |
| 16 | 2A | Channel 2 A-port - Independent of 1A; supports dual-bus architectures like DDR address/command mirroring. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports full 0 V to VCC signal swing on all I/O ports - eliminates need for external biasing in mixed-signal systems. |
| IOFF partial power-down | Blocks current flow when VCC = 0 V - enables safe insertion/removal in live backplanes and modular compute systems. |
| Schmitt-trigger control inputs | Input hysteresis >0.3 V across 2.3–3.6 V VCC - rejects noise on S0/S1/1OE/2OE lines without external filtering. |
| Low ON-resistance flatness | RON variation <±1.5 Ω over 0–VCC input range at 3.3 V - ensures consistent signal attenuation across data amplitude. |
| Thermally enhanced DHVQFN | θJA = 110 K/W (typ.) - 30% lower junction-to-ambient resistance vs. TSSOP16, enabling higher sustained current density. |
Applications
| FPGA I/O Expansion | Memory Interface Isolation |
|---|---|
|
Use Scenario: Expanding limited FPGA GPIO count by time-multiplexing multiple peripheral buses onto shared pins. IC Role / Device Role / Timing Role: Dual-channel bidirectional switch enabling dynamic reconfiguration of I²C, SPI, and UART lines without glue logic. Use Value: Eliminates need for discrete MOSFET arrays; 0.25 ns tpd preserves setup/hold margins for 100+ MHz serial protocols. |
Use Scenario: Isolating DDR3/DDR4 command/address lines between memory controller and DIMM slots during power sequencing. IC Role / Device Role / Timing Role: Bus switch providing controlled break-before-make transition to prevent bus contention during warm reset. Use Value: IOFF blocks backfeed from powered DIMMs into unpowered controller; RON <5 Ω avoids signal integrity degradation. |
| Hot-Swappable Module Interconnect | Test Access Multiplexing |
|
Use Scenario: Enabling field-replaceable compute modules in telecom line cards where backplane remains live during module swap. IC Role / Device Role / Timing Role: Signal path gate that disconnects module I/O before physical removal and reconnects after insertion verification. Use Value: Sub-50 μA IOFF leakage prevents damage to host backplane drivers; Schmitt triggers reject insertion bounce transients. |
Use Scenario: Routing JTAG, SWD, or boundary-scan test signals to multiple ASICs on a dense server motherboard. IC Role / Device Role / Timing Role: Low-capacitance multiplexer selecting one DUT at a time for debug interface access without signal coupling. Use Value: CS(OFF) = 5.2 pF minimizes crosstalk between unselected devices; 302 MHz f(-3dB) supports high-speed debug clocking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 1-of-4 bus switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74CBTLV3253PWR | SOIC-16 package (SOT109-1); higher θJA (150 K/W); no exposed thermal pad. | Limited to lower ambient temperatures (<85 °C) and lower sustained current due to thermal constraints. | Select when legacy through-hole or wave-solder compatibility is required and thermal load is light. |
| 74LVC1G3157GW,125 | Single-channel 1-of-2 switch; smaller XSON6 package; 6 Ω RON at 3.3 V; only one OE input. | Requires two units and additional logic to replicate dual 1-of-4 functionality; increases board area and routing complexity. | Select only for space-constrained single-path applications where channel count and select flexibility are secondary. |
Compared with SN74CBTLV3253PWR and 74LVC1G3157GW,125, the 74CBTLV3253BQ,115 delivers superior thermal performance, guaranteed dual-channel operation in one package, and tighter RON matching across ports-critical for balanced signal routing in high-speed memory and FPGA interfaces.
Availability
74CBTLV3253BQ,115 is available at Aetrix Electronics and suitable for FPGA I/O expansion, memory interface isolation, hot-swappable module interconnect, and test access multiplexing requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for 74CBTLV3253BQ,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance logic, analog, and MOSFET solutions optimized for efficiency, reliability, and miniaturization in industrial, automotive, and computing applications.
The 74CBTLV3253BQ,115 belongs to Nexperia's CBTLV (Configurable Bus Transceiver Low-Voltage) family, engineered specifically for low-latency, low-power bidirectional signal routing in high-density digital systems with strict thermal and ESD requirements.
FAQ
What is the maximum recommended operating frequency for signal switching?
The device supports up to 302 MHz (−3 dB bandwidth) with 50 Ω load and 3.3 V supply, verified per Figure 17 test circuit. For reliable digital switching, maintain data rates below 1 GHz given its 0.25 ns max propagation delay and 4.0 Ω ON-resistance-ensuring signal integrity in DDR and PCIe Gen1 applications.
How should the thermal pad on the DHVQFN16 package be handled?
The exposed thermal pad (terminal 1 index area) must be soldered to a dedicated GND copper pour using ≥6 thermal vias (0.3 mm diameter) to internal GND planes. Per Figure 4 note, it may remain floating if unsoldered-but optimal thermal performance (θJA ≤ 110 K/W) requires GND connection and proper stencil aperture (80% coverage).
Does the device support level shifting between different supply domains?
No. The 74CBTLV3253BQ,115 is not a level shifter-it operates only within a single VCC domain (2.3–3.6 V). All I/O ports (A and B) must remain within 0 V to VCC. Cross-domain signaling requires external level-shifting circuitry or a dedicated translator IC such as the NXSA5102.
Can 1OE and 2OE be tied together for synchronized channel control?
Yes-1OE and 2OE may be connected to a common control signal. However, doing so eliminates independent channel gating. When tied, both channels activate/deactivate simultaneously, reducing flexibility in asymmetric bus configurations but simplifying enable logic in single-function systems.
74CBTLV3253BQ,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- 74CBTLV
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 2 x 4:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-DHVQFN (2.5x3.5)
74CBTLV3253BQ,115 FAQ
1.How can I place an order for 74CBTLV3253BQ,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74CBTLV3253BQ,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74CBTLV3253BQ,115 reliable?
The price and inventory of 74CBTLV3253BQ,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV3253BQ,115 is usually 5 days.
3.What payment methods are accepted for 74CBTLV3253BQ,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLV3253BQ,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74CBTLV3253BQ,115?
74CBTLV3253BQ,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74CBTLV3253BQ,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74CBTLV3253BQ,115?
For technical support, including 74CBTLV3253BQ,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV3253BQ,115 requirements.
6.How does Aetrix verify that 74CBTLV3253BQ,115 is sourced from the original manufacturer or authorized distributors?
All 74CBTLV3253BQ,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV3253BQ,115 meets industry standards.
7.What is the process for return or replacement of 74CBTLV3253BQ,115?
All 74CBTLV3253BQ,115 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV3253BQ,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74CBTLV3253BQ,115 part is unused and in its original packaging.
Return procedure for 74CBTLV3253BQ,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74CBTLV3253BQ,115 Tags
-
SN74HC138DR
Texas Instruments

-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage

-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments

-
74CBTLV3257GUX
Nexperia USA Inc.

-
74HC154BQ,118
Nexperia USA Inc.

-
P3S0200GMX
NXP USA Inc.

-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments

-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments

-
SN74HC138N
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

