Nexperia USA Inc. 74CBTLV3253DS,118

Overview

74CBTLV3253DS,118 from Nexperia is a dual 1-of-4 CMOS bus switch multiplexer/demultiplexer in SSOP16 package, operating from 2.3 V to 3.6 V supply, featuring 5 Ω typical ON-resistance, <0.25 ns propagation delay, and IOFF partial power-down protection for hot-swap applications in high-speed digital interconnects.

For engineers reviewing the 74CBTLV3253DS,118 datasheet, 74CBTLV3253DS,118 pinout, 74CBTLV3253DS,118 application, or 74CBTLV3253DS,118 equivalent, this device serves as a low-latency, rail-to-rail analog/digital signal routing solution with Schmitt-trigger control inputs, ESD-hardened I/O (HBM >2000 V), and guaranteed operation from –40 °C to +85 °C.

Technical Context

This device implements two independent 1-of-4 bidirectional analog switches sharing common select lines (S0, S1) and separate output enables (1OE, 2OE), enabling simultaneous channel selection across both mux/demux paths. Each switch exhibits rail-to-rail voltage handling and sub-5 Ω ON-resistance at 3.3 V, minimizing insertion loss and distortion in data path routing.

Its IOFF circuitry actively disables all switches when VCC = 0 V, blocking backflow current during partial power-down - critical for system-level hot-plug compliance. Schmitt-trigger inputs ensure robust timing margin against slow-rising control signals across the full 2.3–3.6 V supply range.

Key Specifications

Pinout & Package

74CBTLV3253DS,118 is housed in a plastic shrink small outline package (SSOP16), SOT519-1, with 16 leads, 0.635 mm lead pitch, and 3.9 mm body width - optimized for high-density PCB layouts while maintaining hand-solderability and reflow compatibility.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 1-of-4 bus switch applications.

Compared with SN74CBTLV3253PWR, the 74CBTLV3253DS,118 offers tighter thermal constraints but superior board-area efficiency; versus 74LVC2G53DP,125, it delivers full dual 1-of-4 functionality in one package with 2.5× lower ON-resistance and integrated select logic.

Availability

74CBTLV3253DS,118 is available at Aetrix Electronics and suitable for PCI Express routing, DDR memory isolation, industrial Ethernet PHY multiplexing, and FPGA I/O expansion requiring stable component supply across commercial and extended-temperature deployments.

Supply support for 74CBTLV3253DS,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable logic, analog, and MOSFET solutions with leadership in efficiency, miniaturization, and robustness for industrial, automotive, and consumer applications.

The 74CBTLV3253 belongs to Nexperia's CBTLV (Configurable Bus Transceiver Low-Voltage) logic family, engineered specifically for high-speed, low-power signal routing in next-generation digital interconnects where timing integrity and power sequencing resilience are critical.

FAQ

What is the maximum recommended load capacitance for maintaining specified propagation delay?

The datasheet specifies dynamic test conditions using 30 pF (for 2.3–2.7 V) and 50 pF (for 3.0–3.6 V) loads. Propagation delay remains within spec up to 50 pF; beyond that, tpd increases linearly with load capacitance due to RC time constant effects of the 4–8 Ω ON-resistance. For >50 pF loads, verify timing margins with actual board parasitics.

Can 74CBTLV3253DS,118 be used with 1.8 V logic levels on its control inputs?

No - control inputs (S0, S1, 1OE, 2OE) require VIH ≥ 2.0 V at VCC = 3.0–3.6 V and ≥1.7 V at VCC = 2.3–2.7 V. A 1.8 V GPIO cannot reliably assert HIGH; level translation (e.g., NXSLV1T244) is required for interfacing with 1.8 V controllers.

Is the GND pin (pin 8) internally connected to the exposed thermal pad in SSOP16?

No - the SSOP16 package (SOT519-1) has no exposed thermal pad. Pin 8 is the sole GND connection; it must be routed to a low-impedance ground plane. Unlike DHVQFN variants, there is no thermal pad or auxiliary grounding structure in this variant.

Does the device support break-before-make or make-before-break switching behavior?

It operates in break-before-make mode: all switches enter high-impedance OFF-state before any new path is enabled when select inputs change. This is enforced by the internal decoder and ensures no momentary short between B-port channels during transitions.