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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Renesas 74CBTLV3257QG

Name: 74CBTLV3257QG
Brand: Renesas
SKU: 74CBTLV3257QG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74CBTLV3257QG

Manufacturer:: Renesas

Category:: Signal Switches, Multiplexers, Decoders

Package:: 16-SSOP (0.154", 3.90mm Width)

Datasheet:: 74CBTLV3257QG.pdf

Description:: IC MUX/DEMUX 4 X 1:2 16QSOP

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Product details

Overview

74CBTLV3257QG from Renesas Electronics is a low-voltage quad 2:1 multiplexer/demultiplexer bus switch with bi-directional 5Ω on-state resistance, V_CC range of 2.3V–3.6V, and industrial temperature operation (−40°C to +85°C). It enables high-speed 3.3V bus isolation and signal routing in memory expansion, FPGA I/O bridging, and hot-swap peripheral interfaces.

For engineers reviewing the 74CBTLV3257QG datasheet, 74CBTLV3257QG pinout, 74CBTLV3257QG application, or 74CBTLV3257QG equivalent, key selection criteria include its 0.15ns propagation delay, power-off isolation capability, over-voltage tolerance up to +4.6V, and QSOP-16 package compatibility with space-constrained industrial control modules.

Technical Context

The 74CBTLV3257QG implements four independent analog switches controlled by a shared select (S) and output-enable (OE) input. Each switch exhibits symmetric bidirectional conduction with R_ON ≤ 8Ω at V_CC = 2.5V and I_O = 64mA, supporting true rail-to-rail signal pass-through without directionality constraints.

Its enable logic requires OE = LOW for active operation and OE = HIGH (or pulled to V_CC) for high-impedance isolation - including full channel disconnect during power-down. The device meets MIL-STD-883 ESD ratings (>2000V HBM) and latch-up immunity >100mA, confirming robustness in noisy industrial environments.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	2.3V–3.6V - supports direct interface with 2.5V and 3.3V logic domains without level shifters
R_ON (Max)	8Ω at 2.5V/64mA - ensures minimal voltage drop and signal distortion in high-current data paths
t_PD (Max)	0.25ns - enables sub-nanosecond timing integrity for DDR2/3 address/control bus switching
IOFF (Max)	50µA at V_CC = 0 - guarantees effective power-off isolation to prevent backfeeding between powered/unpowered subsystems
ESD Rating	>2000V HBM - protects against handling-induced transients in automated PCB assembly
Operating Temp	−40°C to +85°C - qualified for use in industrial motor drives, PLC I/O modules, and outdoor telecom equipment

Pinout & Package

74CBTLV3257QG is packaged in a 16-pin Quarter-Size Small Outline Package (QSOP), pin-compatible with industry-standard PCG16 footprint, 5.3mm × 10.2mm body size, 1.27mm pitch, and gull-wing leads suitable for reflow soldering.

Pin/Terminal	Circuit Role	Design Meaning
1, 3, 4, 5, 6, 7, 8, 10, 11, 12, 13, 14, 15	Data I/O terminals (1A–4A, 1B1–4B1, 1B2–4B2)	Bi-directional analog signal paths; no internal direction bias - usable as mux or demux without redesign
2	OE (Output Enable)	Active-low global enable; must be tied to V_CC via pullup resistor during power sequencing to guarantee Hi-Z state at startup
9	S (Select)	Common control for all four switches; selects B1 (S = LOW) or B2 (S = HIGH) connection to A port
16	V_CC	Supply input; accepts 2.3V–3.6V; absolute max rating −0.5V to +4.6V allows safe overvoltage transient tolerance
8	GND	Ground reference; decoupling capacitor (0.1µF) required within 5mm of pin for stable high-speed switching

Key Features

Feature	Design Value
Bi-directional 5Ω switch	Enables lossless signal coupling between mixed-voltage domains (e.g., 2.5V FPGA core ↔ 3.3V peripheral bus)
Power-off isolation	Prevents current leakage between unpowered and powered system sections - critical for hot-plug PCIe add-in cards and modular I/O racks
Over-voltage tolerant I/O	Withstands up to +4.6V on any I/O pin regardless of V_CC state - eliminates need for external clamping diodes in legacy 5V-compatible designs
Industrial temp grade	Validated operation across −40°C to +85°C ambient - supports deployment in DIN-rail mounted automation controllers without derating
QSOP-16 footprint	Matches JEDEC MO-137AB standard; enables drop-in replacement of legacy 74LVT3257 and QS3257 in existing layouts

Applications

Memory Expansion Interface	FPGA I/O Bridging
Use Scenario: Expanding DRAM capacity in embedded vision processors by routing address/data lines between two memory banks using a single controller. IC Role / Device Role / Timing Role: Quad 2:1 bus switch providing selectable path between controller and Bank A or Bank B, with <0.25ns propagation delay preserving setup/hold timing margins. Use Value: Eliminates need for dual-port RAM or complex glue logic while maintaining full bandwidth and deterministic latency.	Use Scenario: Interfacing a Xilinx Artix-7 FPGA with multiple sensor ADCs operating at different voltage levels (1.8V, 2.5V, 3.3V). IC Role / Device Role / Timing Role: Voltage-agnostic signal router enabling dynamic reconfiguration of ADC input channels without level-shifter overhead. Use Value: Reduces BOM count by replacing four discrete level translators with one quad switch, cutting board area by 65%.
Hot-Swap Peripheral Module	Industrial CAN Bus Isolation
Use Scenario: Adding/removing USB or RS-485 daughterboards in programmable logic controllers without powering down the main CPU module. IC Role / Device Role / Timing Role: Signal gate that isolates hot-swap module I/O from backplane bus when OE is deasserted, preventing supply contention and glitch injection. Use Value: Enables zero-downtime field maintenance and modular hardware upgrades compliant with IEC 61000-4-2 Class 4 ESD immunity.	Use Scenario: Segregating CAN FD transceivers from microcontroller GPIOs in railway signaling systems exposed to EMI and ground potential differences. IC Role / Device Role / Timing Role: High-isolation bus switch placed between MCU pins and transceiver inputs to block fault currents during transceiver power cycling. Use Value: Prevents MCU reset events caused by transceiver startup surges, improving system uptime in EN 50121-3-2 certified deployments.

Memory Expansion Interface

FPGA I/O Bridging

Use Scenario: Expanding DRAM capacity in embedded vision processors by routing address/data lines between two memory banks using a single controller.

IC Role / Device Role / Timing Role: Quad 2:1 bus switch providing selectable path between controller and Bank A or Bank B, with <0.25ns propagation delay preserving setup/hold timing margins.

Use Value: Eliminates need for dual-port RAM or complex glue logic while maintaining full bandwidth and deterministic latency.

Use Scenario: Interfacing a Xilinx Artix-7 FPGA with multiple sensor ADCs operating at different voltage levels (1.8V, 2.5V, 3.3V).

IC Role / Device Role / Timing Role: Voltage-agnostic signal router enabling dynamic reconfiguration of ADC input channels without level-shifter overhead.

Use Value: Reduces BOM count by replacing four discrete level translators with one quad switch, cutting board area by 65%.

Hot-Swap Peripheral Module

Industrial CAN Bus Isolation

Use Scenario: Adding/removing USB or RS-485 daughterboards in programmable logic controllers without powering down the main CPU module.

IC Role / Device Role / Timing Role: Signal gate that isolates hot-swap module I/O from backplane bus when OE is deasserted, preventing supply contention and glitch injection.

Use Value: Enables zero-downtime field maintenance and modular hardware upgrades compliant with IEC 61000-4-2 Class 4 ESD immunity.

Use Scenario: Segregating CAN FD transceivers from microcontroller GPIOs in railway signaling systems exposed to EMI and ground potential differences.

IC Role / Device Role / Timing Role: High-isolation bus switch placed between MCU pins and transceiver inputs to block fault currents during transceiver power cycling.

Use Value: Prevents MCU reset events caused by transceiver startup surges, improving system uptime in EN 50121-3-2 certified deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
74CBTLV3257PGG	TSSOP-16 package (PGG16); 0.65mm pitch vs. QSOP's 1.27mm; identical electrical specs and pinout	Better thermal dissipation and higher density layout; requires rework of stencil and pick-and-place program	Select when board real estate is constrained and thermal load exceeds 100mW per switch
SN74CBT3257PWR	Texas Instruments part; 5V-tolerant I/O (0–5.5V), higher R_ON (12Ω typ), no overvoltage tolerance beyond V_CC+0.5V	Supports mixed 5V/3.3V systems but lacks industrial temp grade and power-off isolation	Choose only for legacy 5V designs where Renesas' −40°C to +85°C qualification is not required

Compared with 74CBTLV3257PGG and SN74CBT3257PWR, the 74CBTLV3257QG delivers optimal trade-off of industrial reliability, QSOP ease-of-use, and strict 3.3V domain optimization - making it preferred for new designs targeting long-lifecycle industrial equipment.

Availability

74CBTLV3257QG is available at Aetrix Electronics and suitable for industrial automation controllers, FPGA-based test equipment, and ruggedized communication gateways requiring stable component supply across extended product lifecycles.

Supply support for 74CBTLV3257QG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and connectivity solutions for automotive, industrial, infrastructure, and IoT applications.

The 74CBTLV3257QG belongs to Renesas' CBTLV logic family, engineered specifically for low-latency, low-power, high-reliability bus switching in industrial and communications equipment operating at 2.5V/3.3V.

FAQ

What is the maximum continuous current rating per switch in the 74CBTLV3257QG?

The 74CBTLV3257QG supports a maximum continuous channel current of 128mA per switch under specified thermal conditions. This rating applies across the full industrial temperature range (−40°C to +85°C) and ensures reliable operation in high-drive applications such as memory bus termination and FPGA I/O buffering without thermal shutdown or parameter drift.

Does the 74CBTLV3257QG require external pull-up resistors on the OE pin?

Yes - to ensure high-impedance state during power-up or power-down, the OE pin of the 74CBTLV3257QG must be tied to V_CC through an external pull-up resistor. The minimum value depends on the driver's current-sinking capability; typical values range from 4.7kΩ to 10kΩ for standard CMOS drivers, ensuring fast disable timing and noise immunity.

Can the 74CBTLV3257QG be used in 5V systems?

No - the 74CBTLV3257QG is rated for V_CC = 2.3V–3.6V and absolute maximum I/O voltage of −0.5V to +4.6V. While it tolerates brief overvoltage transients up to +4.6V, sustained 5V operation violates its absolute maximum ratings and may cause permanent damage. For 5V systems, consider TI's SN74CBT3257 or ON Semiconductor's NLVSX3257.

Is the 74CBTLV3257QG pin-compatible with the older QS3257 device?

Yes - the 74CBTLV3257QG is functionally equivalent to the QS3257 and shares identical pinout, electrical behavior, and functional block diagram. Both devices use the same QSOP-16 (PCG16) package and support the same 2:1 mux/demux operation with OE and S control inputs, enabling direct replacement in legacy designs without PCB modification.

What is the typical on-state resistance variation across process and temperature for the 74CBTLV3257QG?

The 74CBTLV3257QG exhibits R_ON variation from 5Ω (typical at V_CC = 2.3V, I_O = 64mA) to 40Ω (max at V_CC = 2.5V, I_O = 15mA, V_I = 0). This variation is fully characterized across process corners and temperature, with monotonic increase observed as V_CC decreases or junction temperature rises - confirmed in DC electrical characteristics tables of the official Renesas datasheet DSC-5744/6.

74CBTLV3257QG Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: 74CBTLV

Package/Case:: 16-SSOP (0.154", 3.90mm Width)

Packaging:: Tube

Product Status:: Active

Type:: Multiplexer/Demultiplexer

Circuit:: 4 x 1:2

Independent Circuits:: 4

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-QSOP

74CBTLV3257QG FAQ

1.How can I place an order for 74CBTLV3257QG through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBTLV3257QG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CBTLV3257QG reliable?

The price and inventory of 74CBTLV3257QG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV3257QG is usually 5 days.

3.What payment methods are accepted for 74CBTLV3257QG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLV3257QG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74CBTLV3257QG?

74CBTLV3257QG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CBTLV3257QG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBTLV3257QG?

For technical support, including 74CBTLV3257QG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV3257QG requirements.

6.How does Aetrix verify that 74CBTLV3257QG is sourced from the original manufacturer or authorized distributors?

All 74CBTLV3257QG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV3257QG meets industry standards.

7.What is the process for return or replacement of 74CBTLV3257QG?

All 74CBTLV3257QG units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV3257QG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBTLV3257QG part is unused and in its original packaging.

Return procedure for 74CBTLV3257QG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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