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Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Texas Instruments 74CBTLV3257RGYRG4

Name: 74CBTLV3257RGYRG4
Brand: Texas Instruments
SKU: 74CBTLV3257RGYRG4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74CBTLV3257RGYRG4

Manufacturer:: Texas Instruments

Category:: Signal Switches, Multiplexers, Decoders

Package:: 16-VFQFN Exposed Pad

Datasheet:: 74CBTLV3257RGYRG4.pdf

Description:: IC MUX/DEMUX 4 X 1:2 16VQFN

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Product details

Overview

74CBTLV3257RGYRG4 from Texas Instruments is a low-voltage 4-bit 1-of-2 FET multiplexer/demultiplexer in a 16-pin VQFN package (RGY), featuring 5 Ω on-state resistance, rail-to-rail switching, and I_off partial-power-down support. It enables high-speed signal routing in 2.3–3.6 V systems with sub-nanosecond propagation delay, used for bus switching between dual peripherals in enterprise computing and wired networking.

For engineers reviewing the 74CBTLV3257RGYRG4 datasheet, 74CBTLV3257RGYRG4 pinout, 74CBTLV3257RGYRG4 application, or 74CBTLV3257RGYRG4 equivalent, key selection criteria include guaranteed 5 Ω r_on at 3.3 V/64 mA, −40°C to 85°C operating range, OE-active-low control, and VQFN thermal performance (R_θJA = 78.4°C/W).

Technical Context

The 74CBTLV3257RGYRG4 implements four independent bidirectional analog switches, each selectable between two B-side ports (B1/B2) via a shared S input, while OE enables/disables all channels simultaneously. Its FET-based architecture delivers rail-to-rail signal pass-through with no level-shifting limitation across the full 0–3.6 V I/O range.

Designed for partial-power-down operation, the device guarantees I_off ≤15 µA when V_CC = 0 V and any I/O is biased 0–3.6 V, preventing back-current flow and ensuring channel isolation during power sequencing. The VQFN (RGY) package supports high-density PCB layouts with exposed thermal pad for enhanced thermal dissipation.

Key Specifications

Parameter	Value and Actual Design Meaning
On-state resistance (r_on)	5 Ω typical at V_CC = 3.3 V, 64 mA - ensures minimal voltage drop and signal attenuation in high-speed data paths
Propagation delay (t_pd)	0.15–0.25 ns at V_CC = 2.5 V - enables reliable operation up to 200 MHz bus frequencies
Supply voltage range	2.3–3.6 V - compatible with modern low-voltage logic families including LVTTL and LVCMOS
I_off current	≤15 µA at V_CC = 0 V - prevents damaging backflow during hot-insertion or power sequencing
ESD rating (HBM)	2000 V - meets industrial-grade robustness requirements without external protection
Operating temperature	−40°C to +85°C - validated for enterprise computing and networking equipment environments
Input capacitance (C_i)	3 pF - minimizes loading on driving sources and preserves signal integrity

Pinout & Package

VQFN-16 (RGY) package: 4.00 mm × 3.50 mm body, 0.5 mm pitch, exposed thermal pad (pin 16 is V_CC; pin 8 is GND; pin 15 is OE; pin 1 is S).

Pin/Terminal	Circuit Role	Design Meaning
1A, 2A, 3A, 4A	Common I/O port (A-side)	Bidirectional data path shared across all four channels; connects to system bus or controller
1B1–4B2	Independent I/O ports (B1/B2 sides)	Two selectable endpoints per channel; B1 active when S = L, B2 active when S = H
S (Pin 15)	Select input	Single control line determining which B-side port is connected to corresponding A port
OE (Pin 13)	Output Enable (active low)	Asserting OE = L enables switching; OE = H forces all channels into high-impedance state
V_CC (Pin 14)	Power supply	Must be tied to OE via pullup resistor during power-up/down to guarantee defined high-Z state
GND (Pin 6)	Ground reference	Reference for all I/O and internal circuitry; connects to PCB thermal pad for heat dissipation

Key Features

Feature	Design Value
5 Ω low on-resistance	Enables <10 mV drop at 2 mA, preserving signal fidelity in precision analog and high-speed digital routing
Rail-to-rail I/O switching	Supports full 0–V_CC signal swing without clipping, eliminating need for level shifters in mixed-voltage systems
I_off partial-power-down	Blocks >99.9% of potential back-current when unpowered, enabling safe hot-swap and multi-rail domain isolation
100 mA latch-up immunity	Exceeds JESD78 Class II - eliminates risk of destructive latch-up under transient overvoltage conditions
2000 V HBM ESD protection	Reduces need for external TVS diodes in board-level ESD design, lowering BOM cost and layout area

Applications

Datacenter Bus Switching	Industrial Ethernet PHY Selection
Use Scenario: Selecting between two identical PCIe endpoint devices sharing one root complex link in a modular server blade. IC Role / Device Role / Timing Role: Bidirectional 4-bit bus switch isolating address/data lines; controlled by FPGA GPIO with OE and S pins. Use Value: Eliminates need for dual-port memory or complex arbitration logic; maintains sub-ns timing alignment across all 4 lanes.	Use Scenario: Routing MDIO/MDC and RMII signals between two Ethernet PHYs and a single MAC in a redundant industrial switch. IC Role / Device Role / Timing Role: Low-latency signal multiplexer enabling failover without MAC reinitialization or packet loss. Use Value: Achieves <100 ps skew between selected PHY's RMII clock and data, meeting IEEE 802.3u timing budgets.
Building Automation Controller I/O Expansion	Motor Drive Communication Interface
Use Scenario: Sharing a single UART or SPI interface between multiple sensor modules (temperature, occupancy, CO₂) in a smart HVAC controller. IC Role / Device Role / Timing Role: 4-channel demultiplexer directing serial commands from MCU to individual sensors based on S/OE state. Use Value: Reduces MCU pin count by 75%; maintains 3.3 V logic compatibility across all sensors without level translation.	Use Scenario: Isolating CAN FD and encoder feedback lines between main controller and dual motor inverters in servo drives. IC Role / Device Role / Timing Role: Signal switch enabling dynamic reconfiguration of diagnostic and control paths during maintenance mode. Use Value: Prevents cross-talk between CAN transceivers during hot-swap; supports 5 Mbps CAN FD with <0.3 UI jitter contribution.

Datacenter Bus Switching

Industrial Ethernet PHY Selection

Use Scenario: Selecting between two identical PCIe endpoint devices sharing one root complex link in a modular server blade.

IC Role / Device Role / Timing Role: Bidirectional 4-bit bus switch isolating address/data lines; controlled by FPGA GPIO with OE and S pins.

Use Value: Eliminates need for dual-port memory or complex arbitration logic; maintains sub-ns timing alignment across all 4 lanes.

Use Scenario: Routing MDIO/MDC and RMII signals between two Ethernet PHYs and a single MAC in a redundant industrial switch.

IC Role / Device Role / Timing Role: Low-latency signal multiplexer enabling failover without MAC reinitialization or packet loss.

Use Value: Achieves <100 ps skew between selected PHY's RMII clock and data, meeting IEEE 802.3u timing budgets.

Building Automation Controller I/O Expansion

Motor Drive Communication Interface

Use Scenario: Sharing a single UART or SPI interface between multiple sensor modules (temperature, occupancy, CO₂) in a smart HVAC controller.

IC Role / Device Role / Timing Role: 4-channel demultiplexer directing serial commands from MCU to individual sensors based on S/OE state.

Use Value: Reduces MCU pin count by 75%; maintains 3.3 V logic compatibility across all sensors without level translation.

Use Scenario: Isolating CAN FD and encoder feedback lines between main controller and dual motor inverters in servo drives.

IC Role / Device Role / Timing Role: Signal switch enabling dynamic reconfiguration of diagnostic and control paths during maintenance mode.

Use Value: Prevents cross-talk between CAN transceivers during hot-swap; supports 5 Mbps CAN FD with <0.3 UI jitter contribution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET multiplexer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBTLV3257PWRE4	TSSOP-16 package (5.00 × 4.40 mm); R_θJA = 129.1°C/W; same electrical specs	Lower thermal performance; suited for lower-power, space-tolerant designs	Choose when PCB real estate allows larger footprint and thermal budget exceeds 75°C rise at 100 mW
SN74CBTLV3257DGVRG4	TVSOP-16 package (3.60 × 4.40 mm); R_θJA = 123.1°C/W; identical r_on, t_pd, and I_off	Higher trace inductance due to longer leadframe; less optimal for >150 MHz operation	Prefer for legacy TSSOP-compatible footprints where VQFN rework is not feasible

Compared with SN74CBTLV3257PWRE4 and SN74CBTLV3257DGVRG4, the 74CBTLV3257RGYRG4 delivers superior thermal management (78.4°C/W) and compact size (4.00 × 3.50 mm), making it optimal for thermally constrained, high-density networking and compute modules requiring sustained 200 MHz operation.

Availability

74CBTLV3257RGYRG4 is available at Aetrix Electronics and suitable for datacenter bus switching, industrial Ethernet PHY selection, building automation controller I/O expansion, and motor drive communication interface applications requiring stable component supply across extended product lifecycles.

Supply support for 74CBTLV3257RGYRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

The SN74CBTLV3257 product line targets high-speed, low-voltage signal routing in enterprise infrastructure and industrial control systems, emphasizing rail-to-rail performance, power sequencing safety, and thermal efficiency in miniaturized packages.

FAQ

What is the maximum operating frequency supported by the 74CBTLV3257RGYRG4?

The 74CBTLV3257RGYRG4 is characterized for operation up to 200 MHz, verified through switching measurements at V_CC = 2.5 V and 3.3 V. Propagation delay remains below 0.25 ns, and layout-dependent parasitics (trace inductance/capacitance) determine actual usable bandwidth. For reliable 200 MHz use, maintain controlled-impedance routing and minimize stub lengths per TI application note SCDS040N.

Does the 74CBTLV3257RGYRG4 support hot-swap or partial-power-down operation?

Yes, the 74CBTLV3257RGYRG4 fully supports partial-power-down via its I_off feature: when V_CC = 0 V, leakage current is limited to ≤15 µA even with I/O pins biased 0–3.6 V. This prevents back-current damage during hot-insertion and ensures isolation between powered/unpowered domains - a requirement explicitly validated per JESD78 Class II latch-up testing.

What is the recommended pullup resistor value for OE on the 74CBTLV3257RGYRG4?

TI specifies that OE must be tied to V_CC via a pullup resistor to ensure high-impedance state during power-up/down. The minimum value depends on the driver's current-sinking capability; for standard CMOS drivers (I_OL ≥ 4 mA), a 10 kΩ resistor is sufficient. Lower values (e.g., 4.7 kΩ) improve noise immunity but increase static current - verify against your controller's output low spec in the 74CBTLV3257RGYRG4 datasheet Section 7.1.

Can the 74CBTLV3257RGYRG4 be used with 1.8 V logic systems?

No - the 74CBTLV3257RGYRG4 requires V_CC between 2.3 V and 3.6 V per Section 5.4 of the datasheet. At 1.8 V, the device fails to meet r_on, t_pd, and VIH/VIL specifications. For 1.8 V systems, consider TI's SN74LVC1G3157 or similar LVC-family switches explicitly rated down to 1.65 V.

How does the 74CBTLV3257RGYRG4 handle overvoltage conditions on I/O pins?

The 74CBTLV3257RGYRG4 tolerates I/O voltages up to 4.6 V regardless of V_CC level (per Absolute Maximum Ratings), enabling safe interfacing with higher-voltage peripherals. This overvoltage tolerance is achieved via internal clamping structures and is validated across all operating temperatures - no external protection diodes are required unless transient energy exceeds HBM 2000 V limits.

74CBTLV3257RGYRG4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74CBTLV

Package/Case:: 16-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Type:: Multiplexer/Demultiplexer

Circuit:: 4 x 1:2

Independent Circuits:: 4

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 2.3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-VQFN (4x3.5)

74CBTLV3257RGYRG4 FAQ

1.How can I place an order for 74CBTLV3257RGYRG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBTLV3257RGYRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CBTLV3257RGYRG4 reliable?

The price and inventory of 74CBTLV3257RGYRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLV3257RGYRG4 is usually 5 days.

3.What payment methods are accepted for 74CBTLV3257RGYRG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLV3257RGYRG4 transactions.

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4.How is shipping managed for 74CBTLV3257RGYRG4?

74CBTLV3257RGYRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CBTLV3257RGYRG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBTLV3257RGYRG4?

For technical support, including 74CBTLV3257RGYRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLV3257RGYRG4 requirements.

6.How does Aetrix verify that 74CBTLV3257RGYRG4 is sourced from the original manufacturer or authorized distributors?

All 74CBTLV3257RGYRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLV3257RGYRG4 meets industry standards.

7.What is the process for return or replacement of 74CBTLV3257RGYRG4?

All 74CBTLV3257RGYRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLV3257RGYRG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBTLV3257RGYRG4 part is unused and in its original packaging.

Return procedure for 74CBTLV3257RGYRG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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