Nexperia USA Inc. 74CBTLVD3245BQ,115

Overview

74CBTLVD3245BQ,115 from Nexperia is an 8-bit bidirectional level-shifting bus switch with active-low output enable (OE), designed for voltage translation between 3.0 V and 3.6 V domains. It features 5 Ω typical ON-state resistance, rail-to-rail switching on all A/B I/O ports, and IOFF partial power-down protection. It is used in high-speed digital interconnects such as memory expansion interfaces and FPGA I/O bridging where low-latency, low-capacitance signal routing is required.

For engineers reviewing the 74CBTLVD3245BQ,115 datasheet, 74CBTLVD3245BQ,115 pinout, 74CBTLVD3245BQ,115 application, or 74CBTLVD3245BQ,115 equivalent, key selection criteria include its 0.11 ns typical propagation delay, -40 °C to +125 °C operating range, DHVQFN20 thermal-enhanced package, and IOFF-enabled system-level power sequencing capability.

Technical Context

This device implements eight independent analog CMOS transmission gates controlled by a single OE input. Each channel supports bidirectional signal flow with no internal direction control - data direction is determined solely by external driver/receiver logic on either port. Schmitt-triggered OE input ensures robust noise immunity against slow-rising control signals.

The IOFF circuit actively disables all switches and isolates A/B ports when VCC = 0 V, limiting backflow current to ±50 µA across the full temperature range. Its 9.0 pF typical ON-state capacitance and 575 MHz -3 dB bandwidth support high-fidelity signal integrity in DDR clock distribution and PCIe sideband routing applications.

Key Specifications

Pinout & Package

DHVQFN20 (SOT764-1) package: 2.5 mm × 4.5 mm × 0.85 mm body, thermally enhanced exposed pad (GND(1)), no leads, 20 terminals. Pin 1 index area located at top-left corner; terminal 1 is GND (mechanically indexed but electrically isolated unless soldered to system ground).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit bidirectional bus switch applications.

Compared with SN74CBT3245APWR and 74LVC245ABQ,115, the 74CBTLVD3245BQ,115 delivers superior thermal performance, guaranteed IOFF protection, and sub-0.2 ns timing - making it the only option qualified for industrial-grade hot-plug and extended-temperature interconnects.

Availability

74CBTLVD3245BQ,115 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, PCIe sideband routing, and industrial sensor hub interconnects requiring stable component supply across extended temperature and power sequencing conditions.

Supply support for 74CBTLVD3245BQ,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions optimized for efficiency and miniaturization in industrial, automotive, and computing applications.

The 74CBTLVD series targets high-speed digital interconnects requiring ultra-low latency, rail-to-rail analog switching, and robust power sequencing - specifically engineered for FPGA, memory, and processor interface consolidation.

FAQ

What is the maximum allowable voltage on A/B pins when VCC = 0 V?

The absolute maximum rating allows -0.5 V to VCC + 0.5 V on A/B pins. With VCC = 0 V, this means -0.5 V to +0.5 V. Exceeding these limits risks permanent damage per IEC 60134 limiting values. The IOFF circuit holds leakage to ±50 µA within this range but does not extend voltage tolerance beyond the specified limits.

Can 74CBTLVD3245BQ,115 be used for analog signal switching (e.g., audio or sensor signals)?

Yes - its rail-to-rail analog switching, 5 Ω RON, and 9.0 pF ON-capacitance support DC-coupled analog signals up to ~100 MHz. However, it lacks dedicated analog specifications (e.g., THD, crosstalk); use is limited to low-precision, bandwidth-constrained applications like sensor multiplexing or reference voltage routing - not high-fidelity audio paths.

Is the exposed thermal pad (GND(1)) required to be soldered to PCB ground?

No - the pad is electrically isolated and has no mandatory connection. If soldered, it must remain floating or be connected to system GND to maintain thermal performance and EMI control. Per datasheet note (1), no electrical or mechanical requirement exists to solder it, but doing so improves thermal dissipation by ~20 °C/W in typical layouts.

Does OE require a pull-up or pull-down resistor for reliable operation?

No external resistor is required. The OE input incorporates a Schmitt trigger with defined VIH (≥2.0 V) and VIL (≤0.9 V) thresholds and internal weak pull-down - ensuring deterministic HIGH/LOW states even with unterminated control traces. External resistors are only needed if driving OE from an open-drain source or to override the internal bias.