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NXP Semiconductors 74CBTLVD3245DS,118

Part No.:
74CBTLVD3245DS,118
Manufacturer:
NXP Semiconductors
Category:
Signal Switches, Multiplexers, Decoders
Package:
20-SSOP (0.154", 3.90mm Width)
Datasheet:
Aetrix74CBTLVD3245DS,118.pdf
Description:
IC BUS SWITCH 8 X 1:1 20SSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,764

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Product details

Overview

74CBTLVD3245DS,118 from Nexperia is an 8-bit level-shifting bus switch with active-low output enable (OE), designed for bidirectional signal routing between A and B ports. It operates from 3.0 V to 3.6 V, features 5 Ω typical ON-resistance, rail-to-rail switching, and IOFF partial power-down protection. It is used in high-speed digital interconnects such as memory expansion, FPGA I/O bridging, and mixed-voltage system buses.

For engineers reviewing the 74CBTLVD3245DS,118 datasheet, 74CBTLVD3245DS,118 pinout, 74CBTLVD3245DS,118 application, or 74CBTLVD3245DS,118 equivalent, this device delivers low-latency (<0.22 ns propagation delay), ESD-hardened (HBM >2000 V), temperature-stable (−40 °C to +125 °C) switching for voltage-level translation and bus isolation in industrial and telecom infrastructure.

Technical Context

The 74CBTLVD3245DS,118 implements eight independent CMOS transmission gate switches controlled by a single OE input. Each switch supports bidirectional, rail-to-rail analog/digital signal pass-through with no internal level translation circuitry-voltage translation occurs inherently via I/O port biasing. Schmitt-triggered OE input ensures robust timing margin against slow-rising control signals.

Its IOFF circuitry actively disables all switches and blocks backflow current when VCC = 0 V, enabling hot-insertion and partial power-down operation. The device complies with JEDEC JESD8-B/JESD36 for 3.0–3.6 V operation and meets AEC-Q100-011 CDM ESD requirements (>1000 V).

Key Specifications

Parameter Value and Actual Design Meaning
Supply voltage 3.0 V to 3.6 V - defines compatible logic families (e.g., LVTTL, LVCMOS33) and sets maximum allowable I/O swing.
ON resistance (RON) Typ. 3.7 Ω at 3.0–3.6 V - enables <100 mV voltage drop at 24 mA, preserving signal integrity in high-speed data paths.
Propagation delay (tpd) Max 0.22 ns (−40 °C to +125 °C) - supports >1 GHz signal bandwidth without timing degradation.
Enable/disable time ten max 6.0 ns, tdis max 8.0 ns - ensures fast bus arbitration and dynamic reconfiguration in multi-master systems.
IOFF leakage ±50 μA at VCC = 0 V - prevents damaging back-current during power sequencing or hot-swap events.
ESD rating HBM >2000 V, CDM >1000 V - provides robust handling in automated assembly and field-replaceable module environments.
Operating temperature −40 °C to +125 °C - qualified for under-hood automotive modules, base station RF front-ends, and industrial PLC controllers.

Pinout & Package

74CBTLVD3245DS,118 is packaged in DHVQFN20 (SOT764-1), a 2.5 × 4.5 × 0.85 mm leadless quad flat package with 20 terminals, thermal enhancement, and exposed die pad (non-soldered or GND-connected per design).

Pin/Terminal Circuit Role Design Meaning
n.c. No-connect terminal Terminal 1 is unconnected; no electrical function or mechanical requirement for soldering.
A1–A8 Data I/O port A Eight bidirectional signal terminals accepting 0–VCC voltage levels; connect to source-side logic (e.g., processor bus).
GND Ground reference Terminal 10 establishes 0 V reference for all internal circuitry and ESD protection networks.
B1–B8 Data I/O port B Eight bidirectional signal terminals mirroring A-port behavior; connect to sink-side logic (e.g., peripheral bus).
OE Active-low output enable Terminal 19 controls all eight switches: LOW enables conduction, HIGH places outputs in high-impedance state.
VCC Positive supply Terminal 20 powers internal control logic and switch biasing; must be decoupled locally per high-speed layout guidelines.

Key Features

Feature Design Value
Rail-to-rail switching Supports full 0 V to VCC analog/digital signal pass-through without clamping or distortion-enables true level shifting between mismatched voltage domains.
IOFF partial power-down Prevents destructive back-current flow when VCC is removed while A/B ports remain biased-critical for hot-plug and power-gated subsystems.
Schmitt-trigger OE input Guarantees clean switching despite slow-rising/falling control edges (Δt/ΔV ≤ 200 ns/V), eliminating need for external debouncing or timing margins.
Low ON capacitance CS(ON) = 9.0 pF typical - minimizes loading on high-frequency signals and preserves edge rate in >500 MHz applications.
High noise immunity Input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.9 V at VCC = 3.6 V) provide >1.1 V noise margin-resists crosstalk and ground bounce in dense PCB layouts.

Applications

Memory Expansion Interface FPGA I/O Bridging

Use Scenario: Expanding DDR2/DDR3 memory capacity across multiple DIMM slots using shared address/data bus lines.

IC Role / Device Role / Timing Role: Bidirectional bus switch isolating memory channels during access arbitration; enables dynamic channel selection without signal contention.

Use Value: Eliminates need for complex bus buffers or multiplexers-reduces BOM count and board area while maintaining sub-nanosecond timing alignment.

Use Scenario: Interfacing 1.8 V FPGA I/O banks to 3.3 V peripheral ICs (e.g., ADCs, DACs, sensors) in mixed-voltage signal chains.

IC Role / Device Role / Timing Role: Level-shifting bus switch providing transparent voltage-domain translation without clock domain crossing logic.

Use Value: Delivers deterministic latency (<0.22 ns) and rail-to-rail signal fidelity-preserves setup/hold timing margins critical for high-resolution data acquisition.

Industrial Backplane Bus Telecom Line Card Isolation

Use Scenario: Isolating CPU-to-backplane communication in modular PLC chassis where individual slots may be powered down independently.

IC Role / Device Role / Timing Role: Hot-swap-capable bus switch enabling live insertion/removal of I/O modules without disrupting main controller operation.

Use Value: IOFF protection prevents backfeed into unpowered slots-ensures system-level reliability and eliminates need for auxiliary power sequencing circuitry.

Use Scenario: Segregating control plane (3.3 V) and data plane (1.8 V) buses on high-density line cards in 5G baseband units.

IC Role / Device Role / Timing Role: Low-capacitance, high-bandwidth switch enabling simultaneous control signaling and high-speed serial data routing over shared traces.

Use Value: 575 MHz −3 dB bandwidth and 9.0 pF ON-state capacitance support multi-Gbps SerDes sideband signaling without signal integrity degradation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74CBT3245PWR Higher VCC range (4.5–5.5 V); no IOFF; 7 Ω RON typical; −40 °C to +85 °C only Requires 5 V supply; unsuitable for partial power-down or extended temperature industrial use Select when interfacing legacy 5 V logic and thermal constraints permit narrower operating range.
74LVC2G66DP,125 2-channel, not 8-channel; 3.3 V only; 10 Ω RON typical; no Schmitt-trigger OE; smaller XSON8 package Limited channel count requires parallel placement for 8-bit operation; lacks hot-swap safety features Choose for space-constrained, low-pin-count designs where full 8-bit integration is unnecessary.

Compared with SN74CBT3245PWR and 74LVC2G66DP,125, the 74CBTLVD3245DS,118 uniquely combines 8-channel integration, IOFF-enabled hot-swap capability, Schmitt-triggered control, and extended −40 °C to +125 °C operation-making it the only option qualified for thermally demanding, fault-tolerant industrial backplanes.

Availability

74CBTLVD3245DS,118 is available at Aetrix Electronics and suitable for memory expansion interfaces, FPGA I/O bridging, industrial backplane buses, telecom line card isolation, and mixed-voltage system interconnects requiring stable component supply across automotive-grade temperature ranges and long production lifecycles.

Supply support for 74CBTLVD3245DS,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions optimized for efficiency, miniaturization, and robustness in high-volume applications.

The 74CBTLVD3245DS,118 belongs to Nexperia's CBTLV family of advanced bus switches, engineered specifically for low-latency, high-bandwidth, mixed-voltage digital interconnect in industrial automation, telecom infrastructure, and computing platforms.

FAQ

What is the maximum operating temperature range for the 74CBTLVD3245DS,118?

The 74CBTLVD3245DS,118 is fully specified from −40 °C to +125 °C, meeting industrial and extended-temperature requirements. This range is validated across all key parameters including ON-resistance, propagation delay, and IOFF leakage-ensuring reliable operation in base station RF modules, motor drive controllers, and under-hood automotive ECUs where ambient heat exceeds 105 °C.

Does the 74CBTLVD3245DS,118 support true bidirectional level shifting?

Yes, the 74CBTLVD3245DS,118 supports true bidirectional, rail-to-rail signal pass-through without internal voltage translation circuitry. Its CMOS transmission gate architecture allows signals from either A or B port to propagate with minimal distortion across the full 0 V to VCC range-enabling seamless interface between 1.8 V, 2.5 V, and 3.3 V logic domains when appropriate port biasing is applied externally.

How does the IOFF feature protect the 74CBTLVD3245DS,118 during power-down?

The IOFF circuitry in the 74CBTLVD3245DS,118 actively disables all eight switches and limits OFF-state leakage to ±50 μA when VCC = 0 V-preventing damaging backflow current from powered A/B ports into the unpowered device. This enables safe hot-swap operation in modular systems and eliminates risk of latch-up or thermal overstress during partial power sequencing.

What is the typical ON-state capacitance of the 74CBTLVD3245DS,118?

The 74CBTLVD3245DS,118 exhibits a typical ON-state capacitance (CS(ON)) of 9.0 pF per channel at VCC = 3.3 V. This low value minimizes signal loading and preserves edge rates in high-speed applications such as DDR memory buses and SerDes sideband control links-supporting >500 MHz bandwidth without significant rise-time degradation.

Is the 74CBTLVD3245DS,118 pin-compatible with other packages in the same family?

No-the 74CBTLVD3245DS,118 uses the DHVQFN20 (SOT764-1) package, which has a distinct 2.5 × 4.5 mm footprint and 20-terminal layout. It is not pin-compatible with the TSSOP20 (SOT360-1) variant (74CBTLVD3245PW) due to differing pin assignments and thermal pad configuration. Layout redesign is required when migrating between these packages.

74CBTLVD3245DS,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
20-SSOP (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Bus Switch
Circuit:
8 x 1:1
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP

74CBTLVD3245DS,118 FAQ

1.How can I place an order for 74CBTLVD3245DS,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74CBTLVD3245DS,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74CBTLVD3245DS,118 reliable?

The price and inventory of 74CBTLVD3245DS,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74CBTLVD3245DS,118 is usually 5 days.

3.What payment methods are accepted for 74CBTLVD3245DS,118?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74CBTLVD3245DS,118 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74CBTLVD3245DS,118?

74CBTLVD3245DS,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74CBTLVD3245DS,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74CBTLVD3245DS,118?

For technical support, including 74CBTLVD3245DS,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74CBTLVD3245DS,118 requirements.

6.How does Aetrix verify that 74CBTLVD3245DS,118 is sourced from the original manufacturer or authorized distributors?

All 74CBTLVD3245DS,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74CBTLVD3245DS,118 meets industry standards.

7.What is the process for return or replacement of 74CBTLVD3245DS,118?

All 74CBTLVD3245DS,118 units undergo pre-shipment inspection (PSI). If there is an issue with 74CBTLVD3245DS,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74CBTLVD3245DS,118 part is unused and in its original packaging.

Return procedure for 74CBTLVD3245DS,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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