Nexperia USA Inc. 74CBTLVD3861BQ,118

Overview

74CBTLVD3861BQ,118 from Nexperia is a 10-bit 3.3 V to 1.8 V level-translating bus switch with active-low output enable (OE), designed for bidirectional signal routing between mismatched voltage domains in high-speed digital systems. It features 4 Ω typical ON-resistance, 0.11 ns propagation delay, and operates across -40 °C to +125 °C. Used in DDR memory interface buffering and FPGA I/O expansion where low-latency, low-capacitance switching is critical.

For engineers reviewing the 74CBTLVD3861BQ,118 datasheet, 74CBTLVD3861BQ,118 pinout, 74CBTLVD3861BQ,118 application, or 74CBTLVD3861BQ,118 equivalent, key selection criteria include its 3.3 V → 1.8 V level-shifting capability, IOFF partial power-down support, Schmitt-trigger OE input for noise immunity, and DHVQFN24 thermal-enhanced package for dense PCB layouts.

Technical Context

This device implements a CMOS-based transmission-gate architecture enabling true bidirectional signal flow between A and B ports without direction control. Its IOFF circuitry ensures sub-μA leakage when VCC = 0 V, supporting hot-insertion and partial power-down modes in multi-rail systems.

The Schmitt-trigger input on OE provides hysteresis (typ. 0.4 V) across the full 3.0–3.6 V VCC range, eliminating need for external debouncing in noisy environments. Pass voltage remains ≤1.85 V at 4 mA load and -40 °C, ensuring reliable 1.8 V logic high delivery from 3.3 V sources.

Key Specifications

Pinout & Package

DHVQFN24 (SOT815-1) package: 3.5 × 5.5 × 0.85 mm body, 24-terminal no-lead thermal-enhanced quad flat design with exposed thermal pad (terminal 1 index area). Compatible with fine-pitch SMT reflow and supports high-density routing via bottom-side thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 10-bit level-shifting bus switch applications.

Compared with SN74CBT3384DBQR and 74AVC16T245DGGR, the 74CBTLVD3861BQ,118 uniquely combines 10-bit width, IOFF-enabled partial power-down, and single 3.3 V supply in a thermally enhanced QFN-making it optimal for space-constrained, multi-rail industrial controllers requiring guaranteed hot-swap safety.

Availability

74CBTLVD3861BQ,118 is available at Aetrix Electronics and suitable for DDR memory interface buffering, FPGA I/O expansion, PCIe slot adapter logic, and automotive infotainment hub designs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74CBTLVD3861BQ,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable, and efficient logic, analog, and discrete components for automotive, industrial, mobile, and consumer markets.

The 74CBTLVD3861 belongs to Nexperia's advanced bus switch portfolio, engineered specifically for high-speed, low-power level translation in multi-voltage digital systems where signal integrity, thermal efficiency, and robustness across wide temperature ranges are critical.

FAQ

Can the 74CBTLVD3861BQ,118 translate from 1.8 V to 3.3 V?

Yes-it operates bidirectionally: signals applied to B-port (1.8 V domain) appear at A-port (3.3 V domain) with minimal attenuation, provided VCC remains at 3.3 V. The device does not generate voltage; it passes signals through its low-RON switch, so output levels reflect input levels clamped by the VCC-referenced internal structure. No external biasing is required.

Is the thermal pad (terminal 1) required to be soldered to ground?

No-terminal 1 is a mechanical index marker with no electrical function. The datasheet explicitly states it is "not connected" and that soldering is optional. If soldered, the land must remain electrically floating or be connected to GND; connecting it to any other net may compromise thermal performance or cause unintended coupling.

What is the maximum capacitive load this device can drive while maintaining specified timing?

At 30 pF load (per Table 10), propagation delay remains ≤0.22 ns across -40 °C to +125 °C. Driving >30 pF increases RC delay linearly-e.g., 60 pF raises tpd to ~0.44 ns. For >50 pF loads, consider adding series termination or verify setup/hold margins against target clock frequency using the 9.3 Ω max RON value.

Does OE require an external pull-up resistor during power-up?

Yes-per Section 1, OE must be tied to VCC via a pull-up resistor to ensure high-impedance OFF-state during power-up/power-down. Minimum resistor value depends on the driver's sink capability; for typical 20 μA OE leakage, a 100 kΩ resistor limits current to 33 μA at 3.3 V, satisfying the requirement while minimizing static power.