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Texas Instruments 74GTLP1394DGVRE4
- Part No.:
- 74GTLP1394DGVRE4
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
74GTLP1394DGVRE4.pdf
- Description:
- IC TRANSLATOR BIDIR 16TVSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,331
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Product details
Overview
74GTLP1394DGVRE4 from Texas Instruments is a 2-bit LVTTL-to-GTLP bidirectional bus transceiver with split LVTTL port, adjustable edge-rate control (ERC), selectable polarity (true/inverted), and dedicated feedback path for diagnostics. It delivers 100 mA GTLP drive into distributed backplane loads down to 11 Ω, supports live insertion via Ioff, power-up 3-state, and BIAS VCC, and operates at 3.3 V supply with 5-V-tolerant LVTTL inputs. It interfaces between TI 1394 PHY controllers (e.g., TSB14AA1) and GTLP backplanes in S50/S100 (25/50 Mbps) systems.
For engineers reviewing the 74GTLP1394DGVRE4 datasheet, 74GTLP1394DGVRE4 pinout, 74GTLP1394DGVRE4 application, or 74GTLP1394DGVRE4 equivalent, key selection criteria include GTLP/LVTTL level translation capability, ERC-controlled rise/fall times (1.2–2.5 ns fast mode), split-port feedback for real-time monitoring, live-insertion support, and compatibility with IEEE 1394 backplane physical-layer implementations on VME/FB+/CPCI architectures.
Technical Context
The 74GTLP1394DGVRE4 implements dual-directional signal translation between 3.3-V LVTTL logic (A-port, control inputs) and GTLP backplane signaling (B-port), using differential input reference (VREF = 1 V for GTLP) and termination voltage (VTT = 1.5 V). Its TI-OPC™ circuitry actively limits overshoot on unevenly loaded backplanes, while OEC™ improves signal integrity and reduces EMI.
It features three independent enable paths: OEAB controls B-port output direction (A→B), OEBY enables Y outputs (B→Y), and T/C selects true or complementary data polarity. ERC input adjusts B-port edge rates-GND yields slow edges (tr = 2.0 ns, tf = 2.5 ns), VCC yields fast edges (tr = 1.2 ns, tf = 1.8 ns)-optimized for distributed RLC backplane loads per TI-SPICE models.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | VCC = 3.15–3.45 V; ensures stable GTLP interface operation and compatibility with 3.3-V system rails. |
| GTLP Output Drive | 100 mA sink per B-port pin; enables incident-wave switching on heavily loaded backplanes (Z₀ ≥ 11 Ω). |
| LVTTL I/O Drive | ±24 mA on A/Y ports; supports standard LVTTL fanout and 5-V tolerance for mixed-voltage board design. |
| Propagation Delay (A→B) | 3.6 ns typical (fast edge); meets timing budget for 50-Mbps (S100) IEEE 1394 backplane data transfer. |
| Edge-Rate Control | ERC input selects slow (tr/tf ≈ 2.0/2.5 ns) or fast (tr/tf ≈ 1.2/1.8 ns) B-port transitions for signal integrity tuning. |
| Live Insertion Support | Ioff < 10 µA at VCC = 0 V; prevents backflow current during hot-plug; BIAS VCC precharges B-port I/O before VCC ramp. |
| Input Thresholds | VREF = 1 V (GTLP), VIH(A-port) = 2 V min; enables robust noise margin in electrically noisy backplane environments. |
Pinout & Package
74GTLP1394DGVRE4 is packaged in a 24-pin TVSOP (DGV) with 0.4-mm pitch, 4.4-mm width, and 7.8-mm length. Thermal impedance θJA = 120°C/W enables operation up to 85°C ambient in high-density backplane slots.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, A2 | LVTTL Data Inputs | Accept 3.3-V LVTTL or 5-V-tolerant signals from link-layer controller; feed forward path to B-port. |
| B1, B2 | GTLP Backplane I/O | Bidirectional GTLP data/strobe lines; connect directly to backplane traces with VTT = 1.5 V termination. |
| Y1, Y2 | LVTTL Feedback Outputs | Provide mirrored or inverted B-port data to host controller for real-time diagnostics and status monitoring. |
| OEAB | B-Port Output Enable | Active-low control of A→B transmission; tied to PHY OCDOE for coordinated transmit gating. |
| OEBY | Y-Port Output Enable | Active-low control of B→Y feedback; typically grounded to maintain continuous monitoring capability. |
| T/C | Polarity Select | High = true mode (A→B, B→Y); low = inverted mode (¬A→B, ¬B→Y); matches TSB14AA1 strobe/data inversion requirements. |
| ERC | Edge-Rate Control | GND = slow edges (reduced EMI); VCC = fast edges (maximizes data rate); sets B-port tr/tf per application load. |
| VREF | GTLP Input Reference | 1-V reference for B-port differential receivers; set to 2/3 × VTT (1.5 V) for optimal GTLP noise margin. |
| BIAS VCC | Live-Insertion Precharge | 3.3-V supply for I/O precharge circuitry; must be applied before VCC to prevent backplane disturbance during card insertion. |
Key Features
| Feature | Design Value |
|---|---|
| TI-OPC™ Overshoot Control | Actively clamps low-to-high transitions on unterminated or unevenly loaded backplanes, preserving noise margin at >50 MHz. |
| OEC™ Signal Integrity Enhancement | Reduces bus settling time and EMI through optimized driver/output stage design validated across multiple backplane models. |
| Split LVTTL Port Architecture | Dedicated A-input and Y-output pins enable non-intrusive, real-time feedback of backplane data without disrupting host controller timing. |
| Selectable Polarity (T/C) | Hardware-selectable true or complementary data path allows alignment with PHY-level strobe/data inversion schemes (e.g., TSB14AA1). |
| Adjustable Edge-Rate Control (ERC) | Voltage-controlled B-port slew rate enables system-level optimization of data rate vs. signal integrity for specific backplane RLC characteristics. |
Applications
| IEEE 1394 Backplane Diagnostics | Hot-Pluggable VME/FB+ Slot Interface |
|---|---|
|
Use Scenario: Real-time monitoring of backplane data and strobe signals during field maintenance or firmware update on a multi-slot VME chassis. IC Role / Device Role / Timing Role: 74GTLP1394DGVRE4 provides isolated, polarity-configurable feedback path (A→B→Y) from GTLP backplane to host controller for protocol-level visibility. Use Value: Enables non-intrusive diagnostics without halting main bus traffic; supports live debug of 25/50-Mbps 1394 BPSB links using existing LVTTL test infrastructure. |
Use Scenario: Adding IEEE 1394 connectivity to legacy VME64 or FutureBus+ backplanes with live insertion capability for modular I/O cards. IC Role / Device Role / Timing Role: 74GTLP1394DGVRE4 serves as the physical-layer bridge between TSB14AA1 PHY and GTLP backplane, managing level translation, edge control, and I/O precharge. Use Value: Eliminates need for external biasing or termination networks; BIAS VCC and Ioff ensure zero disturbance to active backplane during card insertion/removal. |
| 1394-Based System Management Bus | Multi-Slot ATM Clock Distribution |
|
Use Scenario: Implementing an auxiliary 2-bit management bus across 20-slot CPCI chassis for IPMI-compliant peripheral monitoring (fans, PSUs, disk drives). IC Role / Device Role / Timing Role: 74GTLP1394DGVRE4 operates in inverted transparent mode (T/C = low) to relay status signals bidirectionally between slot controllers and shelf manager over GTLP backplane. Use Value: Leverages existing 1394 backplane wiring for low-cost, deterministic system management-no additional cabling or protocol stack required. |
Use Scenario: Distributing synchronized read/write clock pairs across a distributed ATM switch fabric with variable trace lengths and loading. IC Role / Device Role / Timing Role: 74GTLP1394DGVRE4 transmits clock signals (A1/A2 → B1/B2) with ERC-adjusted edges to minimize skew and jitter across mismatched backplane segments. Use Value: Achieves sub-nanosecond inter-slot clock alignment by tuning B-port rise/fall times to match local trace impedance and capacitive loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LVTTL-to-GTLP bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74GTLP1394DR | Same core functionality; SOIC-16 package (D) instead of TVSOP-24 (DGV); higher θJA (73°C/W vs. 120°C/W); no BIAS VCC pin-requires external precharge circuitry. | Suitable for lower-density boards where thermal headroom is available and live-insertion is not required. | Select SN74GTLP1394DR only when space constraints favor SOIC and thermal design accommodates higher junction temperature rise. |
| SN74GTLP1394PWR | Identical electrical specs; TSSOP-24 (PW) package with 0.65-mm pitch; θJA = 108°C/W; same pinout as DGV but different mechanical footprint and solder profile. | Preferred for automated assembly with standard TSSOP reflow profiles; compatible with existing 74GTLP1394 layout if padstack adjusted. | Choose SN74GTLP1394PWR when manufacturing process favors TSSOP over TVSOP, and board-level thermal simulation confirms adequate cooling. |
Compared with SN74GTLP1394DR and SN74GTLP1394PWR, the 74GTLP1394DGVRE4 offers superior thermal performance for compact backplane slots, native BIAS VCC support for true live insertion, and TVSOP packaging optimized for high I/O density-making it the preferred choice for modern modular industrial and telecom chassis designs.
Availability
74GTLP1394DGVRE4 is available at Aetrix Electronics and suitable for IEEE 1394 backplane diagnostics, hot-pluggable VME/FB+ slot interfaces, and multi-slot ATM clock distribution requiring stable component supply, long-term lifecycle continuity, and traceable sourcing.
Supply support for 74GTLP1394DGVRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface and backplane technologies.
The 74GTLP1394DGVRE4 belongs to TI's GTLP family of backplane transceivers, designed specifically to enable robust, high-speed IEEE 1394 physical-layer connectivity across VME, CPCI, FB+, and proprietary parallel backplanes.
FAQ
What is the primary function of the 74GTLP1394DGVRE4 in a backplane system?
The 74GTLP1394DGVRE4 serves as a bidirectional LVTTL-to-GTLP bus transceiver that bridges 3.3-V logic-level devices (e.g., TSB14AA1 PHY) with GTLP-signaled backplanes. It enables data/strobe translation, provides a dedicated feedback path (A→B→Y), supports live insertion, and allows edge-rate tuning via the ERC pin-making it essential for IEEE 1394 backplane physical-layer implementations in VME/FB+/CPCI systems.
How does the ERC pin affect signal integrity in the 74GTLP1394DGVRE4?
The ERC pin on the 74GTLP1394DGVRE4 selects between slow (ERC = GND) and fast (ERC = VCC) B-port edge rates: slow mode yields tr/tf ≈ 2.0/2.5 ns, fast mode yields tr/tf ≈ 1.2/1.8 ns. This adjustment allows designers to balance data-transfer speed against ringing and EMI on distributed backplane loads-critical for maintaining signal integrity across varying trace impedances and terminations.
Can the 74GTLP1394DGVRE4 operate with both GTL and GTLP signaling standards?
Yes-the 74GTLP1394DGVRE4 supports both GTL (VTT = 1.2 V, VREF = 0.8 V) and GTLP (VTT = 1.5 V, VREF = 1.0 V) signaling levels. Its AC specifications are guaranteed for GTLP, but functional operation at GTL levels is permitted per datasheet guidance, enabling interoperability with legacy GTL-based backplane systems while retaining full feature set including ERC and polarity control.
What is the role of the BIAS VCC pin in the 74GTLP1394DGVRE4?
The BIAS VCC pin on the 74GTLP1394DGVRE4 powers internal precharge circuitry that conditions B-port I/O lines before main VCC ramps during live insertion. Applied at 3.3 V prior to VCC, it prevents transient disturbances on active backplane signals-ensuring glitch-free hot-plug capability without requiring external bias networks or sequencing controllers.
Is the 74GTLP1394DGVRE4 pin-compatible with other members of the SN74GTLP1394 family?
Yes-the 74GTLP1394DGVRE4 shares identical pin functions and logic behavior with SN74GTLP1394DR (SOIC), SN74GTLP1394PWR (TSSOP), and SN74GTLP1394RGYR (QFN). All variants use the same 24-pin functional mapping (including VREF, BIAS VCC, ERC, T/C), though mechanical footprints differ; PCB layout must match the DGV TVSOP package dimensions and thermal pad requirements.
74GTLP1394DGVRE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74GTLP
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Translator Type:
- Mixed Signal
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 2
- Voltage - VCCA:
- -
- Voltage - VCCB:
- -
- Input Signal:
- LVTTL
- Output Signal:
- GTLP
- Output Type:
- Tri-State, Inverted
- Data Rate:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TFSOP (0.173", 4.40mm Width)
74GTLP1394DGVRE4 FAQ
1.How can I place an order for 74GTLP1394DGVRE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74GTLP1394DGVRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74GTLP1394DGVRE4 reliable?
The price and inventory of 74GTLP1394DGVRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74GTLP1394DGVRE4 is usually 5 days.
3.What payment methods are accepted for 74GTLP1394DGVRE4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74GTLP1394DGVRE4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74GTLP1394DGVRE4?
74GTLP1394DGVRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74GTLP1394DGVRE4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74GTLP1394DGVRE4?
For technical support, including 74GTLP1394DGVRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74GTLP1394DGVRE4 requirements.
6.How does Aetrix verify that 74GTLP1394DGVRE4 is sourced from the original manufacturer or authorized distributors?
All 74GTLP1394DGVRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74GTLP1394DGVRE4 meets industry standards.
7.What is the process for return or replacement of 74GTLP1394DGVRE4?
All 74GTLP1394DGVRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74GTLP1394DGVRE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74GTLP1394DGVRE4 part is unused and in its original packaging.
Return procedure for 74GTLP1394DGVRE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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