Diodes Incorporated 74HC04T14-13

Overview

74HC04T14-13 from Diodes Incorporated is a hex inverter IC with six independent CMOS push-pull gates, operating from 2.0V to 6.0V supply, delivering 4mA output drive at 4.5V, featuring Schmitt-trigger inputs and ESD protection exceeding 2kV HBM. It is used in logic-level signal inversion for PC peripherals, optical drives, and set-top box control circuitry.

For engineers reviewing the 74HC04T14-13 datasheet, 74HC04T14-13 pinout, 74HC04T14-13 application, or 74HC04T14-13 equivalent, key selection criteria include supply voltage range (2.0–6.0V), output drive capability (±4mA at V_CC = 4.5V), input hysteresis, propagation delay (7–27 ns), and TSSOP-14 package compatibility with high-density PCB layouts.

Technical Context

The 74HC04T14-13 implements standard Boolean inversion (Y = A̅) across six isolated channels, with all inputs incorporating Schmitt-trigger action to reject noise on slow-rising or noisy signals. Its CMOS architecture ensures static power consumption below 40 µA at 6.0V and supports rail-to-rail output swing.

Designed for mixed-voltage digital systems, it operates reliably across –40°C to +125°C ambient, with propagation delay tightly specified from 7 ns (6.0V, 25°C) to 27 ns (2.0V, 125°C), and transition times as low as 6 ns under nominal conditions.

Key Specifications

Pinout & Package

TSSOP-14 surface-mount package: 4.9 mm × 4.5 mm body, 0.65 mm pitch, 1.2 mm max height, lead-free and RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex inverter applications.

Compared with SN74HC04DR and MC74HC04ADTR2G, the 74HC04T14-13 offers optimal space efficiency and thermal performance in high-density consumer electronics, while retaining full functional and timing equivalence across the 2.0–6.0V range.

Availability

74HC04T14-13 is available at Aetrix Electronics and suitable for PC peripheral control, optical drive logic, and set-top box interface applications requiring stable component supply and long-term manufacturing continuity.

Supply support for 74HC04T14-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power solutions for computing, industrial, and consumer markets.

The 74HC logic family targets cost-sensitive, high-volume digital interface applications where robustness, wide supply tolerance, and noise immunity are essential - especially in legacy-compatible and mixed-voltage system designs.

FAQ

What is the maximum operating temperature for the 74HC04T14-13?

The 74HC04T14-13 is rated for continuous operation from –40°C to +125°C ambient temperature. Its junction temperature can reach +150°C under worst-case power dissipation, and thermal design must ensure θ_JA remains within limits for the TSSOP-14 package in actual board layout.

Can unused inputs be left floating?

No - unused inputs must be tied to V_CC or GND. Floating CMOS inputs cause increased supply current, potential oscillation, and susceptibility to ESD damage due to undefined threshold states. The datasheet explicitly requires termination per Note 6 in Recommended Operating Conditions.

Does the 74HC04T14-13 support 3.3V-only systems?

Yes - it operates fully across 2.0V to 6.0V, including 3.3V nominal supply. At 3.3V, it delivers ≥3.1V VOH and ≤0.3V VOL under 4mA load, meeting 74HC-compatible input thresholds for interfacing with other 3.3V logic families.

Is the TSSOP-14 package compatible with standard reflow profiles?

Yes - the 74HC04T14-13's lead-free, RoHS-compliant TSSOP-14 package is qualified for standard Pb-free reflow profiles (J-STD-020D), with peak temperature up to 260°C. Its thermal mass and pad layout align with IPC-7351B recommendations for reliable solder joint formation.