Nexperia USA Inc. 74HC05BQ,115

Overview

74HC05BQ,115 from Nexperia is a hex inverter IC with six independent open-drain outputs, designed for wired-OR/AND logic implementation in level-shifting and bus interface circuits. It operates from 2.0 V to 6.0 V, supports -40 °C to +125 °C ambient range, delivers 5.2 mA sink current at VCC = 6.0 V, and exhibits 10 ns typical tPLZ propagation delay at 6.0 V supply - used in I²C bus buffering and microcontroller GPIO expansion.

For engineers reviewing the 74HC05BQ,115 datasheet, 74HC05BQ,115 pinout, 74HC05BQ,115 application, or 74HC05BQ,115 equivalent, key selection criteria include open-drain output compatibility with mixed-voltage systems, thermal-enhanced DHVQFN14 package suitability for space-constrained PCBs, guaranteed VIH/VIL thresholds across full temperature range, and absence of internal pull-ups requiring external resistor design.

Technical Context

The 74HC05BQ implements six identical CMOS inverter stages, each with an open-drain N-channel MOSFET output stage that pulls low or enters high-impedance state - no active HIGH drive capability. Input structure complies with standard CMOS voltage thresholds and provides ±0.1 μA max input leakage at 6.0 V.

Its functional behavior follows strict truth table: input LOW yields high-Z output; input HIGH yields LOW output. Propagation delays (tPLZ/tPZL) and transition times (tTHL) are characterized across 2.0–6.0 V supply and -40 °C to +125 °C, with derated power dissipation (9.6 mW/K above 98 °C) specific to the DHVQFN14 package.

Key Specifications

Pinout & Package

DHVQFN14 (SOT762-1) package: 2.5 mm × 3.0 mm × 0.85 mm body, 14-terminal quad flat no-lead format with exposed thermal pad (non-soldered by default), optimized for thermal performance and PCB area efficiency in high-density layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex inverter with open-drain output applications.

Compared with 74HC05BQ,115, the 74LVC05PW offers faster switching in 3.3 V systems but sacrifices 6 V tolerance and extended temperature qualification, while the SN74LVC1G05DBVR trades channel count and thermal capability for ultra-compact size - making the 74HC05BQ optimal for robust, multi-channel, wide-voltage industrial interfaces.

Availability

74HC05BQ,115 is available at Aetrix Electronics and suitable for industrial automation controllers, automotive body electronics modules, and IoT edge sensor hubs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74HC05BQ,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable logic, analog, and MOSFET solutions with focus on efficiency, miniaturization, and robustness for industrial and automotive markets.

The 74HC05BQ belongs to Nexperia's 74HC logic family - engineered for interoperability with legacy TTL/CMOS systems while meeting stringent industrial reliability standards including extended temperature operation and high ESD immunity.

FAQ

What pull-up resistor value should be used with 74HC05BQ,115 open-drain outputs?

For 5 V operation driving a 5.2 mA load with VOL ≤ 0.4 V, a 1 kΩ pull-up yields ~4.6 V HIGH level and meets timing specs. For I²C at 400 kHz, 2.2 kΩ is typical to limit bus capacitance loading while maintaining rise time <300 ns. Always verify against actual load capacitance and required edge rate.

Can 74HC05BQ,115 be used without external pull-up resistors?

No - open-drain outputs cannot source current; without pull-up resistors, outputs remain floating in HIGH state and fail logic functionality. Pull-ups are mandatory for defined HIGH-level voltage and wired-OR/AND operation. The thermal pad (terminal 1 index area) must remain unconnected or tied to GND if soldered.

How does the DHVQFN14 package affect thermal management compared to SO14?

The DHVQFN14 (SOT762-1) package features an exposed thermal pad and thinner profile (0.85 mm), enabling 30 % lower junction-to-board thermal resistance versus SO14. Its 9.6 mW/K derating above 98 °C allows sustained 500 mW total power dissipation at lower ambient temperatures - critical for dense industrial PCBs with limited airflow.

Is 74HC05BQ,115 suitable for automotive applications?

While qualified from -40 °C to +125 °C, 74HC05BQ,115 is not AEC-Q200 qualified and lacks automotive-specific stress testing (e.g., HTOL, TCT). It may be used in non-safety-critical automotive subsystems (e.g., infotainment power sequencing) but is not approved for engine control, ADAS, or safety-related functions per Nexperia's non-automotive designation.