Diodes Incorporated 74HC08T14-13

Overview

74HC08T14-13 from Diodes Incorporated is a quadruple 2-input AND gate IC in TSSOP-14 package, operating from 2.0V to 6.0V supply, delivering 4mA output drive at 4.5V, with Schmitt-trigger inputs and CMOS low-power logic for digital signal conditioning in embedded control interfaces.

For engineers reviewing the 74HC08T14-13 datasheet, 74HC08T14-13 pinout, 74HC08T14-13 application, or 74HC08T14-13 equivalent, key selection criteria include input threshold compatibility (VIH/VIL), propagation delay (7–27 ns), output drive capability (±4mA), ESD robustness (2kV HBM), and TSSOP-14 thermal and layout constraints.

Technical Context

This device implements four independent Boolean AND functions (Y = A • B) using standard CMOS push-pull outputs. Each gate features Schmitt-trigger action on all inputs, enabling noise-immune signal conditioning for slow or noisy digital sources.

It operates across industrial temperature range (−40°C to +125°C) with guaranteed switching performance up to 6.0V supply, and supports mixed-voltage interfacing via input voltage tolerance (−0.5V to VCC + 0.5V) and rail-to-rail output swing.

Key Specifications

Pinout & Package

TSSOP-14 (Thin Shrink Small Outline Package, 4.4 mm × 5.0 mm body, 0.65 mm pitch) with exposed pad not electrically connected; optimized for high-density PCB layouts and automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input AND gate applications.

Compared with SN74HC08PW and MC74HC08ADTR2G, the 74HC08T14-13 uniquely combines Schmitt-trigger inputs with full −40°C to +125°C operation and 2kV HBM ESD, making it optimal for industrial edge nodes and thermally demanding embedded control.

Availability

74HC08T14-13 is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, USB hub power control logic, and automotive body control modules requiring stable component supply across extended temperature and ESD-prone environments.

Supply support for 74HC08T14-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The 74HC logic family targets general-purpose digital interface and signal conditioning, emphasizing wide supply range, robust ESD, and drop-in compatibility with legacy TTL and CMOS systems.

FAQ

What is the maximum recommended operating frequency for 74HC08T14-13?

The device does not specify a maximum clock frequency, but its typical propagation delay of 7 ns at 6.0V implies a theoretical toggle limit near 35 MHz in single-gate configurations. Real-world frequency depends on load capacitance, supply stability, and PCB routing; for 50 pF loads, reliable operation is confirmed up to 10 MHz per gate in standard designs.

Can unused inputs be left floating?

No. Unused inputs must be tied to either VCC or GND to prevent undefined logic states, increased power consumption, and potential oscillation. The datasheet explicitly states this in Recommended Operating Conditions (Note 6); floating inputs may cause excessive ICC due to partial conduction in CMOS transistors.

Does 74HC08T14-13 support mixed-voltage operation between 3.3V and 5V systems?

Yes. With VIH = 3.15V and VIL = 1.35V at 4.5V, and input voltage tolerance up to VCC + 0.5V, the part accepts 3.3V logic highs as valid inputs when powered at 5V, and outputs 5V logic levels compatible with 3.3V-tolerant receivers - no external level shifter needed for basic interfacing.

Is thermal pad on TSSOP-14 package electrically connected?

No. The exposed thermal pad on the 74HC08T14-13 TSSOP-14 package is not internally connected to any die node. It may be soldered to a thermal copper pour for improved heat dissipation but must remain electrically isolated from VCC, GND, or signal nets per Diodes Incorporated's AP02001 layout guidelines.