Nexperia USA Inc. 74HC238BQ-Q100X

Overview

74HC238BQ-Q100 from Nexperia is an automotive-qualified 3-to-8 line decoder/demultiplexer with three binary address inputs (A0–A2), eight active-HIGH mutually exclusive outputs (Y0–Y7), and three enable inputs (E1, E2 active LOW; E3 active HIGH). It operates from -40 °C to +125 °C, supports CMOS-level inputs, and features side-wettable flanks in its DHVQFN16 package for AOI-compatible solder joint inspection - used in automotive memory chip select decoding and parallel expansion to 1-of-32 decoding.

For engineers reviewing the 74HC238BQ-Q100 datasheet, 74HC238BQ-Q100 pinout, 74HC238BQ-Q100 application, or 74HC238BQ-Q100 equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, propagation delay ≤45 ns at VCC = 4.5 V, output drive capability of ±4 mA, input clamping diodes enabling overvoltage-tolerant interfacing, and DHVQFN16 thermal-enhanced packaging for high-reliability automotive PCB layouts.

Technical Context

The device implements a combinational logic decoder with strict mutual exclusivity: only one output goes HIGH per valid address/enable combination, governed by the function table where Yn = (E1·E2·Ē3)·(A2A1A0 = n). Its triple-enable architecture (two active-LOW, one active-HIGH) enables hierarchical cascading without external inversion.

Input clamping diodes allow safe interfacing to signals exceeding VCC when current-limiting resistors are used; output stages deliver rail-to-rail CMOS-compatible levels with VOH ≥ 3.98 V and VOL ≤ 0.26 V at IO = ±4 mA and VCC = 4.5 V, ensuring robust noise margins in noisy automotive environments.

Key Specifications

Pinout & Package

DHVQFN16 package (SOT763-1) with side-wettable flanks for automated optical inspection of solder joints; 2.5 × 3.5 × 0.85 mm body, 16 terminals, no leads, exposed thermal pad (non-electrical, optional GND connection).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-to-8 decoder/demultiplexer applications.

Compared with 74HC238BQ-Q100, the 74HCT238BQ-Q100 offers seamless integration into legacy 5 V TTL systems without level translation, while the SN74LV138APWR provides lower-voltage operation but sacrifices automotive qualification, thermal performance, and AOI support - making it unsuitable for safety-critical vehicle subsystems.

Availability

74HC238BQ-Q100 is available at Aetrix Electronics and suitable for engine control units, ADAS camera modules, and electric power steering systems requiring stable component supply across extended temperature ranges and full automotive lifecycle support.

Supply support for 74HC238BQ-Q100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable components optimized for automotive, industrial, and consumer applications - with leadership in logic, MOSFETs, diodes, and ESD protection.

The 74HC238BQ-Q100 belongs to Nexperia's automotive-qualified HC logic family, designed specifically for robust, low-power address decoding and signal routing in harsh-temperature vehicle subsystems where functional safety and long-term supply stability are mandatory.

FAQ

Is the 74HC238BQ-Q100 pin-compatible with non-automotive versions like 74HC238PW?

Yes - the 74HC238BQ-Q100 shares identical logic functionality, pin assignment, and electrical characteristics with non-Q100 variants such as 74HC238PW, but adds AEC-Q100 Grade 1 qualification, extended temperature validation (-40 °C to +125 °C), and enhanced process controls for automotive reliability. Package dimensions and solder profile requirements differ due to DHVQFN16 vs. TSSOP16 form factors.

Can the 74HC238BQ-Q100 be used as a demultiplexer, and how is that configured?

Yes - configure E1 or E2 as the data input (driven HIGH/LOW), E3 as the active-HIGH strobe, and the remaining enable as a fixed control signal. Address inputs A0–A2 then select which of the eight outputs mirrors the data input. This achieves true 1-to-8 demultiplexing with propagation delay matching address-to-output timing (≤45 ns at VCC = 4.5 V).

What is the purpose of the exposed thermal pad on the DHVQFN16 package?

The exposed pad (terminal 1) is not electrically connected and has no internal bond. It may remain unconnected or be soldered to a GND plane to improve thermal dissipation and mechanical stability. When connected, it must be floated or tied to GND - never to VCC or signal nets - to avoid short circuits or parasitic coupling.

Does the 74HC238BQ-Q100 support hot insertion or live swapping in powered systems?

No - the device lacks hot-swap protection circuitry. Applying VCC before establishing stable GND or connecting inputs while VCC is ramping may cause latch-up or excessive current through input clamping diodes. Always follow controlled power sequencing: establish GND first, apply VCC, then assert inputs - consistent with AEC-Q100 board-level stress requirements.