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NXP Semiconductors 74HC2G126GD,125
- Part No.:
- 74HC2G126GD,125
- Manufacturer:
- NXP Semiconductors
- Package:
- 8-XFDFN
- Datasheet:
-
74HC2G126GD,125.pdf
- Description:
- IC BUFFER NON-INVERT 6V 8XSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,779
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Product details
Overview
74HC2G126GD,125 from NXP Semiconductors is a dual CMOS buffer/line driver with 3-state outputs, controlled by independent output enable inputs (1OE, 2OE). It operates from 2.0 V to 6.0 V, delivers symmetrical output impedance and balanced propagation delays (8–23 ns at VCC = 4.5–6.0 V), and supports industrial temperature range (−40 °C to +125 °C) in XSON8 package. It is used for bidirectional bus interfacing and level translation in compact digital systems.
For engineers reviewing the 74HC2G126GD,125 datasheet, 74HC2G126GD,125 pinout, 74HC2G126GD,125 application, or 74HC2G126GD,125 equivalent, key selection criteria include 3-state drive capability, input clamp diode support for overvoltage-tolerant interfacing, low static current (≤20 µA), high noise immunity, and compatibility with both HC- and HCT-family logic families.
Technical Context
This device implements two independent non-inverting buffers, each with dedicated 3-state control. Each channel features input clamp diodes enabling safe interface to voltages exceeding VCC when used with external current-limiting resistors. The logic is fully static CMOS, with TTL-compatible input thresholds only in the 74HCT variant - the 74HC2G126GD,125 uses CMOS-level inputs (VIH ≥ 3.15 V at VCC = 4.5 V).
It complies with JEDEC standard no. 7A and supports operation across −40 °C to +125 °C. Dynamic performance includes matched tPLH/tPHL (≤23 ns), fast enable/disable times (≤27 ns enable, ≤30 ns disable at VCC = 4.5 V), and low transition times (≤15 ns), ensuring timing integrity in high-speed data paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply voltage range | 2.0 V to 6.0 V - enables direct interface with 3.3 V and 5 V logic domains without level shifters |
| Propagation delay (VCC = 4.5 V) | ≤23 ns - ensures sub-44 MHz data throughput per channel in synchronous bus applications |
| Output drive strength | ±6 mA at VCC = 4.5 V - sufficient to drive 50 pF loads with <15 ns transition time |
| Input leakage current | ±1.0 µA max at VCC = 6.0 V - minimizes standby power in battery-sensitive designs |
| ESD protection | HBM >2000 V, MM >200 V - meets industrial handling requirements without additional protection circuitry |
| Operating temperature | −40 °C to +125 °C - qualified for under-hood automotive modules and industrial controllers |
| Power dissipation capacitance | 11 pF per enabled buffer - enables accurate dynamic power estimation (PD = CPD × VCC² × fi) |
Pinout & Package
XSON8 (SOT996-2) package: plastic extremely thin small outline, no leads, 8 terminals, body size 3 × 2 × 0.5 mm, thermal pad optional, pin 1 indicator in lower-left corner below marking code "H26".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 7 | 1OE, 2OE | Active-low 3-state enable inputs - independently disable each buffer output to high-impedance state |
| 2, 5 | 1A, 2A | Non-inverting data inputs - accept CMOS-level signals; include clamp diodes for overvoltage tolerance |
| 3, 6 | 1Y, 2Y | Buffered non-inverting outputs - drive capacitive loads up to 50 pF with controlled rise/fall times |
| 4 | GND | Ground reference (0 V) - must be low-impedance connection to minimize switching noise coupling |
| 8 | VCC | Positive supply rail - decoupling capacitor (100 nF) required within 3 mm of this pin for stable operation |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent 3-state buffers | Enables isolated control of two data paths - critical for multiplexed address/data buses in microcontroller peripherals |
| Input clamp diodes | Allows safe interfacing to voltages > VCC using series resistors - eliminates need for external clamping in mixed-voltage systems |
| Symmetrical output impedance | Ensures matched rise/fall times (tr/tf ≤15 ns) - reduces signal distortion and EMI in high-speed routing |
| Low ICC (≤20 µA) | Reduces quiescent power in always-on subsystems - supports energy-efficient design in IoT edge nodes |
| JEDEC 7A compliance | Guarantees interoperability with industry-standard logic families - simplifies BOM consolidation across product lines |
Applications
| Industrial PLC I/O Expansion | USB-to-Parallel Bridge Interface |
|---|---|
Use Scenario: Isolating and buffering parallel data lines between a microcontroller and modular I/O cards in programmable logic controllers. IC Role / Device Role / Timing Role: Dual 3-state buffer providing direction-controlled data path isolation and bus contention prevention during hot-swap events. Use Value: Enables reliable multi-drop bus operation with <23 ns propagation delay and ±6 mA drive - maintains timing margins under 10 MHz parallel clocking. |
Use Scenario: Level-shifting and driving legacy parallel printer signals (STROBE, ACK, BUSY) from a USB bridge IC operating at 3.3 V. IC Role / Device Role / Timing Role: Voltage-tolerant buffer translating between 3.3 V logic and 5 V parallel peripheral signaling while supporting tri-state control for bus sharing. Use Value: Input clamp diodes allow direct connection to 5 V signals with only series resistors - eliminates discrete level translators and saves PCB area. |
| Automotive Body Control Module | Compact FPGA Configuration Bus |
Use Scenario: Driving LED driver enable lines and sensor interface select lines in under-dash body control units exposed to extended temperature ranges. IC Role / Device Role / Timing Role: Robust dual buffer delivering noise-immune control signals with guaranteed operation from −40 °C to +125 °C. Use Value: High noise immunity and HBM >2000 V ESD rating ensure reliability in electrically noisy vehicle cabins - reduces field failure rates. |
Use Scenario: Buffering configuration data and status signals between an FPGA and external SPI flash or EEPROM during power-up sequencing. IC Role / Device Role / Timing Role: Low-capacitance (CI = 1.0 pF), low-propagation-delay buffer isolating FPGA I/O pins from configuration memory loading effects. Use Value: 1.0 pF input capacitance minimizes loading on FPGA configuration pins - preserves setup/hold timing for reliable bitstream loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74LVC2G126GM,125 | Lower VCC range (1.65–5.5 V); higher drive (±24 mA); smaller XSON8 footprint (2.0 × 1.25 × 0.5 mm) | Better suited for 1.8 V/3.3 V mixed-signal SoC interfaces requiring stronger drive | Select when interfacing to low-voltage FPGAs or when >±6 mA output current is required |
| SN74LVC2G126DCKR | Same VCC range; SC70-6 package (6-pin); only one buffer per package; no 3-state enable per channel | Requires two devices for dual-channel operation; lacks independent OE control per buffer | Select only if board space allows dual SC70 placement and single-enable operation suffices |
Compared with 74HC2G126GD,125, the 74LVC2G126GM,125 offers higher drive and lower voltage support but reduced noise margin at 5 V, while SN74LVC2G126DCKR sacrifices channel independence and package density - making 74HC2G126GD,125 optimal for space-constrained dual-channel 3-state control.
Availability
74HC2G126GD,125 is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and compact FPGA configuration systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 74HC2G126GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The 74HC2G126GD,125 belongs to NXP's 74HC logic family - designed for low-power, high-noise-immunity digital interfacing in space- and power-constrained embedded systems.
FAQ
What is the maximum operating voltage for the 74HC2G126GD,125?
The 74HC2G126GD,125 supports a maximum supply voltage of 6.0 V, with absolute maximum ratings extending to +7.0 V. Operation above 6.0 V violates recommended conditions and risks permanent damage. Its wide 2.0–6.0 V range allows direct use with 3.3 V and 5 V systems without regulators or level shifters - a key advantage of the 74HC2G126GD,125 in mixed-voltage designs.
Does the 74HC2G126GD,125 support TTL-level inputs?
No, the 74HC2G126GD,125 uses CMOS-level input thresholds (e.g., VIH ≥ 3.15 V at VCC = 4.5 V), not TTL-compatible thresholds. For TTL input compatibility, the pin-compatible 74HCT2G126GD variant must be used. This distinction is critical: substituting 74HC2G126GD,125 in a TTL-driven system may cause logic misreads due to insufficient high-level input voltage margin.
How does the input clamp diode function in the 74HC2G126GD,125?
The 74HC2G126GD,125 integrates input clamp diodes from each A-input to VCC and GND. When interfacing to signals exceeding VCC (e.g., 5 V signals in a 3.3 V system), a series current-limiting resistor restricts diode conduction to ≤20 mA, preventing damage. This feature eliminates external clamping components - a verified design benefit of the 74HC2G126GD,125 confirmed in NXP's functional description and limiting values table.
What is the thermal derating behavior of the 74HC2G126GD,125 in XSON8 package?
For the XSON8 (SOT996-2) package, total power dissipation (Ptot) derates linearly above 118 °C at 7.8 mW/K. At 125 °C ambient, Ptot is reduced by 54.6 mW from its 300 mW maximum - resulting in a usable limit of ~245 mW. This derating curve is specified in Table 5 of the NXP datasheet and directly applies to the 74HC2G126GD,125 due to its documented package mapping.
Can the 74HC2G126GD,125 replace the 74HC2G125 in a design?
No - the 74HC2G125 is a dual inverter with 3-state outputs, while the 74HC2G126GD,125 is a dual non-inverting buffer. Their logic functions are fundamentally different: 74HC2G126GD,125 passes input signals unchanged (Y = A), whereas 74HC2G125 inverts them (Y = NOT A). Substitution would invert critical control signals and cause system failure unless logic is redesigned.
74HC2G126GD,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74HC
- Package/Case:
- 8-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 7.8mA, 7.8mA
- Voltage - Supply:
- 2V ~ 6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XSON, SOT996-2 (2x3)
74HC2G126GD,125 FAQ
1.How can I place an order for 74HC2G126GD,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74HC2G126GD,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74HC2G126GD,125 reliable?
The price and inventory of 74HC2G126GD,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74HC2G126GD,125 is usually 5 days.
3.What payment methods are accepted for 74HC2G126GD,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74HC2G126GD,125 transactions.
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4.How is shipping managed for 74HC2G126GD,125?
74HC2G126GD,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74HC2G126GD,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74HC2G126GD,125?
For technical support, including 74HC2G126GD,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74HC2G126GD,125 requirements.
6.How does Aetrix verify that 74HC2G126GD,125 is sourced from the original manufacturer or authorized distributors?
All 74HC2G126GD,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74HC2G126GD,125 meets industry standards.
7.What is the process for return or replacement of 74HC2G126GD,125?
All 74HC2G126GD,125 units undergo pre-shipment inspection (PSI). If there is an issue with 74HC2G126GD,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74HC2G126GD,125 part is unused and in its original packaging.
Return procedure for 74HC2G126GD,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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